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Hybrid frame with lead-lock tape

  • US 6,545,343 B2
  • Filed: 05/02/2001
  • Issued: 04/08/2003
  • Est. Priority Date: 07/29/1996
  • Status: Expired due to Fees
First Claim
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1. A lead frame for use with a semiconductor device, said lead frame comprising:

  • a plurality of inwardly extending leads, each lead of said plurality of inwardly extending leads having an end, said plurality of inwardly extending leads surrounding a position for said semiconductor device;

    at least one bussing lead substantially longitudinally extending between said ends of said plurality of inwardly extending leads and across at least a portion of said position for said semiconductor device, said at least one bussing lead having a first end and second end; and

    at least one tape segment attached between a portion of said at least one bussing lead and a portion of said lead frame.

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