Pre-plate treating system
First Claim
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1. A method of electroplating a substrate comprising:
- providing a solution comprising from about 0.0003% to about 30% of a film forming amine and sufficient acid to produce a pH of less than about 6.5;
coating at least a portion of the substrate with the solution, thereby forming a film on the substrate, wherein said film inhibits oxidation of said substrate; and
plating the substrate.
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Abstract
The invention relates in general to a method of electroplating substrates where at least a portion of the substrate is coated with a solution containing a film forming amine and sufficient acid to produce a pH of less than 6.5. The acid helps to clean the surface of the substrate, and the film forming amine forms a film on the surface of the substrate. Electroplating proceeds with greatly improved speed and efficiency, especially in low current areas.
27 Citations
24 Claims
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1. A method of electroplating a substrate comprising:
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providing a solution comprising from about 0.0003% to about 30% of a film forming amine and sufficient acid to produce a pH of less than about 6.5;
coating at least a portion of the substrate with the solution, thereby forming a film on the substrate, wherein said film inhibits oxidation of said substrate; and
plating the substrate. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20)
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21. A method of electroplating a substrate comprising:
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providing a solution comprising from about 0.0003% to about 30% of a film forming amine and sufficient acid to produce a pH of less than about 6.5, the solution comprising hydrochloric acid;
coating at least a portion of the substrate with the solution, thereby forming a film on the substrate; and
plating the substrate. - View Dependent Claims (22, 23, 24)
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Specification