Inspection system with vibration resistant video capture

• US 6,549,647 B1
• Filed: 03/10/2000
• Issued: 04/15/2003
• Est. Priority Date: 01/07/2000
• Status: Expired due to Fees

• Current Assignee: CyberOptics Corporation (Nordson Corporation)
• Original Assignee: CyberOptics Corporation (Nordson Corporation)
• Inventors: Skunes, Timothy A., Fishbaine, David
• Primary Examiner(s): Mehta, Bhavesh
• Assistant Examiner(s): CHAWAN, SHEELA C
• Application Number:
  US09/522,519
• Time in Patent Office: 1,131 Days
• Field of Search: 382/145, 382/147, 382/149, 382/108, 382/150, 382/286, 356/376, 356/512, 250/208.1, 348/297, 348/92, 348/95, 348/94, 348/129, 348/134, 348/311-317, 348/142, 348/275, 358/213.19
• US Class Current: 382/150
• CPC Class Codes: G01B 11/2518 Projection by scanning of the object
• CPC Class Codes: G01B 11/30 for measuring roughness or irregularity of surfaces
• CPC Class Codes: G01N 2021/95646 Soldering
• CPC Class Codes: H04N 25/72 using frame transfer [FT]

Abstract

Methods and an apparatus are disclosed for providing enhanced vibration immunity in a solder paste inspection system, although they are usable in any number of industries that require rapid acquisition of several images. The method includes capturing at least three images on a frame transfer CCD array before any data is sequentially read from the array. The present method is extendable to a larger number of images. Additionally, the masked memory area can be larger than the image area of the frame transfer CCD array.

Claims

1. A method of acquiring at least two images with a single frame transfer CCD array, the method comprising:

a) illuminating an object, and acquiring a first image on an image area of the array;

b) shifting at least a portion of the first image into a memory area of the array;

c) resetting the image area of the array; and

d) illuminating the object and acquiring a second image on the image area of the array, while the first image is in the memory area of the single frame transfer CCD array; and

wherein the at least two images are acquired within about 1 millisecond.

2. The method of claim 1, wherein object height is computed based upon the at least two images.

3. A solder paste inspection system performing the method of claim 2.

4. A solder paste inspection system performing the method of claim 1.

5. The method of claim 1, wherein the illumination is in the visible spectrum.

6. A method of acquiring at least three fringe pattern images on a surface feature, the method comprising:

successively acquiring at least first, second, and third fringe pattern images with a single frame transfer CCD array;

wherein all images are acquired before any data is read from the CCD array; and

wherein all images are acquired within about 1 millisecond.

7. A method of acquiring three fringe pattern images of a feature with a single frame transfer CCD array having an image area with a width W and a height H, and a memory area, the method comprising:

a) exposing the feature with a first fringe pattern, and acquiring a first image thereof on the image area;

b) shifting the first image by a distance corresponding to a length of H/2;

c) resetting the image area of the array;

d) exposing the feature with a second fringe pattern, and acquiring a second image thereof on the image area;

e) shifting the second image by a distance corresponding to a length of H/2;

f) resetting the image area of the array;

g) exposing the feature with a third fringe pattern, and acquiring a third image thereof on the image area; and

h) shifting the first, second and third images out of the array.

8. The method of claim 7, wherein the first second, and third images each have a size substantially of W by H/2.

9. The method of claim 7, wherein the steps of a) through h) are performed within a time period of about 2 milliseconds.

10. The method of claim 9, wherein the steps of a) through h) are performed within about 1 millisecond.

11. The method of claim 7, wherein feature height is computed based upon the first, second and third images.

12. A solder paste inspection system performing the method of claim 7.

13. The method of claim 7 wherein the memory area and the image area are of substantially the same size.

14. A method of capturing at least three video images on a surface feature with a single frame transfer CCD array having an image area and a memory area, the method comprising:

a) energizing an illumination source to project illumination on the surface feature;

b) acquiring an image in the image area;

c) transferring contents of the image area and the memory area by an amount equal to a fraction of the height of the image area;

d) resetting the image area of the CCD array;

e) repeating steps a) through c) a number of times equal to the inverse of the fraction and executing step d) between each iteration of steps a) through c); and

wherein the inverse of the fraction is an integer greater than one.

15. The method of claim 14 wherein the memory area and the image area are of substantially the same size.

16. A method of acquiring three fringe pattern images of a feature with a single frame transfer CCD array having an image area with a width W and a height H and a memory area having a width W and a height 2H, the method comprising:

a) exposing the feature with a first fringe pattern of light, and acquiring a first image thereof on the image area;

b) shifting the first image completely into the memory area;

c) exposing the feature with a second fringe pattern of light, and acquiring a second image thereof on the image area;

d) shifting the second image completely into the memory area,

e) exposing the feature with a third fringe pattern of light, and acquiring a third image thereof on the image area; and

f) shifting the first, second and third images out of the array.