Modular memory device

• US 6,545,891 B1
• Filed: 08/14/2000
• Issued: 04/08/2003
• Est. Priority Date: 08/14/2000
• Status: Expired due to Term

• Current Assignee: Innovative Memory Systems, Inc. (Wi-LAN Inc.)
• Original Assignee: Matrix Semiconductor, Inc. (Western Digital Corporation)
• Inventors: Lee, Thomas H., Johnson, Mark G., Bosch, Derek J., Tringali, J. James, Farmwald, P. Michael
• Primary Examiner(s): Lam, David
• Application Number:
  US09/638,334
• Time in Patent Office: 967 Days
• Field of Search: 365/51, 365/52, 365/63, 365/130, 365/185.04, 365/104, 365/94, 361/735, 361/803
• US Class Current: 365/51
• CPC Class Codes: G11C 5/025 Geometric lay-out considerations of storage- and peripheral-blocks in a semiconductor storage device geometrical lay-out of the components in integrated circuits, H01L27/0207
• CPC Class Codes: G11C 5/063 Voltage and signal distribution in integrated semi-conductor memory access lines, e.g. word-line, bit-line, cross-over resistance, propagation delay

Abstract

A modular memory device includes a support element, a memory unit comprising a three-dimensional memory array carried by the support element, a device interface unit carried by the support element and coupled with the memory unit, and an electrical connector carried by the support element and coupled with the device interface unit. The memory array is well suited for use as a digital medium storage device for digital media such as digital text, digital music, digital image or images, and digital video. The device interface unit is not required in all cases.

Claims

1. A modular memory device comprising:

a support element;

a memory unit comprising a three-dimensional memory array, said memory unit carried by the support element; and

an electrical connector carried by the support element and coupled with the memory unit;

wherein the three-dimensional memory array comprises a plurality of layers of memory cells stacked vertically above one another in a single chip.

2. A modular, digital medium memory device comprising:

a support element;

a memory unit comprising a memory array, said memory unit carried by the support element, said memory array comprising a plurality of write-once, field-programmable memory cells;

a modular housing protecting the memory unit; and

an electrical connector carried by the support element and coupled with the memory unit, said electrical connector exposed at an exterior surface of the memory device;

said memory cells storing at least one digital media file selected from the group consisting of digital text, digital music, a digital image, a sequence of digital images, digital video, and combinations thereof.

3. The invention of claim 2 further comprising:

a device interface unit carried by the support element and coupled with the memory unit and the electrical connector.

4. The invention of claim 3 wherein the memory unit and the device interface unit are fabricated on a single substrate, and wherein the substrate is carried by the support element.

5. The invention of claim 3 wherein the device interface unit fits within a substrate area of no more than 8 mm².

6. The invention of claim 2, 3, 4, or 5 wherein the memory cells are arrayed on a substrate with an area density no less than 3×

10⁷ memory cells per square millimeter of substrate.

7. The invention of claim 2, 3, 4, or 5 wherein the memory array stores at least one digital media file selected from the group consisting of digital text, digital music, a digital image, a sequence of digital images, and digital video, and combinations thereof.

8. A modular memory device comprising:

a support element;

a memory unit comprising a three-dimensional memory array, said memory unit carried by the support element; and

an electrical connector carried by the support element and coupled with the memory unit;

wherein the memory array comprises a plurality of write-once memory cells.

9. The invention of claim 8 wherein the memory array stores at least one digital media file selected from the group consisting of digital text, digital music, a digital image, a sequence of digital images, digital video, and combinations thereof.

10. A modular memory device comprising:

a support element;

a memory unit comprising a three-dimensional memory array, said memory unit carried by the support element; and

an electrical connector carried by the support element and coupled with the memory unit;

wherein the memory array comprises a plurality of memory cells arrayed on a substrate with an area density no less than 3×

10⁷ memory cells per square millimeter of substrate.

11. The invention of claim 10 wherein the memory array stores at least one digital media file selected from the group consisting of digital text, digital music, a digital image, a sequence of digital images, and digital video, and combinations thereof.

12. A digital media memory device comprising:

a memory unit comprising a three-dimensional memory array comprising a plurality of stacked layers of memory cells;

said memory cells characterized by respective digital states, said digital states storing a digital signal representing at least one digital media file selected from the group consisting of;

a digital image, a sequence of digital images, a group of pages of digital text, digital music, a digital map, digital video, and combinations thereof.

13. The invention of claim 12 wherein the memory cells are write-once memory cells.

14. The invention of claim 12 or 13 wherein the memory cells are field programmable.

15. The invention of claim 12 wherein the memory cells are arrayed on a substrate with an area density no less than about 3×

10⁷ memory cells per square millimeter of substrate.

16. The invention of claim 12 further comprising:

a support element that carries the memory unit;

a device interface unit carried by the support element and coupled with the memory unit; and

an electrical connector carried by the support element and coupled with the device interface unit.

17. The invention of claim 16 wherein the memory unit and the device interface unit are fabricated on a single substrate, and wherein the substrate is carried by the support element.

18. The invention of claim 16 wherein the device interface unit fits within an area of no more than 8 mm².

19. The invention of claim 2 or 12 in combination with a digital media storage device operative to field program said digital media file in said memory cells.

20. The invention of claim 19 wherein the storage device comprises a digital camera.

21. The invention of claim 19 wherein the storage device comprises a digital audio playback device.

22. The invention of claim 19 wherein the storage device comprises an electronic book.

23. The invention of claim 12, wherein the plurality of stacked layers are stacked vertically above one another in a single chip.

24. A modular memory device comprising:

a support element;

a memory unit comprising a write once memory array fabricated on a substrate, said memory unit carried by the support element;

a device interface unit fabricated on the same substrate as the memory array and coupled with the memory unit; and

an electrical connector carried by the support element and coupled with the device interface unit;

wherein the device interface unit comprises circuitry allowing the modular memory device to interface with a device coupled with the electrical connector.

25. The invention of claim 24 wherein the memory array comprises a three-dimensional array of memory cells.

26. The invention of claim 24 wherein the memory array comprises a two-dimensional array of memory cells.

29. The invention of claim 24 or 27 wherein the device interface unit implements an interrupt management function for a selected protocol.

27. A modular memory device comprising:

a support element;

a memory unit comprising a three-dimensional memory array fabricated on a substrate, said memory unit carried by the support element;

a device interface unit fabricated on the same substrate as the memory array and coupled with the memory unit; and

an electrical connector carried by the support element and coupled with the device interface unit.

28. The invention of claim 27, wherein the three-dimensional memory array comprises a plurality of layers of memory cells stacked vertically above one another in a single chip.

30. A memory device comprising:

an integrated circuit substrate;

a first memory array above the integrated circuit substrate; and

a second memory array fabricated on the integrated circuit substrate under the first memory array;

wherein the first and second memory arrays each comprise a respective plurality of memory cells, and wherein the memory cells of the first memory array are of a different type than the memory cells of the second memory array.

31. The invention of claim 30, wherein the memory cells of the first memory array are write-once, and wherein the memory cells of the second memory array are write-many.