Hybrid integrated circuit device

• US 6,548,832 B1
• Filed: 03/28/2000
• Issued: 04/15/2003
• Est. Priority Date: 06/09/1999
• Status: Expired due to Term

• Current Assignee: III Holdings 2, LLC
• Original Assignee: Sanyo Electric Company Limited (Panasonic Holdings Corporation)
• Inventors: Ota, Susumu, Kobayashi, Yoshiyuki, Sakamoto, Noriaki, Shimizu, Hisashi
• Primary Examiner(s): Flynn, Nathan J.
• Assistant Examiner(s): Andujar, Leonardo
• Application Number:
  US09/536,921
• Time in Patent Office: 1,113 Days
• Field of Search: 257/81, 257/82, 257/88, 257/89, 257/93, 257/95, 257/98, 257/99
• US Class Current: 257/88
• CPC Class Codes: F21V 29/00 Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems lighting fixtures combined with outlets for air-treatment systems F24F13/078
• CPC Class Codes: F21Y 2115/10 Light-emitting diodes [LED]
• CPC Class Codes: H01L 2224/45124 Aluminium (Al) as principal constituent
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48472 the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
• CPC Class Codes: H01L 25/0753 the devices being arranged next to each other
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/12041 LED
• CPC Class Codes: H01L 33/52 Encapsulations
• CPC Class Codes: H01L 33/54 having a particular shape
• CPC Class Codes: H01L 33/60 Reflective elements
• CPC Class Codes: H01L 33/62 Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls

Abstract

In a light irradiation device in which a light emitting element is attached to a printed circuit board, the heat radiation properties are enhanced, and improvement of the light emitting efficiency and reduction of the size and weight are realized. A Cu pattern covered with Ni is formed on a metal substrate 11. Light emitting elements 11 are mounted on the pattern in the form of a series circuit. Metal substrates in each of which the series connection is formed are connected to one another in parallel. Since Ni has excellent corrosion resistance and a high reflection efficiency, the surfaces of the substrates themselves can be used as reflective plates. A lens 37 is formed for each of the light emitting elements, whereby the emission efficiency can be further improved.

When a circuit is configured in one region of a hybrid integrated circuit substrate, a position recognition mark 53 and a flow stop 57 are disposed in the open region. Also the region is covered with Ni so as to function as reflecting means.

Claims

1. A hybrid integrated circuit device comprising:

a metal substrate covered with an insulation;

a wiring portion disposed substantially over the metal substrate and substantially covered by a reflective conductive film, comprising electrode regions, said electrode regions isolated from each other by a gap, said reflective conductive film being configured to reflect light;

a mounting region formed on each electrode region; and

a light emitting element mounted on each mounting region and connecting one electrode region to another in series.

2. A hybrid integrated circuit device according to claim 1, wherein the gap has a constant width.

3. A hybrid integrated-circuit device according to claim 1, wherein the reflective conductive film covers the wiring portion except for the gap.

4. A hybrid integrated circuit device according to claim 1, wherein the gap has a predetermined width for isolating the electrode regions from each other.

5. A hybrid integrated circuit device according to claim 1, further comprising:

a first wiring region disposed at one end of the substrate; and

a second wiring region disposed at the opposite end of the substrate;

wherein the electrode regions connect the first wiring region and the second wiring region in series.

6. A hybrid integrated circuit device according to claim 1, wherein the light emitting elements are arranged in even number column-wise and odd number row-wise.

7. A hybrid integrated circuit device comprising:

a metal substrate covered with an insulation;

electrode regions disposed on the metal substrate said electrode regions being isolated from each other and substantially covering the metal substrate, said electrode regions covered by a reflective conductive film, said reflective conductive film being configured to reflect light;

a plurality of light emitting diodes, each diode coupling one electrode region to another to connect all the electrode regions in series; and

a circuit mounted on the metal substrate for driving said light emitting diodes, said circuit covered by a reflective conductive film.

8. A hybrid integrated circuit device comprising:

a substrate;

electrode regions disposed on the substrate, said electrode regions being isolated from each other;

a reflective conductive film covering the electrode regions;

a plurality of light emitting diodes, each diode coupling one electrode region to another to connect all the electrode regions in series; and

a circuit mounted on the substrate for driving said light emitting diodes, said circuit covered by a reflective conductive film;

an island-like conductive pattern, comprising a reflective conductive film, disposed in regions on the substrate not occupied by the electrode regions and the circuit;

wherein said electrode regions, the island-like conductive pattern, and the circuit substantially cover the substrate, said island-like conductive pattern is an alignment mark.

9. A hybrid integrated circuit device comprising:

a metal substrate covered with an insulation;

electrode regions disposed on the metal substrate, said electrode regions being isolated from each other;

a reflective conductive film covering the electrode regions;

a plurality of light emitting diodes, each diode coupling one electrode region to another to connect all the electrode regions in series; and

a circuit mounted on the metal substrate for driving said light emitting diodes, said circuit covered by a reflective conductive film;

an island-like conductive pattern, comprising a reflective conductive film, disposed in regions on the metal substrate not occupied by the electrode regions and the circuit;

wherein said electrode regions, the island-like conductive pattern, and the circuit substantially cover the metal substrate, said island-like conductive pattern is configured to stop a flow of a resin.

10. A hybrid integrated circuit device comprising:

a metal substrate covered with an insulation;

a first wiring region disposed at one end of the metal substrate;

a second wiring region disposed at the opposite end of the metal substrate;

a plurality of electrodes disposed between said first wiring region and said second wiring region;

a plurality of light emitting diodes, each diode connecting one electrode to another to connect all the electrodes in series;

the first wiring region and the second wiring region connected in series through the electrodes;

a circuit mounted on said metal substrate for driving said light emitting diodes; and

an island-like conductive pattern disposed in a region on the metal substrate not occupied by the first and second wiring regions, the electrodes, and the circuit;

wherein the first and second wiring regions, the electrodes, the island-like conductive pattern, and the circuit substantially cover the metal substrate and are covered with a light reflective film, said island-like conductive pattern is an alignment mark.

11. A hybrid integrated circuit device according to claim 10, wherein said film comprises any one of Au, Ni, and solder.

12. A hybrid integrated circuit device according to claim 10, wherein a resin is disposed on said circuit and contacts said island-like conductive pattern.

13. A hybrid integrated circuit device according to claim 10, wherein the substrate is made of a surface insulated metal substrate.

14. A hybrid integrated circuit device comprising:

a plurality of the metal substrates of claim 10;

wherein the substrates are electrically connected to each other.

15. A hybrid integrated circuit device according to claim 14, wherein one substrate and another substrate juxtaposed to each other have opposite wiring patterns with respect to each other.

16. A hybrid integrated circuit device according to claim 15, further comprising:

a bonding area or a solder bonding area formed at both ends of each substrate.

17. A hybrid integrated circuit device according to claim 16, wherein the bonding area or solder bonding area has a plurality of areas formed on each of both ends of the substrate.

18. A light irradiating apparatus comprising:

a plurality of the hybrid integrated circuit devices comprising

a metal substrate covered with an insulation;

a wiring portion disposed substantially over the metal substrate and substantially covered by a reflective conductive film, comprising electrode regions, said electrode regions isolated from each other by a gap;

a mounting region formed on each electrode region; and

a light emitting element mounted on each mounting region and connecting one electrode region to another in series;

a metallic container with the hybrid integrated circuit devices forming a bottom;

wherein water for cooling the devices also feeds a plant placed on the devices and a light generated by the devices promotes plant growth.