Smart card with replaceable chip

• US 6,554,193 B1
• Filed: 11/01/2000
• Issued: 04/29/2003
• Est. Priority Date: 08/31/1998
• Status: Expired due to Term

• Current Assignee: Comdata SPA (NHI-2, LLC)
• Original Assignee: The Standard Register Company (Middleby Corporation)
• Inventors: Wilkinson, Patrick Fitzgerald, Hileman, Martin H., Fehrman, R. David, Thaxton, Daniel David
• Primary Examiner(s): Frech, Karl D.
• Application Number:
  US09/704,105
• Time in Patent Office: 909 Days
• Field of Search: 235/488, 235/492, 235/487, 235/441, 902/26, 902/41, 361/737, 361/761
• US Class Current: 235/488
• CPC Class Codes: G06K 19/077 Constructional details, e.g. mounting of circuits in the carrier
• CPC Class Codes: G06K 19/07739 comprising a first part capable of functioning as a record carrier on its own and a second part being only functional as a form factor changing part, e.g. SIM cards type ID 0001, removably attached to a regular smart card form factor
• CPC Class Codes: G06K 19/07743 External electrical contacts

Abstract

A smart card is provided having a removable integrated circuit. The integrated circuit is mounted on a semiconductor chip assembly which is locked within the smart card. The semiconductor chip assembly is configured so that once it is locked in place, it may only be removed with a special tool. The special tool allows the locking mechanisms holding the semiconductor chip assembly within the smart card to be disengaged. Attempts to remove the semiconductor chip assembly without the special tool may result in damage to one or both of the semiconductor chip assembly and the smart card. The semiconductor chip assembly may be mounted through the side of the smart card or through one of the faces. A security label applied to the smart card and the semiconductor chip assembly provides additional security with a visual indication of tampering with the semiconductor chip assembly.

Claims

1. A card comprising:

a card body having a face, an edge, and a cut-out portion extending at least partially through said face, said cut-out portion intersecting at least a portion of said edge defining an opening in said edge; and

a semiconductor chip assembly having a semiconductor device positioned thereon, said semiconductor chip assembly being insertable within said cut-out portion through said opening such that at least a portion of said semiconductor chip assembly defines a portion of the card body periphery, wherein said card body includes a first locking member within said cut-out portion and wherein said semiconductor chip assembly includes a corresponding second locking member such that said semiconductor chip assembly is locked within said cut-out portion of said card body as said first locking member engages said second locking member.

2. The card of claim 1, wherein:

said semiconductor chip assembly further comprises first and second projections extending along opposing sides thereof; and

,

said card body further comprises first and second grooves formed on opposing sides of said cut-out portion arranged such that upon inserting said semiconductor chip assembly within said cut-out portion, said first and second projections engage corresponding ones of said first and second grooves.

3. The card of claim 1, wherein:

said card body further comprises first and second projections formed on opposing sides of said cut-out portion; and

,

said semiconductor chip assembly further comprises first and second grooves extending along opposing sides thereof and arranged such that upon inserting said semiconductor chip assembly within said cut-out portion, said first and second projections engage corresponding ones of said first and second grooves.

4. The card of claim 1, further comprising a security label, said security label being placed over a portion of said card body and a portion of said semiconductor chip assembly thereby providing an indication of tampering with said semiconductor chip assembly.

5. The card of claim 4, wherein said security label comprises a frangible layer.

6. The card of claim 4, wherein said security label comprises a holographic layer.

7. The card of claim 4, wherein said security label extends across a top face and a bottom face of said card body.

8. The card of claim 4, wherein said security label extends across said side of said card body.

9. The card of claim 1, wherein a top surface of said semiconductor chip assembly is substantially coplanar with a top face of said card body.

10. The card of claim 1, wherein said first and second locking members comprise opposing hooks which engage one another as said semiconductor chip assembly is slid into place.

11. The card of claim 1, wherein said card body further comprises a laminate formed on a back face thereof covering at least part of said cut-out portion.

12. A card comprising:

a card body having;

a front face;

a back face;

an edge;

a cut-out portion extending at least partially through said front face intersecting at least a portion of said edge defining an opening in said edge; and

a laminate formed on said back face covering said cut-out portion

a semiconductor chip assembly having a semiconductor device positioned thereon, said semiconductor chip assembly being insertable within said cut-out portion through said opening such that at least a portion of said semiconductor chip assembly defines a portion of the card body periphery.

13. The card of claim 12, wherein:

said semiconductor chip assembly further comprises first and second projections extending along opposing sides thereof; and

,

said card body further comprises first and second grooves formed on opposing sides of said cut-out portion arranged such that upon inserting said semiconductor chip assembly within said cut-out portion, said first and second projections engage corresponding ones of said first and second grooves.

14. The card of claim 12, wherein:

said card body further comprises first and second projections formed on opposing sides of said cut-out portion; and

,

said semiconductor chip assembly further comprises first and second grooves extending along opposing sides thereof and arranged such that upon inserting said semiconductor chip assembly within said cut-out portion, said first and second projections engage corresponding ones of said first and second grooves.

15. The card of claim 12, wherein said card body includes a first locking member within said cut-out portion and wherein said semiconductor chip assembly includes a corresponding second locking member such that said semiconductor chip assembly is locked within said cut-out portion of said card body as said first locking member engages said second locking member.

16. The card of claim 15, wherein said first and second locking members comprise opposing hooks which engage one another as said semiconductor chip assembly is slid into place.

17. The card of claim 12, further comprising a security label, said security label being placed over a portion of said card body and a portion of said semiconductor chip assembly thereby providing an indication of tampering with said semiconductor chip assembly.

18. The card of claim 17, wherein said security label comprises a select one of a frangible layer and a holographic layer.

19. The card of claim 17, wherein said security label extends across a top face and a bottom face of said card body.

20. The card of claim 17, wherein said security label extends across said side of said card body.

21. The card of claim 12, wherein a top surface of said semiconductor chip assembly is substantially coplanar with a top face of said card body.

22. A method of forming a card comprising:

providing a card body;

forming a cut-out portion in a top face of said card body extending at least partially therethrough, said cut-out portion intersecting at least a portion of an edge of said card body defining an opening in said edge of said card body;

forming a first locking member within said cut-out portion;

providing a semiconductor chip assembly having a semiconductor device formed thereon;

forming a corresponding second locking member on said semiconductor chip assembly; and

sliding said semiconductor chip assembly into said cut-out portion through said opening such at least a portion of said semiconductor chip assembly defines a portion of the card body periphery and said semiconductor chip assembly is locked within said cut-out portion of said card body as said first locking member engages said second locking member.

23. The method of claim 22, wherein said step of providing a semiconductor chip assembly comprises the step of forming first and second projections extending along opposing sides of said semiconductor chip assembly, and wherein said step of forming a cut-out portion in said card body extending through a side thereof comprises the step of forming corresponding first and second grooves on opposing sides of said cut-out portion, said first and second projections of said semiconductor chip assembly arranged to engage said corresponding first and second grooves.

24. The method of claim 22, wherein said step of forming a cut-out portion in said card body extending through a side thereof comprises the step of forming first and second projections extending along opposing sides of said cut-out portion, and wherein said step of providing a semiconductor chip assembly comprises the step of forming corresponding first and second grooves on opposing sides of said semiconductor chip assembly, said first and second projections of said card body arranged to engage said corresponding first and second grooves.

25. The method of claim 22, further comprising the step of applying a security label over a portion of said card body and a portion of said semiconductor chip assembly thereby providing an indication of tampering with said semiconductor chip assembly.

26. The method of claim 25, wherein said security label extends across said top face and a bottom face of said card body.

27. The method of claim 25, wherein said security label extends across said side of said card body.

28. The method of claim 22, wherein said step of forming a cut-out portion in said card body is performed by injection molding of said card body.

29. The method of claim 22, wherein said step of forming a cut-out portion in said card body is performed by milling said card body.

30. The method of claim 22, wherein said step of forming a cut-out portion in said card body comprises the step of punching out said cut-out portion in said card body.

31. A card comprising:

a card body having;

a cut-out portion extending partially through said card body, said cut-out portion intersecting at least a portion of an edge of said card body defining an opening in said edge of said card body;

a first locking member within said cut-out portion; and

,

first and second grooves formed on opposing sides of said cut-out portion; and

,

a semiconductor chip assembly having;

a semiconductor device positioned thereon;

a corresponding second locking member; and

,

first and second projections extending along opposing sides thereof;

wherein said semiconductor chip assembly is insertable within said cut-out portion through said opening such that said first and second projections engage corresponding ones of said first and second grooves, and said first locking member engages said second locking member.

32. A card comprising:

a card body having a cut-out portion extending entirely through said card body, said cut-out portion intersecting at least a portion of an edge of said card body defining an opening in said edge of said card body;

a laminate formed on a back face of said card body;

a semiconductor chip assembly having a semiconductor device positioned thereon, wherein said semiconductor chip assembly is insertable within said cut-out portion through said opening such that at least a portion of said semiconductor chip assembly defines a portion of the card body periphery.

33. The card of claim 32, wherein:

said semiconductor chip assembly further comprises first and second projections extending along opposing sides thereof; and

,

said card body further comprises first and second grooves formed on opposing sides of said cut-out portion arranged such that upon inserting said semiconductor chip assembly within said cut-out portion, said first and second projections engage corresponding ones of said first and second grooves.

34. The card of claim 32, wherein:

said card body further comprises first and second projections formed on opposing sides of said cut-out portion; and

,

said semiconductor chip assembly further comprises first and second grooves extending along opposing sides thereof and arranged such that upon inserting said semiconductor chip assembly within said cut-out portion, said first and second projections engage corresponding ones of said first and second grooves.

35. The card of claim 32, wherein said card body includes a first locking member within said cut-out portion and wherein said semiconductor chip assembly includes a corresponding second locking member such that said semiconductor chip assembly is locked within said cut-out portion of said card body as said first locking member engages said second locking member.

36. The card of claim 35, wherein said first and second locking members comprise opposing hooks which engage one another as said semiconductor chip assembly is slid into place.

37. The card of claim 32, further comprising a security label, said security label being placed over a portion of said card body and a portion of said semiconductor chip assembly thereby providing an indication of tampering with said semiconductor chip assembly.