Method for collective production of magnetic heads with rounded bearing surface

• US 6,555,294 B1
• Filed: 01/29/2001
• Issued: 04/29/2003
• Est. Priority Date: 07/28/1998
• Status: Expired due to Fees

• Current Assignee: Commissariat a L'Energie Atomique (French Alternative Energies and Atomic Energy Commission)
• Original Assignee: Commissariat a L'Energie Atomique (French Alternative Energies and Atomic Energy Commission)
• Inventors: Albertini, Jean-Baptiste, Sibuet, Henri, Gaud, Pierre, Barrois, Gérard
• Primary Examiner(s): McPherson, John A.
• Assistant Examiner(s): Sagar, Kripa
• Application Number:
  US09/744,667
• Time in Patent Office: 820 Days
• Field of Search: 438/463, 438/460, 216/62, 216/65, 216/94, 638/940, 430/311
• US Class Current: 430/311
• CPC Class Codes: G11B 5/3103 Structure or manufacture of integrated heads or heads mechanically assembled and electrically connected to a support or housing
• CPC Class Codes: G11B 5/3106 where the integrated or assembled structure comprises means for conditioning against physical detrimental influence, e.g. wear, contamination G11B5/3133 takes precedence
• CPC Class Codes: G11B 5/3163 Fabrication methods or processes specially adapted for a particular head structure, e.g. using base layers for electroplating, using functional layers for masking, using energy or particle beams for shaping the structure or modifying the properties of the basic layers
• CPC Class Codes: Y10T 29/49046 with etching or machining of magnetic material

Abstract

A process for collectively making integrated magnetic heads with a bearing surface obtained by photolithography. According to the process, on a wafer is deposited a plurality of heads, a mask defining the profile of the bearing surfaces and the wafer is collectively engraved in the vicinity of the pole pieces of the heads. Such a process may find particular application to the making of magnetic heads.

Claims

1. A process for collectively making integrated magnetic heads, comprising:

forming on a wafer a plurality of components each including magnetic pole pieces separated by an air-gap,

collectively forming a rounded shape with at least one radius of curvature in the vicinity of the pole pieces of each component; and

separating the components into discrete magnetic head devices having the rounded shape as a bearing surface,

wherein the collectively forming step comprises at least one of masked photolithography and cutting by using a laser beam.

2. A process according to claim 1, wherein said collectively forming step comprises:

depositing on the wafer at least one mask including as many patterns as components on the wafer, each pattern having, opposite the pole pieces of each component, an edge of rounded shape; and

collectively forming the rounded shape by photolithography through the at least one mask.

3. A process according to claim 2, wherein each component includes as a front, said pole pieces, and, as a back, electrical connection jacks, said connection jacks being disengaged.

4. A process according to claim 2, wherein a first mask is deposited on a first face of the wafer and a first non-through photolithography is effected to give the components the rounded surface, then a second mask is deposited on a second face of the wafer and a second photolithography of the wafer is effected.

5. A process according to claim 4, wherein the second photolithography does not go through said wafer.

6. A process according to claim 1, wherein said collectively forming step comprises using a laser beam to cut the wafer, said laser beam being at least partially directed onto water and moved along a rounded path.

7. A process according to claim 6, wherein the laser beam is guided by a jet of liquid at high pressure.

8. A process according to claim 6, wherein a first non-through laser cutting is effected to give the components the rounded surface.

9. A process according to claim 6, wherein each component includes, as a front, said pole pieces, and, as a back, electrical connection jacks, said connection jacks being disengaged.

10. A process according to claim 1, wherein said photolithography or said laser cutting goes through said wafer.

11. A process according to claim 1, wherein the wafer includes a substrate supporting the plurality of components and a superstrate covering the components.

12. A process according to claim 11, wherein a grooving is effected in the superstrate which grooving comes into position above connection jacks of the magnetic heads.

13. A process according to claim 11, wherein the superstrate and/or the substrate is thinned before effecting the photolithography or the laser cutting.

14. A process for collectively making integrated magnetic heads comprising:

step for collectively forming a plurality of magnetic components on a wafer;

step for collectively forming a rounded shape bearing surface for each of the magnetic components; and

step for separating the plurality of magnetic components into discrete magnetic heads.