Light controlled silicon on insulator device

• US 6,545,333 B1
• Filed: 04/25/2001
• Issued: 04/08/2003
• Est. Priority Date: 04/25/2001
• Status: Active Grant

• Current Assignee: Globalfoundries US Incorporated (GlobalFoundries, Inc.)
• Original Assignee: International Business Machines Corporation
• Inventors: Rankin, Jed H., Nowak, Edward J., Ketchen, Mark B., Stevens, Keith C.
• Primary Examiner(s): Lee, Eddie
• Assistant Examiner(s): Ortiz, Edgardo
• Application Number:
  US09/681,541
• Time in Patent Office: 713 Days
• Field of Search: 257/79, 257/80, 257/83, 257/84, 257/460, 257/461, 257/463, 257/347, 438/31, 438/22, 438/24, 438/48, 438/65
• US Class Current: 257/461
• CPC Class Codes: H01L 27/1203 the substrate comprising an insulating body on a semiconductor body, e.g. SOI three-dimensional layout H01L27/0688
• CPC Class Codes: H01L 27/1443 with at least one potential jump or surface barrier
• CPC Class Codes: H01L 27/14643 Photodiode arrays; MOS imagers
• CPC Class Codes: H01L 31/024 Arrangements for cooling, heating, ventilating or temperature compensation for photovoltaic devices H01L31/052

Abstract

A device with an optically controlled VT is disclosed. The device includes a semiconductor die which includes an FET, the FET having a gate on an upper surface of a substrate, a body under the gate and a source contacting the body forming a body-to-source junction. A light source is provided for exposing the body to light from the lower surface of the substrate.

Claims

1. An electronic device adapted for control by exposure to light of a pre-determined wavelength, comprising:

a substrate having upper and lower surfaces;

an insulating layer having upper and lower surfaces on said upper surface of said substrate;

a plurality of FETs formed on said top surface of said insulating layer, each FET having a gate, a body under said gate and a source contacting said body forming a body-to-source junction;

trenches in said substrate, said trenches aligned to said body of at least a portion of said FETs, extending from said lower surface of said substrate to said lower surface of said insulating layer and filled with a light transmitting material; and

;

an optical guide layer on said lower surface of said substrate and on said filled trenches.

2. The electronic device according to claim 1, wherein said optical guide layer is quartz.

3. The electronic device according to claim 2, wherein said optical guide layer is at least thicker than half of the equivalent wavelength in quartz of said predetermined wavelength.

4. The electronic device according to claim 1, wherein said optical guide layer has a thickness in the range of 20 nm to 500 nm.

5. The electronic device according to claim 1, wherein said predetermined wavelength is a function of a thickness of said body.

6. The electronic device according to claim 5, wherein the thickness of said body is in the range of 10 to 200 nm.

7. The electronic device according to claim 1, further including a reflective layer on said optical guide layer.

8. The electronic device according to claim 7, wherein said reflective layer is selected from the group consisting of aluminum, titanium, tungsten, platinum, tantalum, nickel, silver and alloys thereof.

9. The electronic device according to claim 7, further including a heatsink attached to said reflective layer.

10. An electronic device adapted for control by exposure to light of a pre-determined wavelength, comprising:

a thermally conductive substrate having upper and lower surfaces;

an insulating layer having upper and lower surfaces on said upper surface of said substrate;

a plurality of FETs formed on said top surface of said insulating layer, each FET having a gate, a body under said gate and a source contacting said body forming a body-to-source junction; and

trenches in said substrate, said trenches aligned to said body of at least a portion of said FETs, extending from said lower surface of said substrate to said lower surface of said insulating layer and filled with a light transmitting material to form optical guides.

11. The electronic device according to claim 10, wherein said substrate is diamond.

12. The electronic device according to claim 10, wherein said substrate is at least thicker than half of the equivalent wavelength in said light transmitting material of said predetermined wavelength.

13. The electronic device according to claim 10, wherein said light transmitting material is quartz.

14. The electronic device according to claim 10, wherein said substrate has a thickness in the range of 200 nm to 5000 nm.

15. The electronic device according to claim 10, wherein said predetermined wavelength is a function of a thickness of said body.

16. The electronic device according to claim 15, wherein the thickness of said body is in the range of 10 to 200 nm.

17. The electronic device according to claim 10, further including a reflective layer on said substrate and optical guides.

18. The electronic device according to claim 17, wherein said reflective layer is selected from the group consisting of aluminum, titanium, tungsten, platinum, tantalum, nickel, silver and alloys thereof.

19. The electronic device according to claim 17, further including a heatsink attached to said reflective layer.

20. An electronic device adapted for control by exposure to light of a predetermined wavelength, comprising:

a semiconductor die comprising;

a heat conductive substrate having upper and lower surfaces;

an insulating layer having upper and lower surfaces on said upper surface of said substrate;

a plurality of FETs formed on said top surface of said insulating layer, each FET having a gate, a body under said gate and a source contacting said body forming a body-to-source junction; and

optical paths formed in said substrate, said optical paths disposed to provide light to said body of at least a portion of said FETs, and extending from said lower surface of said substrate to said lower surface of said insulating layer.

21. The electronic device according to claim 20, wherein said optical paths emerge on one or more sides of said semiconductor die.

22. The electronic device according to claim 21, further comprising one or more lasers optically coupled to each said side of said semiconductor die where said optical paths emerge, said lasers for exposing said bodies to light emitted by said laser.