Mounting film bulk acoustic resonators in microwave packages using flip chip bonding technology

• US 6,550,664 B2
• Filed: 12/09/2000
• Issued: 04/22/2003
• Est. Priority Date: 12/09/2000
• Status: Active Grant

• Current Assignee: Avago Technologies International Sales Pte Limited (Broadcom, Inc.)
• Original Assignee: Agilent Technologies, Inc.
• Inventors: Ruby, Richard C., Bradley, Paul, Larson, John D. III
• Primary Examiner(s): Dunn, Tom
• Assistant Examiner(s): EDMONDSON, LYNNE RENEE
• Application Number:
  US09/733,704
• Publication Number:
  US 20020070262A1
• Time in Patent Office: 864 Days
• Field of Search: 228/179.1, 228/180.22, 333/186-192, 333/193, 29/253.5, 310/346, 310/322, 438/118
• US Class Current: 228/179.1
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H03H 9/1014 the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the BAW device
• CPC Class Codes: Y10T 29/42 Piezoelectric device making

Abstract

A device includes a die that contains a filter circuit. The filter is implemented using film bulk acoustic resonators. A package contains the die. The package includes a base portion. Signal paths are incorporated in the base portion. Solder joints attach the die to the base portion. The solder joints electrically connect pads on the die to the signal paths in the base portion. The solder joints do not include, and are used instead of, wire bonds.

Claims

1. A device comprising:

a die that contains a filter circuit, the filter circuit being implemented using film bulk acoustic resonators;

a package that contains the die, the package including a base layer, signal paths being incorporated in the base layer; and

,

solder joints that attach the die directly to the base layer, the solder joints electrically connecting pads on the die to the signal paths in the base layer, wherein the solder joints do not include, and are used instead of, wire bonds.

2. A device as in claim 1 wherein the package is comprised of ceramic material.

3. A device as in claim 2 wherein the package is hermetically sealed.

4. A device as in claim 1 wherein the package is hermetically sealed.

5. A method comprising the following steps:

(a) fabricating a filter circuit within a die, the filter being implemented using film bulk acoustic resonators; and

,

(b) placing the die within a package, including the following substep;

(b.1) attaching the die to directly to a base layer of the package using solder joints, the solder joints electrically connecting pads on the die to signal paths in the base layer, wherein the solder joints do not include, and are used instead of, wire bonds.

6. A method as in claim 5 wherein step (b) additionally includes the following substep:

(b.2) hermetically sealing the die within the package.

7. A method as in claim 6 wherein in step (b) the package is comprised of ceramic material.

8. A method as in claim 5 wherein in step (b) the package is comprised of ceramic material.

9. A method comprising the following steps:

(a) fabricating a filter circuit within a die, the filter being implemented using film bulk acoustic resonators; and

,

(b) placing the die within a package using flip-chip bonding, including the following substep;

(b.1) attaching the die directly to a base layer of the package using solder joints, the solder joints electrically connecting pads on the die to signal paths in the base layer.

10. A method as in claim 9 additionally comprising the following step:

(c) hermetically sealing the die within the package.

11. A method as in claim 10 wherein in step (b) the package is comprised of ceramic material.

12. A method as in claim 9 wherein in step (b) the package is comprised of ceramic material.