Optical module

• US 6,546,173 B2
• Filed: 02/20/2001
• Issued: 04/08/2003
• Est. Priority Date: 02/20/2001
• Status: Expired due to Term

• Current Assignee: RPX Corporation
• Original Assignee: Avanti Optics Corporation
• Inventors: Case, Steven K., Skunes, Timothy A., Mowry, Gregory S.
• Primary Examiner(s): Patel, Tulsidas
• Application Number:
  US09/789,125
• Publication Number:
  US 20020114586A1
• Time in Patent Office: 777 Days
• Field of Search: 385/52, 385/51, 385/39, 385/88
• US Class Current: 385/52
• CPC Class Codes: G02B 6/255 Splicing of light guides, e.g. by fusion or bonding
• CPC Class Codes: G02B 6/2553 Splicing machines, e.g. optical fibre fusion splicer
• CPC Class Codes: G02B 6/2555 Alignment or adjustment devices for aligning prior to splicing
• CPC Class Codes: G02B 6/32 having lens focusing means positioned between opposed fibre ends with lens being an integral part of the single fibre end G02B6/262
• CPC Class Codes: G02B 6/3636 the mechanical coupling means being grooves G02B6/3652 takes precedence
• CPC Class Codes: G02B 6/3652 the additional structures being prepositioning mounting areas, allowing only movement in one dimension, e.g. grooves, trenches or vias in the microbench surface, i.e. self aligning supporting carriers
• CPC Class Codes: G02B 6/3692 with surface micromachining involving etching, e.g. wet or dry etching steps surface micromachining involving subtractive techniques B81C1/00055
• CPC Class Codes: G02B 6/3873 Connectors using guide surfaces for aligning ferrule ends, e.g. tubes, sleeves, V-grooves, rods, pins, balls
• CPC Class Codes: G02B 6/4207 with optical elements reducing the sensitivity to optical feedback anti-reflection devices specially adapted for lasers, see H01S3/0064
• CPC Class Codes: G02B 6/4221 involving a visual detection of the position of the elements, e.g. by using a microscope or a camera
• CPC Class Codes: G02B 6/4224 using visual alignment markings, e.g. index methods
• CPC Class Codes: G02B 6/4225 by a direct measurement of the degree of coupling, e.g. the amount of light power coupled to the fibre or the opto-electronic element
• CPC Class Codes: G02B 6/4226 Positioning means for moving the elements into alignment, e.g. alignment screws, deformation of the mount
• CPC Class Codes: G02B 6/4227 Active alignment methods, e.g. procedures and algorithms
• CPC Class Codes: G02B 6/4228 Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements G02B6/4234 takes precedence
• CPC Class Codes: G02B 6/4231 with intermediate elements, e.g. rods and balls, between the elements
• CPC Class Codes: G02B 6/4232 using the surface tension of fluid solder to align the elements, e.g. solder bump techniques flip-chip mounting techniques in assembly of semiconductor devices H01L24/81
• CPC Class Codes: G02B 6/4236 Fixing or mounting methods of the aligned elements
• CPC Class Codes: G02B 6/4238 Soldering
• CPC Class Codes: G02B 6/4239 Adhesive bonding; Encapsulation with polymer material
• CPC Class Codes: Y10T 29/49004 : including measuring or testing of device or component part
• CPC Class Codes: Y10T 29/49117 : Conductor or circuit manufacturing
• CPC Class Codes: Y10T 29/4913 : Assembling to base an electrical component, e.g., capacitor, etc.
• CPC Class Codes: Y10T 29/49131 : by utilizing optical sighting device
• CPC Class Codes: Y10T 29/49144 : by metal fusion

Abstract

An optical module for use in an optical device is provided. The module includes an optical component and relative reference mount. The optical component is fixed spacially relative to a registration feature. The registration feature is configured to couple to a fixed reference mount.

Claims

1. An optical module for use in an optical device, comprising:

an optical component having an optical characteristic which varies based upon a position of the optical component in space relative to at least one dimension and wherein component variability causes a variability in the optical characteristic;

a relative reference mount having a registration feature with a three dimensional shape configured to constrain movement in six degrees of freedom when physically coupled to a corresponding registration feature of a fixed reference mount and to provide a repeatable is registration therebetween;

an adjustable optical component mount configured to fixedly couple to the optical component and have an adjustable position relative to the relative reference mount; and

a bond configured to bond the optical component mount to the relative reference mount and thereby fix the optical component relative to the registration feature of the relative reference mount at a prealigned position relative to the registration feature of the relative reference mount to adjust for the variability in the optical characteristic of the optical component prior to placing the relative reference mount in the fixed reference mount whereby the optical component is fixed in six degrees of freedom relative to the registration feature of the relative reference mount.

2. The optical module of claim 1 wherein the bond comprises solder.

3. The optical module of claim 1 wherein the bond is electrical conductive.

4. The optical module of claim 1 wherein the optical component mount comprises first and second plates with the optical component secured therebetween.

5. The optical module of claim 1 wherein the bond comprises adhesive.

6. The optical module of claim 1 wherein the bond has a first state in which the spacial orientation can be adjusted and a second state in which the spacial orientation is fixed.

7. The optical module of claim 6 wherein the bond is operably coupled to only one of the optical component and the relative reference mount when in a first state.

8. The optical module of claim 7 wherein the bond is activated to fill a gap.

9. The optical module of claim 6 wherein application or removal of heat causes a change in state of the bond.

10. The optical module of claim 6 wherein application or removal of radiation causes a change in state of the bond.

11. The optical module of claim 1 wherein the relative reference mount is substantially planar.

12. The optical module of claim 1 wherein the fixed reference mount comprises a substantially planar substrate.

13. The optical module of claim 1 wherein the bond has a first state in which the optical component can move with up to 6 degrees of freedom relative to the relative reference mount.

14. The optical module of claim 1 including a bonding pad between the optical component mount and the relative reference mount configured to adhere to the bond.

15. The optical module of claim 1 wherein the optical component mount includes a registration feature configured to register the optical component.

16. The optical module of claim 1 wherein the optical component is bonded to the optical component mount.

17. The optical module of claim 1 wherein the bond is heat activated and at least one heater element is thermally coupled to the bond.

18. The optical module of claim 17 including electrical conductors on at least one of the relative reference mount and the optical component mount electrically coupled to the heater element.

19. The optical module of claim 18 including contact pads electrically coupled to the electrical conductors.

20. The optical module of claim 1 including a bonding pad on the relative reference mount configured to adhere to a bond coupled to the fixed reference mount.

21. The optical module of claim 1 wherein the relative reference mount comprises silicon.

22. The optical module of claim 1 wherein the optical component mount comprises silicon.

23. The optical module of claim 1 wherein the optical component mount includes an interface surface and the optical component is flush with the interface surface.

24. The optical module of claim 1 wherein the relative reference mount comprises a semiconductor.

25. The optical module of claim 1 wherein the relative reference mount comprises a ceramic.

26. The optical module of claim 1 wherein the registration feature is configured to provide substantially kinematic registration to a fixed reference mount.

27. The optical module of claim 1 wherein the adjustable position comprises a height adjustment of the optical component over the relative reference mount.

28. The optical module of claim 1 wherein the bond comprises a weld.

29. An optical module for use in an optical device, comprising:

an optical component having an optical characteristic which varies based upon a position of the optical component in space relative to at least one dimension and wherein component variability causes a variability in the optical characteristic;

an adjustable optical component mount having a substantially planar mount plate coupled to the optical component;

a substantially planar relative reference mount having a registration feature with a three dimensional shape configured to constrain movement in six degrees of freedom when physically coupled to a substantially planar fixed reference substrate and to provide a repeatable registration therebetween;

a bond configured to bond the relative reference mount to the optical component mount opposite the optical component to thereby fix the optical component relative to the relative reference mount at a prealigned position;

wherein the adjustable optical component mount allows adjustment of the optical component relative to the substantially planar relative reference mount and the bond fixes the adjusted position of the optical component at a prealigned position relative to the registration feature of the relative reference mount to adjust for the variability in the optical characteristic of the optical component prior to placing the relative reference mount in the fixed reference mount whereby the optical component is fixed in six degrees of freedom relative to the substantially planar relative reference mount.

30. The optical module of claim 29 wherein the bond comprises solder.

31. The optical module of claim 29 wherein the bond comprises adhesive.

32. The optical module of claim 29 wherein the bond has a first state in which the spacial orientation can be adjusted and a second state in which the spacial orientation is fixed.

33. The optical module of claim 32 wherein the bond touches only one of the optical component mount and the relative reference mount when in a first state.

34. The optical module of claim 33 wherein application or removal of heat causes a change in state of the bond.

35. The optical module of claim 29 including a bonding pad between the optical component mount and the relative reference mount configured to adhere to the bond.

36. The optical module of claim 29 wherein the bond is heat activated and at least one heating element is thermally coupled to the bond.

37. The optical module of claim 29 wherein the relative reference mount comprises silicon.

38. The optical module of claim 29 wherein the registration feature is configured to provide substantially kinematic registration to a fixed reference mount.

39. The optical module of claim 29 wherein the adjusted position comprises height of the optical component over the relative reference mount.

40. The optical module of claim 29 wherein the bond comprises a weld.

41. An optical module for use in an optical device, comprising:

an optical component having an optical characteristic which varies based upon a position of the optical component in space relative to at least one dimension and wherein component variability causes a variability in the optical characteristic;

an adjustable optical component mount configured to fixedly couple to the optical component;

a relative reference mount having a registration feature with a three dimensional shape configured to constrain movement of the adjustable optical component mount in six degrees of freedom when physically coupled to a reference substrate and to provide a repeatable registration therebetween and allow relative adjustment of the position of the adjustable optical component mount; and

an adjusted fixed spacial orientation between the optical component mount and the relative reference mount to prealign the optical component relative to the registration feature of the relative reference mount to adjust for the variability in the optical characteristic of the optical component prior to placing the relative reference mount in the reference substrate whereby the optical component is fixed in six degrees of freedom relative to the relative reference mount.

42. The optical module of claim 41 including a bond to fix the spacial location.

43. The optical module of claim 42 wherein the bond comprises solder.

44. The optical module of claim 41 wherein the registration feature is configured to provide substantially kinematic registration to the reference substrate.

45. The optical module of claim 43 wherein the bond has a first state in which the spacial orientation can be adjusted and a second state in which the spacial orientation is fixed.

46. The optical module of claim 42 wherein the bond touches only one of the adjustable optical component mount and the relative reference mount when in a first state.

47. The optical module of claim 42 wherein the bond is activated to fix the spacial orientation.

48. The optical module of claim 47 wherein application or removal of heat causes a change in state of the bond.

49. The optical module of claim 41 wherein the relative reference mount is substantially planar.

50. The optical module of claim 41 including a bonding pad between the adjustable optical component mount and the relative reference mount configured to adhere to the bond.

51. The optical module of claim 48 including a heating element carried on at least one of the relative reference mount and the optical component mount.

52. The optical module of claim 41 wherein the optical component mount comprises silicon.

53. The optical module of claim 41 wherein the adjusted fixed spacial orientation comprises height of the optical component over the relative reference mount.

54. The optical module of claim 42 wherein the bond comprises a weld.

56. The optical module of claim 53 wherein the bond comprises solder.

55. An optical module for use in an optical device, comprising:

an optical component having an optical characteristic which varies based upon a position of the optical component in space relative to at least one dimension and wherein component variability causes a variability in the optical characteristic;

a relative reference mount having a registration feature with a three dimensional shape configured to constrain movement in six degrees of freedom when physically coupled to a corresponding registration feature of a substrate and to provide a repeatable registration therebetween;

an adjustable optical component mount configured to fixedly mount the optical component and adjustably mount to the relative reference mount at a prealigned orientation and position relative to the registration feature; and

a bond configured to fixedly secure the adjustable optical component mount and thereby the optical component at the prealigned orientation and position relative to the registration feature of the relative reference mount to adjust for the variability in the optical characteristic of the optical component prior to placing the substrate in the fixed reference mount whereby the optical component is fixed in six degrees of freedom relative to the registration feature of the relative reference mount.

57. The optical module of claim 55 wherein the optical characteristic is aligned with a reference defined relative to the registration feature of the relative reference mount.

58. The optical module of claim 55 wherein the bond provides a fixed spacial orientation between the optical component and the relative reference mount.

59. The optical module of claim 58 wherein the bond has a first state in which the spacial orientation can be adjusted and a second state in which the spacial orientation is fixed.

60. The optical module of claim 59 wherein the bond is operably coupled to only one of the optical component mount and the relative reference mount when in a first state.

61. The optical module of claim 55 wherein application or removal of heat causes a change in state of the bond.

62. The optical module of claim 55 wherein the bond is heat activated and at least one heating element is thermally coupled to the bond.

63. The optical module of claim 55 wherein the prealigned position comprises a height of the optical component over the relative reference mount.

64. The optical module of claim 55 wherein the bond comprises a weld.