Process for manufacturing a semiconductor material wafer comprising single-Crystal regions separated by insulating material regions
First Claim
1. A process for manufacturing a wafer of semiconductor material, comprising:
- carrying out a directional etching in a semiconductor material body to form trenches having a first width;
carrying out an isotropic etching of said trenches of said semiconductor material body under said trenches to form cavities having a second width larger than the first width;
covering said walls of said cavities with dielectric material;
depositing insulating material to at least partially fill said cavities so as to form a single-crystal island separated from said semiconductor material body.
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Abstract
A process including the steps of: carrying out a directional etching in a semiconductor material body to form trenches having a first width; carrying out an isotropic etching of the semiconductor material body under the trenches to form cavities having a width larger than the trenches; covering the walls of the cavities with dielectric material; depositing non-conducting material different from thermal oxide to fill the cavities at least partially, so as to form a single-crystal island separated from the rest of the semiconductor material body. The isotropic etching permits the formation of at least two adjacent cavities separated by a support region of semiconductor material, which is oxidized together with the walls of the cavities to provide a support to the island prior to filling with non-conducting material.
50 Citations
30 Claims
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1. A process for manufacturing a wafer of semiconductor material, comprising:
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carrying out a directional etching in a semiconductor material body to form trenches having a first width;
carrying out an isotropic etching of said trenches of said semiconductor material body under said trenches to form cavities having a second width larger than the first width;
covering said walls of said cavities with dielectric material;
depositing insulating material to at least partially fill said cavities so as to form a single-crystal island separated from said semiconductor material body. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17)
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- 18. A wafer of semiconductor material, comprising a semiconductor material body surrounding an insulating structure of non-conducting material, an island surrounded by said insulating structure and a support structure for said island, arranged laterally to or under said island, between said island and said semiconductor material body.
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23. An integrated power device, comprising a semiconductor material body surrounding an insulating structure of non-conducting material, and an island surrounded by said insulating structure;
- said semiconductor material body housing a vertical-current-flow power transistor including a buried conduction region and said island housing a low-voltage device, said buried conduction region arranged under said island and said insulating structure.
- View Dependent Claims (24)
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25. A process for manufacturing integrated circuits, comprising:
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forming in a semiconductor material body a single-crystal island separated from the semiconductor material body with non-conductive material other than thermal oxide. - View Dependent Claims (26, 27, 28, 29, 30)
directionally etching the semiconductor material body to form one or more trenches; and
isotropically etching through the trenches the semiconductor material body to form cavities under the trenches, the cavities having a width greater than the width of the trenches.
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28. The process of claim 27, further comprising covering the walls of the one or more cavities with a dielectric material.
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29. The process of claim 27 wherein forming one or more cavities comprises forming at least two adjacent cavities separated by a wall that supports the single-crystal island in the semiconductor material body.
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30. The process of claim 25 wherein forming the single-crystal island further comprises forming at least one end support region of dielectric material extending between the semiconductor material body and the single-crystal island transversely and adjacent to the single crystal island.
Specification