High-speed probing apparatus

• US 6,545,493 B1
• Filed: 09/11/2000
• Issued: 04/08/2003
• Est. Priority Date: 09/29/1999
• Status: Expired due to Term

• Current Assignee: Tokyo Electron Limited
• Original Assignee: Tokyo Electron Limited
• Inventors: Iino, Shinji
• Primary Examiner(s): Cuneo, Kamand
• Assistant Examiner(s): Nguyen, Jimmy
• Application Number:
  US09/659,732
• Time in Patent Office: 939 Days
• Field of Search: 324/754, 324/755, 324/758, 324/158.1, 324/763, 324/762, 324/761, 324/765, 439/482, 439/66
• US Class Current: 324/750.03
• CPC Class Codes: G01R 31/2886 Features relating to contacting the IC under test, e.g. probe heads; chucks G01R31/2865 takes precedence, test connections, e.g. test sockets, or probes per se, G01R1/04 or G01R1/06

Abstract

A probing apparatus is adapted for high-speed measurement and used for inspecting the electric characteristics of an object under inspection. The probing apparatus is provided with a probing apparatus main body, a contactor arranged inside the probing apparatus main body, pin electronics including a plurality of electronic circuits and arranged in a transmission line that is provided for transmission of inspection signals between the contactor and a tester located outside the probing apparatus, the electronic circuits being made of at least one integrated circuit, an interposer for electrically connecting the pin electronics and the contactor together, and a cooling unit for cooling the pin electronics.

Claims

1. A high-speed measurement probing apparatus for inspecting electric characteristics of an object under inspection, comprising:

a probing apparatus main body;

a contactor arranged inside the probe apparatus main body, said contactor being replaceable;

a pin electronics including a plurality of electronic circuits and arranged in a transmission line that is provided for transmission of inspection signals between the contactor and a tester located outside the probing apparatus, said electronic circuits being made of at least one integrated circuit;

an interposer for electrically connecting the pin electronics and the contactor together, said interposer being replaceable; and

cooling means for cooling the pin electronics.

2. A high-speed measurement probing apparatus according to claim 1, wherein the electronic circuits of the pin electronics include a control section, a comparator section and a driver section, and said control section, said comparator section and said driver section are made of at least one integrated circuit.

3. A high-speed measurement probing apparatus according to claim 1, wherein said pin electronics comprise an upper package and a lower package, and said cooling means is arranged between peripheral portions of the upper and lower packages.

4. A high-speed measurement probing apparatus according to claim 1, wherein said interposer includes contact pins that are projected from both sides thereof.

5. A high-speed measurement probing apparatus according to claim 2, wherein the driver section of the pin electronics is made of at least one integrated circuit and is located closer to the cooling means than other circuit sections.

6. A high-speed measurement probing apparatus according to claim 2, wherein the comparator section of the pin electronics is made of at least one integrated circuit and is located closer to the interposer than other circuit sections.

7. A high-speed measurement probe apparatus for inspecting electric characteristics of an object under inspection, comprising:

a probing apparatus main body;

a contactor arranged inside the probing apparatus main body, said contactor being replaceable;

a pin electronics including a plurality of electronic circuits and arranged in a transmission line that is provided for transmission of inspection signals between the contactor and a tester located outside the probing apparatus, said electronic circuits being made of at least one integrated circuit;

a pattern generator including an electronic circuit and used for generating inspection signals;

an interface board for electrically connecting the pattern generator and the pin electronics together;

an interposer for electrically connecting the pin electronics and the contactor together, said interposer being replaceable; and

cooling means for cooling the pin electronics.

8. A high-speed measurement probing apparatus according to claim 7, wherein the electronic circuit of the pattern generator is made of at least one integrated circuit.

9. A high-speed measurement probing apparatus according to claim 7, wherein the electronic circuits of the pin electronics include a control section, a comparator section and a driver section, and said control section, said comparator section, and said driver section are made of at least one integrated circuit.

10. A high-speed measurement probing apparatus according to claim 7, wherein the driver section of the pin electronics is made of at least one integrated circuit and is located closer to the cooling means than other circuit sections.

11. A high-speed measurement probing apparatus according to claim 9, wherein the comparator section of the pin electronics is made of at least one integrated circuit and is located closer to the interposer than other circuit sections.