Semiconductor packages and methods for making the same

• US 6,548,764 B1
• Filed: 06/07/2000
• Issued: 04/15/2003
• Est. Priority Date: 06/07/2000
• Status: Expired due to Term

• Current Assignee: Micron Technology, Inc.
• Original Assignee: Micron Technology, Inc.
• Inventors: Jiang, Tongbi, Street, Bret, Prindiville, Casey
• Primary Examiner(s): Talbott, David L.
• Assistant Examiner(s): NORRIS, JEREMY C
• Application Number:
  US09/590,023
• Time in Patent Office: 1,042 Days
• Field of Search: 174/52.2, 174/52.4, 174/260, 174/255, 298/32, 298/33, 298/38, 298/41
• US Class Current: 174/255
• CPC Class Codes: H01L 21/565 Moulds
• CPC Class Codes: H01L 22/20 Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
• CPC Class Codes: H01L 2224/4824 Connecting between the body and an opposite side of the item with respect to the body
• CPC Class Codes: H01L 2224/85 using a wire connector
• CPC Class Codes: H01L 2224/97 the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 24/97 the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/01029 Copper [Cu]
• CPC Class Codes: H01L 2924/01079 Gold [Au]
• CPC Class Codes: H01L 2924/01087 Francium [Fr]
• CPC Class Codes: H01L 2924/014 Solder alloys
• CPC Class Codes: H01L 2924/14 Integrated circuits
• CPC Class Codes: H01L 2924/15311 being a ball array, e.g. BGA
• CPC Class Codes: H01L 2924/181 Encapsulation
• CPC Class Codes: Y10T 29/4913 Assembling to base an electrical component, e.g., capacitor, etc.

Abstract

Semiconductor package support elements including cover members attached to one or more reject die sites are provided. Methods for making the support elements of the present invention and for making semiconductor packages using the same are also provided. Reject die sites on defective substrates of a support element are covered prior to the encapsulation process using a cover member. The cover member comprises, for example, pressure-sensitive or temperature-activated tape, reject dies, or the like. The support elements and methods of the present invention virtually eliminate bleeding or flashing during encapsulation due to the presence of reject die sites. The support elements and methods of the present invention further ensure that functional dice are not sacrificed by being attached to reject die sites, thereby decreasing manufacturing costs while increasing yield of functional semiconductor packages.

Claims

1. A support element comprising:

(a) a plurality of integrally connected substrates, the substrates forming a first surface and a second surface;

(b) at least one defective substrate forming a defective die attach area on the second surface of the defective substrate;

(c) the at least one defective substrate having a wire bond slot forming an opening through the defective substrate extending from the first surface to the second surface; and

(d) a cover member attached to the at least one defective substrate at the defective die attach area so as to cover at least a portion of the wire bond slot, wherein the cover member does not comprise a functional die.

2. The support element of claim 1, wherein the first surface further includes a plurality of conductors.

3. The support member of claim 1, wherein the cover member comprises tape, the tape having dimensions sufficient to cover at least a portion of the wire bond slot.

4. The support member of claim 1, wherein the cover member covers a majority of an opening formed by the wire bond slot.

5. The support element of claim 1, wherein the cover member covers from about 70% to about 98% of the opening formed by the wire bond slot.

6. A support clement comprising:

(a) a strip of insulating material forming a plurality of integrally connected substrates;

(b) a first surface having electrical circuitry at each substrate, wherein there is at least one defective substrate that includes defective electrical circuitry;

(c) a second surface having a substantially planar die attach surface at each substrate; and

(d) a cover member placed on the at least one defective substrate having defective electrical circuitry, wherein the cover member covers at least a portion of an opening extending through the defective substrate and does not comprise a functional die.

7. The support member of claim 6, wherein the cover member covers from about 80% to about 90% of the opening.

8. The support element of claim 6, wherein the cover member comprises self-adhesive tape.

9. The support element of claim 6, wherein the cover member comprises a defective die.

10. The support element of claim 6, wherein the cover member covers from about 70% to about 98% of the opening.

11. A support element comprising:

(a) a plurality of integrally connected substrates, the substrates forming a first surface and a second surface;

(b) at least one defective substrate forming a defective die attach area on the second surface of the defective substrate;

(c) the at least one defective substrate having a wire bond slot forming an opening through the defective substrate extending from the first surface to the second surface; and

(d) a cover member attached to the at least one defective substrate at the defective die attach area so as to cover a majority of the opening formed by the wire bond slot, wherein the cover member does not comprise a functional die.

12. The support element of claim 11, wherein the cover member covers from about 70% to about 98% of the opening formed by the wire bond slot.

13. A support element comprising:

(a) a plurality of integrally connected substrates, the substrates forming a first surface and a second surface;

(b) at least one defective substrate forming a defective die attach area on the second surface of the defective substrate;

(c) the at least one defective substrate having a wire bond slot forming an opening through the defective substrate extending from the first surface to the second surface; and

(d) a cover member attached to the at least one defective substrate at the defective die attach area so as to cover from about 70 percent to about 100 percent of the opening formed by the wire bond slot, wherein the cover member does not comprise a functional die.

14. The support element of claim 13, wherein the cover member covers from about 70% to about 98% of the opening formed by the wire bond slot.