Method and device for protecting micro electromechanical system structures during dicing of a wafer
First Claim
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1. A method for protecting a MEMS structure during a dicing of a MEMS wafer to produce individual MEMS dies, comprising the steps of:
- (a) preparing a MEMS wafer having a plurality of MEMS structure sites thereon;
(b) mounting, upon the MEMS wafer, punched tape, the punched tape having holes in areas corresponding to locations of the MEMS structure sites on the MEMS wafer;
(c) mounting, upon the punched tape, a cover tape to produce a laminated MEMS wafer, the cover tape being without openings; and
(d) dicing the laminated MEMS wafer into a plurality of MEMS dies.
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Abstract
A wafer cap protects micro electromechanical system (“MEMS”) structures during a dicing of a MEMS wafer to produce individual MEMS dies. A MEMS wafer is prepared having a plurality of MEMS structure sites thereon. Upon the MEMS wafer, the wafer cap is mounted to produce a laminated MEMS wafer. The wafer cap is recessed in areas corresponding to locations of the MEMS structure sites on the MEMS wafer. The capped MEMS wafer can be diced into a plurality of MEMS dies without causing damage to or contaminating the MEMS die.
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Citations
20 Claims
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1. A method for protecting a MEMS structure during a dicing of a MEMS wafer to produce individual MEMS dies, comprising the steps of:
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(a) preparing a MEMS wafer having a plurality of MEMS structure sites thereon;
(b) mounting, upon the MEMS wafer, punched tape, the punched tape having holes in areas corresponding to locations of the MEMS structure sites on the MEMS wafer;
(c) mounting, upon the punched tape, a cover tape to produce a laminated MEMS wafer, the cover tape being without openings; and
(d) dicing the laminated MEMS wafer into a plurality of MEMS dies. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20)
(e) applying a contiguous tape on a backside of the MEMS wafer, the backside of the MEMS wafer being a side opposite of a side having the MEMS structure sites located thereon.
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12. The method as claimed in claim 11, wherein the contiguous tape is applied to a backside of the MEMS wafer after the cover tape is mounted on the MEMS wafer.
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13. The method as claimed in claim 11, wherein the contiguous tape is applied to a backside of the MEMS wafer before the cover tape is mounted on the MEMS wafer.
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14. The method as claimed in claim 1, wherein the laminated MEMS wafer is diced with a wafer saw with a cover tape side of the laminated MEMS wafer facing towards a cutting device of the wafer saw such that the wafer cap is sawn before the MEMS wafer.
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15. The method as claimed in claim 1, further comprising the step of:
(e) removing individual dies from the diced laminated MEMS wafer before the wafer cap is removed from the laminated MEMS wafer.
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16. The method as claimed in claim 1, further comprising the step of:
(e) mounting dies from the diced laminated MEMS wafer into a package before the wafer cap is removed from the laminated MEMS wafer.
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17. The method as claimed in claim 1, further comprising the step of:
(e) mounting dies from the diced laminated MEMS wafer into a package after the wafer cap is removed from the laminated MEMS wafer.
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18. The method as claimed in claim 1, wherein the cover tape comprises a static dissipative material.
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19. The method as claimed in claim 1, wherein the punched tape comprises a static dissipative material.
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20. The method as claimed in claim 11, wherein the contiguous tape comprises a static dissipative material.
Specification