Method for conducting sensor array-based rapid materials characterization

• US 6,553,318 B2
• Filed: 05/15/2001
• Issued: 04/22/2003
• Est. Priority Date: 12/11/1998
• Status: Expired due to Fees

• Current Assignee: Freeslate Inc. (Unchained Labs Inc.)
• Original Assignee: Symyx Technologies Incorporated (Dassault Systemes SA)
• Inventors: Mansky, Paul
• Primary Examiner(s): WACHSMAN, HAL D
• Application Number:
  US09/858,048
• Publication Number:
  US 20020028456A1
• Time in Patent Office: 707 Days
• Field of Search: 702/22-24, 702/27, 702/28, 702/19, 702/30-32, 702/57, 702/64, 702/65, 702/113, 702/115-119, 702/124, 702/126, 702/130, 702/136, 702/132-134, 702/183, 702/184, 702/189, 702/FOR.142, 702/FOR.143, 702/FOR.170, 702/FOR.171, 702/FOR-115, 702/FOR-103, 700/266, 700/269, 700/299, 700/300, 422/70, 422/89, 422/68.1, 422/88, 422/98, 422/50, 422/83, 422/90, 422/82.01, 422/82.12, 422/82.13, 422/82.05, 422/82.02, 422/82.03, 422/82.06, 422/61, 422/62, 422/67, 422/69, 422/81, 422/82.04, 422/76, 422/77, 422/51, 422/82.11, 436/149, 436/150, 436/806, 436/151, 436/157, 436/43, 435/287.1, 435/287.9, 435/288.7, 374/45, 374/50, 374/56, 374/142, 374/31, 374/32, 374/117, 374/10, 374/11, 205/775, 205/776.5, 205/787, 205/782.5, 204/400, 204/401, 204/406-410, 204/416, 204/298.11, 738/630.1, 738/631.1
• US Class Current: 702/22
• CPC Class Codes: B01J 19/0046 Sequential or parallel reactions, e.g. for the synthesis of polypeptides or polynucleotides; Apparatus and devices for combinatorial chemistry or for making molecular arrays synthesis methods per se C40B50/00
• CPC Class Codes: B01J 2219/00605 the compounds being directly bound or immobilised to solid supports
• CPC Class Codes: B01J 2219/00612 the surface being inorganic
• CPC Class Codes: B01J 2219/00621 by physical means, e.g. trenches, raised areas
• CPC Class Codes: B01J 2219/00637 by coating it with another layer
• CPC Class Codes: B01J 2219/00653 the compounds being bound to electrodes embedded in or on the solid supports
• CPC Class Codes: B01J 2219/00659 Two-dimensional arrays
• CPC Class Codes: B01J 2219/00707 separated from the reactor apparatus
• CPC Class Codes: B01J 2219/00745 Inorganic compounds
• CPC Class Codes: B01J 2219/00747 Catalysts
• CPC Class Codes: C40B 30/08 by measuring catalytic activity
• CPC Class Codes: C40B 40/18 Libraries containing only inorganic compounds or inorganic materials
• CPC Class Codes: G01N 25/005 by investigating specific heat
• CPC Class Codes: G01N 25/18 by investigating thermal conductivity by calorimetry G01N25/20; by measuring change of resistance of an electrically-heated body G01N27/18

Abstract

There is disclosed a material characterization method. The method may include any combination of several potential steps. According to one of the steps multiple material samples are applied to multiple sensors in an array of sensors. In another step, one or more of the sensors of the array are electrically contacted. In another step, electrical connections are formed between selected sensors and electronic test and measurement apparatus. In another step, electric signals are sent to and received from the sensors in the array wherein the signals correspond to thermal, electrical, mechanical or other properties of the material samples. Preferably, some of the equipment (e.g., the electrical connections) used in the method are standardized to allow equipment such as sensor arrays to be interchangeable with equipment such as the electronic test and measurement apparatus.

Claims

1. A method for characterizing a plurality of materials, comprising the steps of:

a) providing 5 to 400 sensors on a first array, each of said sensors being adapted for receiving a test sample of a material and each of said sensors being adapted for measuring a same first material property as each other sensor;

b) connecting said first array to an interconnection device associated with electronic test circuitry for electrical communication between said first array and said electronic test circuitry;

c) depositing a different individual material test sample onto each of said sensors,

d) routing an electrical input signal to each of said sensors having a material test sample thereon;

e) measuring a resulting electrical output signal from each of said sensors having a material test sample thereon;

f) correlating any difference between said electrical input signal and said electrical output signal with said same first material property being tested;

g)removing said first array;

h) repeating said steps (a)-(f), substituting a second array of 5 to 400 sensors for said first array, each of said sensors in said second array being adapted for receiving a test sample of a material and each of said sensors of said second array being adapted for measuring a same second material property as each other sensor by way of said interconnection device.

2. The method according to claim 1, wherein said first material property is chosen from a group consisting of heat capacity, specific heat, thermal conductivity and thermal stability.

3. The method according to claim 1, wherein said routing step (d) includes routing a signal with a multiplexer.

4. The method according to claim 1, wherein each of said material test samples is measured simultaneously relative to each other material test samples.

5. The method according to claim 1, wherein each of said material test samples is measured consecutively relative to each other material test samples.

6. The method according to claim 1, further comprising disposing of said first and second arrays after completion of said measuring step.

7. The method according to claim 1 wherein said routing step includes positioning a probe over one of said sensors and translating said probe for making electrical contact with a contact pad associated with said one of said sensors.

8. A method for characterizing a plurality of materials, comprising the steps of:

a) providing 5 to 400 sensors on a first array lithographically formed on a first substrate, each of said sensors being adapted for receiving a test sample of a material and each of said sensors being adapted for measuring common first material property or properties as each other sensor;

b) connecting said first array to an interconnection device associated with electronic test circuitry for electrical communication between said first array and said electronic test circuitry;

c) depositing a different individual material test sample onto each of said sensors;

d) routing an electrical input signal with a multiplexer to each of said sensors having a material test sample thereon;

e) measuring a resulting electrical output signal from each of said sensors having a material test sample thereon;

f) correlating any difference between said electrical input signal and said electrical output signal with said common first material property being tested;

g) removing said first array;

h) repeating said steps (a)-(f), substituting for said first array a second array of 5 to 400 sensors lithographically formed on a second substrate, each of said sensors in said second array being adapted for receiving a test sample of a material and each of said sensors being adapted for measuring common second material property or properties as each other sensor by way of said interconnection device.

9. The method according to claim 8, wherein said common first material property is chosen from a group consisting of heat capacity, specific heat, thermal conductivity and thermal stability.

10. The method according to claim 8, wherein each of said different individual material test samples is measured simultaneously relative to each other test sample.

11. The method according to claim 8, wherein each of said different individual material test samples is measured consecutively relative to each other test sample.

12. The method according to claim 8, further comprising disposing of said first and second arrays after completion of said measuring.

13. A method for characterizing a plurality of materials, comprising the steps of:

a) providing 5 to 400 sensors on a first array lithographically formed on a first substrate and having a first sensor contact pad format with a plurality of contact pads, each of said sensors being adapted for receiving a test sample of a material and each of said sensors being adapted for measuring common first material property or properties as each other sensor;

b) connecting said first array to a printed circuit board having electrical traces defined therein adapted for communicating with said plurality of contact pads of said sensors and for connecting to a multi-pin connector disposed near an edge of said printed circuit board;

c) connecting said printed circuit board via said multi-pin connector to an interconnection device associated with electronic test circuitry for electrical communication between said first array and said electronic test circuitry;

d) depositing a material test sample onto each of said sensors with an automated dispenser;

e) routing an electrical input signal with a multiplexer to each of said sensors having a material test sample thereon;

f) measuring a resulting electrical output signal from each of said sensors having a material test sample thereon;

g) correlating with a computer any difference between said electrical input signal and said electrical output signal with said common first material property being tested;

h) removing said first array and disposing of said first array;

i) repeating said steps (a)-(h), substituting for said first array a second array of 5 to 400 sensors lithographically formed on a second substrate and having a second sensor contact pad format, with a plurality of contact pads, which is the same as said first sensor contact pad format, each of said sensors in said second array being adapted for receiving a test sample of a material and each of said sensors being adapted for measuring common second material property or properties as each other sensor by way of said interconnection device.

14. The method according to claim 13 wherein said plurality of contact pads of said first and second contact pad formats are remotely disposed relative to said sensors for connection between said first and second arrays and said printed circuit board along an edge of said first and second arrays.

15. The method according to claim 13, wherein each of said material test samples is measured simultaneously relative to each other material test samples.

16. The method according to claim 15, wherein each of said material test samples is a liquid.

17. The method according to claim 13, wherein each of said material test samples is measured consecutively relative to each other material test samples.

18. The method according to claim 13, wherein each of said material test samples is deposited to form solid state samples.

19. The method according to claim 13, wherein said sensors are adapted for receiving a material sample on a support that is about 0.1 to 25 micrometers thick.

20. The method according to claim 19, wherein said sensors are coated.