Multi-piezoelectric layer ultrasonic transducer for medical imaging

• US 6,552,471 B1
• Filed: 01/27/2000
• Issued: 04/22/2003
• Est. Priority Date: 01/28/1999
• Status: Expired due to Fees

• Current Assignee: Parallel Design, Inc (GE Aerospace)
• Original Assignee: Parallel Design, Inc (GE Aerospace)
• Inventors: Chartrand, David, Chandran, Sanjay
• Primary Examiner(s): Dougherty, Thomas M.
• Application Number:
  US09/492,430
• Time in Patent Office: 1,181 Days
• Field of Search: 310/328, 310/331, 310/332, 310/365, 310/366, 310/334
• US Class Current: 310/328
• CPC Class Codes: B06B 1/0611 in a pile
• CPC Class Codes: H10N 30/057 by stacking bulk piezoelectric or electrostrictive bodies and electrodes
• CPC Class Codes: H10N 30/871 Single-layered electrodes of multilayer piezoelectric or electrostrictive devices, e.g. internal electrodes
• CPC Class Codes: H10N 30/875 Further connection or lead arrangements, e.g. flexible wiring boards, terminal pins
• CPC Class Codes: Y10T 29/42 Piezoelectric device making
• CPC Class Codes: Y10T 29/49005 Acoustic transducer
• CPC Class Codes: Y10T 29/49155 Manufacturing circuit on or in base
• CPC Class Codes: Y10T 29/49156 with selective destruction of conductive paths

Abstract

A transducer is tuned to a desired impedance by building piezoelectric assemblies of multiple layers, each layer acting as a parallel capacitor. Piezoelectric layers are preferably constructed by plating or otherwise placing a conducting perimeter around a piezoelectric substrate. Gaps are suitably formed in the conducting layer by dicing or otherwise to form distinct electrical conducting regions on each layer. Piezoelectric layers are then suitably placed such that positive and negative conducting regions on each layer contact positive and negative regions on other layers. Layers are suitably joined by epoxy or by any other joining technique.

Claims

1. A piezoelectric assembly for an ultrasonic transducer, the assembly comprising:

a first piezo layer comprising a first substrate having a first conductive coating covering the perimeter of said first substrate, said first conductive coating having a first electrode and a second electrode electrically isolated from each other by first and second cuts in said first conductive coating; and

a second piezo layer disposed adjacent to said first piezo layer, the second piezo layer comprising a second substrate having a second conductive coating covering the perimeter of said second substrate, said second conductive coating having a third electrode and a fourth electrode electrically isolated from each other by third and fourth cuts in said second conductive coating; and

wherein said first and second piezo layers are affixed together with an adhesive such that said first electrode and said third electrode form a first electrical node and said second and fourth electrodes form a second electrical node, said first and second electrical nodes defining first and second capacitors across said first and second substrates such that the total impedance of said piezoelectric assembly is less than the impedance of said first piezo layer.

2. The piezoelectric substrate of claim 1 wherein said first substrate and said second substrate comprise fired ceramic.

3. A multilayered piezoelectric transducer assembly comprising:

a first piezoelectric layer having a first electrode, a second electrode and a first dielectric material disposed therebetween, wherein said first and second electrodes are electrically isolated from each other by first and second cuts in a first conductive coating substantially covering the perimeter of said first dielectric material;

a second piezoelectric layer having a third electrode, a fourth electrode and a second dielectric material disposed therebetween, wherein said thirds and fourth electrodes are electrically isolated from each other by third and fourth cuts in a second conductive coating substantially covering the perimeter of said second dielectric material;

an adhesive bonding said first and second piezoelectric layers to each other such that said second cut aligns with said third cut such that said first and third electrodes form a first electrical node and such that said second and fourth electrodes form a second electrical node.

4. The piezoelectric transducer of claim 3 wherein said first and second dielectric layers comprise fired ceramic.

5. The piezoelectric transducer of claim 3 wherein said transducer has a total capacitance substantially equal to the sum of the capacitances of said first and second piezoelectric layers.

6. The piezoelectric transducer of claim 3 further comprising:

a third piezoelectric layer having a fifth electrode and a sixth electrode forming a third capacitor; and

a second adhesive bonding said third piezoelectric layer to said second piezoelectric layer such that said first, third and fifth electrodes are in electrical communication and such that said second, fourth and sixth electrodes are in electrical communication with each other.

7. The piezoelectric transducer of claim 6 wherein said transducer has a total capacitance substantially equal to the sum of the capacitances of said first, second and third piezoelectric layers.

8. The piezoelectric transducer of claim 4 further comprising:

a third piezoelectric layer having a fifth electrode and a sixth electrode forming a third capacitor; and

a second adhesive bonding said third piezoelectric layer to said second piezoelectric layer such that said first, third and fifth electrodes are in electrical communication and such that said second, fourth and sixth electrodes are in electrical communication with each other.

9. The piezoelectric transducer of claim 8 wherein said transducer has a total capacitance substantially equal to the sum of the capacitances of said first, second and third piezoelectric layers.

10. A piezoelectric assembly, the assembly comprising:

a first piezoelectric substrate substantially encompassed by a first coating, the first coating forming at least a first electrode and at least a second electrode thereon, the first electrode being electrically isolated from the second electrode;

a second piezoelectric substrate substantially encompassed by a second coating, the second coating forming at least a third electrode and at least a fourth electrode thereon, the third being electrically isolated from the fourth electrode;

the first piezoelectric substrate being adjacent to the second piezoelectric substrate, the second electrode being electrically influenced by the third electrode.

11. The assembly of claim 10, the first electrode being in opposite facing relationship with the fourth electrode.

12. The assembly of claim 11, the first electrode including a wrap-around end extending around a side of the first substrate.

13. The assembly of claim 12, the second electrode including a wrap-around end extending around a side of the second substrate.

14. The assembly of claim 13, the first coating and the second coating further comprising conductive material.

15. The assembly of claim 14, the first substrate being coupled to the second substrate.

16. The assembly of claim 15, the first substrate being coupled to the second substrate by an adhesive conductive bonding material.

17. The assembly of claim 16 further comprising at least a first lead in electrical communication with the first substrate, and at least a second lead in electrical communication with the second substrate.

18. The assembly of claim 12, the first lead being in the same planar surface as the second lead.

19. The assembly of claim 12 further comprising at least a third piezoelectric substrate substantially encompassed by a third coating, the third coating forming at least a fifth electrode and at least a sixth electrode thereon, the fifth electrode being electrically isolated from the sixth electrode, the third substrate being adjacent to the second substrate, the fourth electrode being in facing relationship with the fifth electrode.

20. The assembly of claim 19, the at least first electrode being in opposite facing relationship with the at least sixth electrode.

21. The assembly of claim 20, the at least fifth electrode including a wrap-around end extending around a side of the substrate.

22. The assembly of claim 20, the at least sixth electrode including a wrap-around end extending around a side of the substrate.

23. The assembly of claim 22, the first lead being in the same planar surface as the second lead.

24. A piezoelectric assembly comprising:

at least a first substrate substantially encompassed by a first coating, the first coating comprising a first front surface electrode and a first rear surface electrode;

at least a second substrate substantially encompassed by a second coating, the second coating comprising a second front surface electrode and a second rear surface electrode, the first rear surface electrode being in electrical communication with the second front surface electrode, the first front surface electrode being in electrical communication with the second rear surface electrode;

at least a first lead in electrical communication with the first front surface; and

at least a second lead in electrical communication with the first rear surface.

25. The assembly of claim 24, the at least first lead being in the same planar surface as the at least second lead.

26. The assembly of claim 25 further comprising backing material in communication with the first front surface electrode.

27. The assembly of claim 26 further comprising at least one acoustic matching layer in facing relationship with the second rear surface electrode.

28. A piezoelectric assembly comprising:

a first piezoelectric substrate having a first impedance, the first piezoelectric substrate substantially encompassed by a conductive first coating, the first coating forming a first electrode and a second electrode thereon, the first electrode being electrically isolated from the second electrode by a gap in the conductive coating;

a second piezoelectric substrate having a second impedance, the second substrate substantially encompassed by a second conductive coating, the second coating forming a third electrode and a fourth electrode thereon, the third electrode being electrically isolated from the fourth electrode by a second gap in the second conductive coating; and

the first piezoelectric substrate being coupled to the second piezoelectric substrate, the second electrode being electrically influenced by the third electrode, such that the total impedance of the first impedance and the second impedance is less than the first impedance.

29. The assembly of claim 28, the first substrate being coupled to the second substrate by an adhesive conductive bonding material.

30. The assembly of claim 29 further comprising at least a first lead in electrical communication with the first substrate, and at least a second lead in electrical communication with the second substrate.

31. The assembly of claim 30, the first lead being in the same planar surface as the second lead.

32. The assembly of claim 31 further comprising a third piezoelectric substrate having a third impedance, the third substrate substantially encompassed by a third conductive coating, the third coating forming a fifth electrode and a sixth electrode thereon, the fifth electrode being electrically isolated from the sixth electrode, the second piezoelectric substrate being coupled to the third piezoelectric substrate, the fourth electrode being electrically influenced by the fifth electrode, the total impedance of the first impedance, second impedance and third impedance being less than the first impedance.