Semiconductor device and fabrication method thereof

• US 6,552,694 B1
• Filed: 07/06/2000
• Issued: 04/22/2003
• Est. Priority Date: 07/13/1999
• Status: Expired due to Fees

• Current Assignee: Shinko Electric Industries Company Limited (Fujitsu Limited)
• Original Assignee: Shinko Electric Industries Company Limited (Fujitsu Limited)
• Inventors: Akagawa, Masatoshi, Fujii, Tomoharu, Higuchi, Tsutomu, Okamura, Shigeru
• Primary Examiner(s): Wong, Don
• Assistant Examiner(s): VANNUCCI, JAMES
• Application Number:
  US09/609,974
• Time in Patent Office: 1,020 Days
• Field of Search: 340/572, 340/539, 257/679, 257/778, 343/895, 343/732, 343/741, 343/742, 343/866, 343/867, 343/873
• US Class Current: 343/895
• CPC Class Codes: G06K 19/07749 the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
• CPC Class Codes: G06K 19/07775 the antenna being on-chip
• CPC Class Codes: G06K 19/07779 the inductive antenna being a coil
• CPC Class Codes: G06K 19/07783 the coil being planar
• CPC Class Codes: G06K 19/07784 the inductive antenna consisting of a plurality of coils stacked on top of one another
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01Q 1/2225 used in active tags, i.e. provided with its own power source or in passive tags, i.e. deriving power from RF signal
• CPC Class Codes: H01Q 7/00 Loop antennas with a substantially uniform current distribution around the loop and having a directional radiation pattern in a plane perpendicular to the plane of the loop

Abstract

A semiconductor device with an antenna including one or more antenna units for sending and receiving signals and a semiconductor element electrically connected to the antenna units, wherein the antenna units are formed by pressing or etching a thin metal sheet with substantially the same flat surface size as the semiconductor element, and the antenna units are integrally coupled to the surface of the semicondcutor element. The antenna units are formed in a plurality of layers separated by insulating layers, and the antenna units formed on the respective layers are connected electrically in series with each other.

Claims

1. A semiconductor device with an antenna, comprising:

one or more antenna units for sending and receiving signals and a semiconductor element electrically connected to said antenna units,

wherein said antenna units are formed with substantially a same flat surface size as said semiconductor element,

wherein each of said antenna units includes connecting terminals protruding from a lower surface thereof,

wherein said antenna units are integrally coupled to the surface of said semiconductor element by electrically connecting the connecting terminals of the antenna units with the semiconductor element,

wherein said semiconductor element surface defines an area, and

wherein the size of each of said antenna units is dimensioned to be received within the area.

2. A semiconductor device with an antenna according to claim 1,

wherein said antenna units are formed on said surface in a plurality of layers each separated by insulating layers, and in different planes, and the antenna units formed on said respective layers are electrically connected in series with each other and to said surface of the semiconductor element.

3. A semiconductor device with an antenna according to claim 1,

wherein an outer surface of said antenna is covered with a sealing resin.

4. A semiconductor device with an antenna according to claim 2,

wherein connecting terminals protruded toward the antenna unit of an adjacent layer are formed on one of the surfaces of said antenna units, and

wherein said antenna units are electrically connected with each other through said connecting terminals.

5. A semiconductor device with an antenna according to claim 4,

wherein said antenna units are electrically connected with each other by using an anisotropic conductive adhesive film or an anisotropic conductive adhesive.

6. A semiconductor device with an antenna according to claim 2, wherein the outer surface of said antenna is covered with a sealing resin.

7. The device according to claim 1, wherein the antenna units are formed by pressing a thin sheet of metal.

8. The device according to claim 1, wherein the antenna units are formed by etching a thin sheet of metal.

9. A semiconductor device with an antenna according to claim 1, wherein the semiconductor element includes electrode terminals protruding upwardly, and corresponding to the connecting terminals of the antenna units, and the antenna units and the semiconductor element are integrally coupled by contacting the connecting terminals with the corresponding electrode terminals of the semiconductor element.

10. A semiconductor device with an antenna according to claim 1, wherein the semiconductor element includes electrode terminals protruding upwardly, and corresponding to the connecting terminal of the antenna unit, and the antenna units and the semiconductor element are integrally coupled by contacting the connecting terminals of a first one of the antenna units with the connecting terminals of a second one of the antenna units, and contacting the connecting terminals of the second one of the antenna units with the corresponding electrode terminals of the semiconductor element.

11. The semiconductor device with an antenna according to claim 1, wherein the connecting terminals on the antenna units include a first connecting terminal found at an outer end of an outer peripheral portion of the antenna units, and a second connecting terminal found at the an end of an inner peripheral portion of the antenna unit.

12. A method of fabricating a semiconductor device with an antenna, comprising one or more antenna units for sending and receiving signals and a semiconductor element electrically connected with said antenna units,

comprising the steps of forming a plurality of semiconductor elements at predetermined positions on a semiconductor wafer, forming an antenna frame having a plurality of antenna units at positions corresponding to said predetermined positions, and setting said semiconductor wafer and said antenna frame in register with each other in opposed relation to each other in accordance with the positions of said semiconductor elements and said antenna units, coupling by connecting each of said semiconductor elements and the corresponding antenna units with each other electrically, and cutting off said semiconductor wafer and said antenna frame to profile of each of said semiconductor devices.

13. A method of fabricating a semiconductor device with an antenna according to claim 12,

wherein an outer surface of said antenna frame is covered with a sealing resin before said semiconductor wafer, having said antenna frame, is cut off to the profile of each of said semiconductor devices.

14. A method according to claim 12, wherein the antenna units are formed by etching a thin sheet of metal.

15. A method according to claim 12, wherein the antenna units are formed by pressing a thin sheet of metal.

16. A method of fabricating a semiconductor device with an antenna, comprising one or more antenna units for sending and receiving signals and a semiconductor element electrically connected with said antenna units,

comprising the steps of forming a plurality of semiconductor elements at predetermined positions on a semiconductor wafer, forming antenna frames, each of which has a plurality of antenna units at the positions corresponding to said predetermined positions, forming a multilayered member by integrating said antenna frames, each of which is separated by an adhesive film, and by connecting antenna units of said antenna frames electrically in series with each other, and setting said semiconductor wafer and said multilayered member in register with each other in an opposed relation to each other in accordance with the positions of said semiconductor elements and said antenna units, coupling by connecting each of said semiconductor elements and the corresponding antenna units with each other electrically, and cutting off said semiconductor wafer and said multilayered member to profile of each of said semiconductor devices.

17. A method of fabricating a semiconductor device with an antenna according to claim 16,

wherein said antenna units of said antenna frames, each of which is separated by an adhesive film, are electrically connected in series with each other through connecting terminals on a surface of said antenna unit formed into protrusions toward a surface of an adjacent antenna unit.

18. A method of fabricating a semiconductor device with an antenna according to claim 16,

wherein an outer surface of said antenna frame is covered with a sealing resin before said semiconductor wafer, having said antenna frame, is cut off to the profile of each of said semiconductor devices.

19. A method according to claim 16, wherein the antenna units are formed by pressing a thin sheet of metal.

20. A method according to claim 16, wherein the antenna units are formed by etching a thin sheet of metal.