Vapor chamber active heat sink

• US 6,550,531 B1
• Filed: 05/16/2000
• Issued: 04/22/2003
• Est. Priority Date: 05/16/2000
• Status: Active Grant

• Current Assignee: Intel Corporation
• Original Assignee: Intel Corporation
• Inventors: Searls, Damion T., Dishongh, Terrance J., Lian, Bin, Dujari, Prateek J.
• Primary Examiner(s): Bennett, Henry
• Assistant Examiner(s): MCKINNON, TERRELL L
• Application Number:
  US09/572,926
• Time in Patent Office: 1,071 Days
• Field of Search: 165/80.3, 165/80.4, 165/104.26, 165/104.33, 361/699, 361/700, 257/716, 174/15.2
• US Class Current: 165/104.33
• CPC Class Codes: F28D 15/0233 the conduits having a particular shape, e.g. non-circular cross-section, annular F28D15/0241, F28D15/0266 take precedence
• CPC Class Codes: F28D 2021/0029 Heat sinks
• CPC Class Codes: F28F 3/022 the means being wires or pins
• CPC Class Codes: F28F 3/04 the means being integral with the element
• CPC Class Codes: H01L 2224/16 of an individual bump connector
• CPC Class Codes: H01L 2224/73253 Bump and layer connectors
• CPC Class Codes: H01L 23/427 Cooling by change of state, e.g. use of heat pipes by liquefied gas H01L23/445

Abstract

A heat dissipation device including a base portion having a plurality of projections extending therefrom. The base portion may have a vapor chamber defined therein and may have first surface sloped from a central apex portion to edges of the base portion. The vapor chamber includes at least one extension on a vapor chamber upper surface which is adapted to direct a condensed working fluid toward a desired location on a vapor chamber lower surface. The vapor chamber lower surface may have at least one depression to collect a greater portion of the working fluid in a desired location(s).

Claims

1. A heat dissipation device, comprising:

a base portion having a first surface sloped from a central apex portion thereof to edges of said base portion such that a substantially pyramidal shape is formed;

said a plurality of projections extending from said base portion first surface; and

a chamber defined within said base portion, wherein said chamber includes a working fluid disposed therein.

2. The heat dissipation device of claim 1, wherein said base portion further includes a mounting surface, wherein said plurality of projections extend from said base portion first surface substantially perpendicularly to said base portion mounting surface.

3. The heat dissipation device of claim 1, further including at least one extension on an upper surface of said chamber, wherein said at least one extension is positioned to direct working fluid toward a desired location on a lower surface of said chamber.

4. The heat dissipation device of claim 1, further including at least one depression in a lower surface of said chamber.