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Method of manufacturing a dual wafer tunneling gyroscope

  • US 6,555,404 B1
  • Filed: 08/01/2000
  • Issued: 04/29/2003
  • Est. Priority Date: 08/01/2000
  • Status: Expired due to Fees
First Claim
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1. A method of making a MEM tunneling gyroscope comprising the steps of:

  • (a) defining a cantilevered beam structure, first portions of at least two side drive electrodes and a mating structure on a first substrate or wafer;

    (b) forming at least one contact structure, second portions of said at least two side drive electrodes and a mating structure on a second substrate or wafer, the mating structure on the second substrate or wafer being of a complementary shape to the mating structure on the first substrate or wafer and the second portions of the side drive electrodes being of a complementary shape to the first portions of the side drive electrodes on the first substrate or wafer;

    (c) positioning the mating structure of the first substrate or wafer into a confronting relationship with the mating structure of the second substrate or wafer;

    (d) bonding a layer associated with said mating structure on the first substrate or. wafer with a layer associated with the mating structure on the second substrate or wafer;

    (e) bonding layers associated with said first portions of at least two side drive electrodes on the first substrate or wafer with layers associated with said second portions of at least two side drive electrodes on the second substrate or wafer;

    (f) removing at least a portion of the first substrate or wafer to release the cantilevered beam structure.

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