Data carrier with an integrated electronic component and with a transmission coil which comprises turn portions arranged directly against said component

• US 6,552,422 B1
• Filed: 08/28/2000
• Issued: 04/22/2003
• Est. Priority Date: 08/31/1999
• Status: Expired due to Term

• Current Assignee: Xenogenic Development Limited Liability Company (Intellectual Ventures LLC)
• Original Assignee: Koninklijke Philips Electronics N.V. (Koninklijke Philips N.V.)
• Inventors: Schober, Joachim Heinz
• Primary Examiner(s): Williams, Alexander O.
• Application Number:
  US09/649,673
• Time in Patent Office: 967 Days
• Field of Search: 257/679, 257/662-664, 257/691, 361/767, 235/492, 235/487, 235/488, 235/449, 235/451, 235/384
• US Class Current: 257/679
• CPC Class Codes: G06K 19/07749 the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
• CPC Class Codes: G06K 19/0775 arrangements for connecting the integrated circuit to the antenna
• CPC Class Codes: G06K 19/07775 the antenna being on-chip
• CPC Class Codes: G06K 19/07779 the inductive antenna being a coil
• CPC Class Codes: G06K 19/07783 the coil being planar
• CPC Class Codes: H01L 2224/05553 being rectangular
• CPC Class Codes: H01L 2224/05554 being square
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/49171 Fan-out arrangements
• CPC Class Codes: H01L 24/06 of a plurality of bonding areas
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/01005 Boron [B]
• CPC Class Codes: H01L 2924/01013 Aluminum [Al]
• CPC Class Codes: H01L 2924/01033 Arsenic [As]
• CPC Class Codes: H01L 2924/01046 Palladium [Pd]
• CPC Class Codes: H01L 2924/0105 Tin [Sn]
• CPC Class Codes: H01L 2924/01079 Gold [Au]
• CPC Class Codes: H01L 2924/01082 Lead [Pb]
• CPC Class Codes: H01L 2924/14 Integrated circuits
• CPC Class Codes: H01L 2924/181 Encapsulation

Abstract

In a data carrier (1) with an integrated electronic component (3) and with a transmission coil (12), short turn portions (21, 22, 23, 24, and 25) of the transmission coil (12) are formed by connection lines which are provided on the integrated electronic component (3) in the area of a component surface (4) of the integrated electronic component (3) and which are preferably formed by conductor tracks.

Claims

1. A data carrier, comprising:

a carrier body;

an integrated electronic component accommodated on said carrier body, said integrated electronic component including

a component surface defining a first component corner and a second component corner diagonally opposing said first component corner,

a first connection contact in a region of said first component corner,

a second connection contact in a region of said second component corner, wherein a distance between said first connection contact and said second connection contact is maximized, and

one or more connection lines in an area of said component surface between said first connection contact and said second connection contact; and

a transmission coil accommodated on said carrier body, said transmission coil including

a first coil contact electrically interconnected to said first connection contact,

a second coil contact electrically interconnected to said second connection contact, and

a plurality of turn portions electrically interconnected to said first coil contact, said second coil contact, and said one or more connection lines.

2. The data carrier of claim 1, further comprising:

a module including

a component carrier having a carrier surface accommodating said integrated electronic component, and

a plurality of intermediate contacts and bond wires electrically interconnecting said first coil contact to said first connection contact, said second coil to said second connection contact, and said plurality of turn portions to said one or more connection lines.

3. The data carrier of claim 2,

wherein said carrier surface defines a first carrier corner and a second carrier corner diagonally opposing said first carrier corner;

wherein a first bond wire electrically interconnects a first intermediate contact in a region of said first carrier corner to said first connection contact; and

wherein a second bond wire electrically interconnects a second intermediate contact in a region of said second carrier corner to said second connection contact.

4. A data carrier, comprising:

a carrier body;

an integrated electronic component accommodated on said carrier body, said integrated electronic component including

a component surface defining a first component corner and a second component corner diagonally opposing said first component corner,

a first connection contact in a region of said first component corner,

a second connection contact in a region of said second component corner, wherein a distance between said first connection contact and said second connection contact is maximized, and

one or more connection lines in an area of said component surface between said first connection contact and said second connection contact, said one or more connection lines being unconnected to said first connection contact and said second connection contact; and

a transmission coil accommodated on said carrier body, said transmission coil including

a first coil contact electrically interconnected to said first connection contact,

a second coil contact electrically interconnected to said second connection contact,

a plurality of turn portions electrically interconnected to said first coil contact, said second coil contact, and said one or more connection lines.

5. The data carrier of claim 4, further comprising:

a module including

a component carrier having a carrier surface accommodating said integrated electronic component, and

a plurality of intermediate contacts and bond wires electrically interconnecting said first coil contact to said first connection contact, said second coil to said second connection contact, and said plurality of turn portions to said one or more connection lines.

6. The data carrier of claim 5,

wherein said carrier surface defines a first carrier corner and a second carrier corner diagonally opposing said first carrier corner;

wherein a first bond wire electrically interconnects a first intermediate contact in a region of said first carrier corner to said first connection contact; and

wherein a second bond wire electrically interconnects a second intermediate contact in a region of said second carrier corner to said second connection contact.

7. A data carrier, comprising:

a carrier body;

an integrated electronic component accommodated on said carrier body, said integrated electronic component including

a component surface defining a first component corner and a second component corner diagonally opposing said first component corner,

a first connection contact in a region of said first component corner,

a second connection contact in a region of said second component corner, wherein a distance between said first connection contact and said second connection contact is maximized, and

one or more connection lines in an area of said component surface between said first connection contact and said second connection contact; and

a transmission coil accommodated on said carrier body, said transmission coil including

a first coil contact having a portion beneath and electrically interconnected to said first connection contact,

a second coil contact having a portion beneath and electrically interconnected to said second connection contact,

a plurality of turn portions electrically interconnected to said first coil contact, said second coil contact, and said one or more connection lines.

8. The data carrier of claim 7, wherein said one or more connection lines are unconnected to said first connection contact and said second connection contact.

9. The data carrier of claim 7, further comprising:

a module including

a component carrier having a carrier surface accommodating said integrated electronic component, and

a plurality of intermediate contacts and bond wires electrically interconnecting said first coil contact to said first connection contact, said second coil to said second connection contact, and said plurality of turn portions to said one or more connection lines 4.1.

10. The data carrier of claim 9,

wherein said carrier surface defines a first carrier corner and a second carrier corner diagonally opposing said first carrier corner;

wherein a first bond wire electrically interconnects a first intermediate contact in a region of said first carrier corner to said first connection contact; and

wherein a second bond wire electrically interconnects a second intermediate contact in a region of said second carrier corner to said second connection contact.