Multilayer ceramic electronic element and manufacturing method therefor

• US 6,550,117 B1
• Filed: 06/20/2000
• Issued: 04/22/2003
• Est. Priority Date: 12/03/1997
• Status: Expired due to Fees

• Current Assignee: TDK Corporation
• Original Assignee: TDK Corporation
• Inventors: Nomura, Takeshi, Tokuoka, Yasumichi
• Primary Examiner(s): Walczak, David J.
• Application Number:
  US09/595,912
• Time in Patent Office: 1,036 Days
• Field of Search: 29/254.2, 298/30, 298/31, 298/42, 298/46, 298/51, 29/254.1, 361/303, 361/306.1, 361/306.3, 361/308.1, 361/309, 361/310, 361/311, 361/312, 361/313, 361/321--32, 156/89.12, 156/89.16, 156/89.23, 156/235, 156/239
• US Class Current: 29/25.42
• CPC Class Codes: H01G 4/30 Stacked capacitors H01G4/33 takes precedence
• CPC Class Codes: H01G 4/308 made by transfer techniques
• CPC Class Codes: H05K 1/0306 Inorganic insulating substrates, e.g. ceramic, glass
• CPC Class Codes: H05K 2201/09881 Coating only between conductors, i.e. flush with the conductors
• CPC Class Codes: H05K 2203/0108 Male die used for patterning, punching or transferring
• CPC Class Codes: H05K 2203/0528 Patterning during transfer, i.e. without preformed pattern, e.g. by using a die, a programmed tool or a laser
• CPC Class Codes: H05K 3/046 by selective transfer or selective detachment of a conductive layer
• CPC Class Codes: H05K 3/4667 characterized by using an inorganic intermediate insulating layer
• CPC Class Codes: Y10T 29/43 Electric condenser making
• CPC Class Codes: Y10T 29/435 Solid dielectric type
• CPC Class Codes: Y10T 29/49126 Assembling bases
• CPC Class Codes: Y10T 29/49128 Assembling formed circuit to base

Abstract

Internal electrode layers of a multilayer ceramic electronic element are structured such that spaces, which are formed between adjacent internal electrodes, are eliminated so as to substantially flatten the internal electrode layers. Moreover, the thickness of each green dielectric layer is reduced. To achieve this, a laminating process is performed by a thermal transfer printing method such that a thermal transfer conductor material and a thermal transfer dielectric material are used so as to form internal electrode portions and green dielectric portions. Thus, the internal electrode layers are formed.

Claims

1. A method of manufacturing a multilayer ceramic electronic element, comprising the steps of:

forming a green internal electrode portion by thermally transfer-printing, on a green dielectric layer formed on a support member, a thermal transfer conductor material by a first thermal transfer printing method; and

forming a green dielectric portion by thermally transfer-printing, on a surface of said green dielectric layer at where said green internal electrode portion is not formed and which is flush with said green internal electrode portion, a thermal transfer dielectric material by a second thermal transfer printing method so that a substantially flat green internal electrode layer is formed.

2. A method of manufacturing a multilayer ceramic electronic element according to claim 1, wherein said green dielectric layer is formed on said support member by a third thermal transfer printing method using said thermal transfer dielectric material.

3. A method of manufacturing a multilayer ceramic electronic element according to claim 2, wherein said thermal transfer conductor material is formed by sequentially laminating, on said support member, a separation layer mainly composed of wax, a conductor layer mainly composed of thermoplastic resin, wax and conductor particles or the thermoplastic resin and the conductor particles and an adhesive layer mainly composed of thermoplastic resin and wax or the thermoplastic resin and said thermal transfer dielectric material is formed by sequentially laminating, on said support member, a separation layer mainly composed of wax, a dielectric layer mainly composed of thermoplastic resin, wax and dielectric particles or the thermoplastic resin and the dielectric particles and adhesive layer mainly composed of thermoplastic resin and wax or the thermoplastic resin.

4. A method of manufacturing a multilayer ceramic electronic element according to claim 1, wherein said thermal transfer conductor material is formed by sequentially laminating, on said support member, a separation layer mainly composed of wax, a conductor layer mainly composed of thermoplastic resin, wax and conductor particles or the thermoplastic resin and the conductor particles and an adhesive layer mainly composed of thermoplastic resin and wax or the thermoplastic resin and said thermal transfer dielectric material is formed by sequentially laminating, on said support member, a separation layer mainly composed of wax, a dielectric layer mainly composed of thermoplastic resin, wax and dielectric particles or the thermoplastic resin and the dielectric particles and adhesive layer mainly composed of thermoplastic resin and wax or the thermoplastic resin.

5. A method of manufacturing a multilayer ceramic electronic element according to any one of claims 1 to 3, wherein a surface of said green internal electrode layer is subjected to a calendering process so that the surface of said green internal electrode layer is flattened.