Semiconductor device with selectively diffused regions
First Claim
1. A semiconductor device comprising:
- a semiconducting substrate in the shape of a slice, a first and a second doped region in one major surface of the semiconductor substrate, the first doping region having a higher surface dopant concentration than the second doped region; and
a metal contact pattern substantially in alignment with said first doped region, wherein the surface dopant concentration of said second doped region increases with distance from within said second doped region towards said first doped region the increasing gradient in the surface concentration of the dopant facilitating carrier transport towards the metal contact pattern substantially along the length of the second doped region.
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Abstract
The present invention describes a method of manufacturing a semiconductor device, comprising a semiconductor substrate (2) in the shape of a slice, the method comprising the steps of: step 1) selectively applying a pattern of a solids-based dopant source to a first major surface of said semiconducting substrate (2); step 2) diffusing the dopant atoms from said solids-based dopant source into said substrate (2) by a controlled heat treatment step in a gaseous environment surrounding said semi-conducting substrate (2), the dopant from said solids-based dopant source diffusing directly into said substrate (2) to form a first diffusion region (12) and, at the time, diffusing said dopant from said solids-based dopant source indirectly via said gaseous environment into said substrate (2) to form a second diffusion region (15) in at least some areas of said substrate (2) not covered by said pattern; and step 3) forming a metal contact pattern (20) substantially in alignment with said first diffusion region (12) without having etched said second diffusion region (15) substantially.
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13 Claims
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1. A semiconductor device comprising:
a semiconducting substrate in the shape of a slice, a first and a second doped region in one major surface of the semiconductor substrate, the first doping region having a higher surface dopant concentration than the second doped region; and
a metal contact pattern substantially in alignment with said first doped region, wherein the surface dopant concentration of said second doped region increases with distance from within said second doped region towards said first doped region the increasing gradient in the surface concentration of the dopant facilitating carrier transport towards the metal contact pattern substantially along the length of the second doped region.- View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13)
Specification