Electrical interconnect between an articulating display and a PC based planar board

• US 6,555,745 B1
• Filed: 10/19/2001
• Issued: 04/29/2003
• Est. Priority Date: 10/19/2001
• Status: Active Grant

• Current Assignee: Medtronic Incorporated (Medtronic Plc)
• Original Assignee: Medtronic Incorporated (Medtronic Plc)
• Inventors: Kruse, John M., Kukson, Dean
• Primary Examiner(s): Reichard, Dean A.
• Assistant Examiner(s): OLIVA, CARMELO B
• Application Number:
  US10/053,048
• Publication Number:
  US 20030075349A1
• Time in Patent Office: 557 Days
• Field of Search: 174/35.C, 174/35.R, 174/36, 174/254, 439/67, 439/77, 439/493, 439/497, 361/816, 361/818
• US Class Current: 174/394
• CPC Class Codes: H01B 7/0838 Parallel wires, sandwiched between two insulating layers
• CPC Class Codes: H01B 7/0861 comprising one or more screens
• CPC Class Codes: H05K 1/0218 by printed shielding conductors, ground planes or power plane H05K1/0236 takes precedence
• CPC Class Codes: H05K 1/0393 Flexible materials H05K1/038 takes precedence; specific organic compositions are classified in H05K1/0313 and subgroups

Abstract

A flexible interconnect for electrically connecting a display unit to a data processing unit to facilitate transmission of low voltage differential signals and inhibit electromagnetic interference (EMI). The flexible interconnect includes a conductive layer extending along a plane and an upper and lower insulative layer above and below the conductive layer. The interconnect includes an upper and lower shield layer above and below the upper and lower insulative layer. The flexible interconnect layers form first and second opposing sides orthogonal to the plane of the conductive layer. The interconnect also includes at least two conductive shield members that face the first and second opposing sides of the flexible interconnect layers. The two conductive shield members electrically connect the upper and lower shield layer on each opposing side such that the conductive shield members and the shield layers inhibit EMI about the length of the flexible interconnect.

Claims

1. A flexible interconnect arrangement (FIA) adapted to transmit low voltage differential signals along a length of the FIA and inhibit electromagnetic radiation generated as the signals travel along the length of the FIA, the FIA comprising:

a conductive layer extending parallel to a plane along the length of the FIA, an upper insulative layer and a lower insulative layer respectively above and below the conductive layer, and an upper shield layer and lower shield layer respectively above and below the upper insulative layer and the lower insulative layer, said layers forming at least first and second opposing sides orthogonal to the plane of the conductive layer; and

at least two conductive shield members adapted to face the respective first and second opposing sides of said layers and to electrically connect the upper shield layer and the lower shield layer on each opposing side, respectively, wherein the conductive shield members and the shield layers are adapted to inhibit EMI about the length of the FIA.

2. The FIA of claim 1, wherein the conductive shield members are comprised of a plurality of sets of conductive vias adapted to be located along the length of the FIA.

3. The FIA of claim 1, wherein the upper shield layer is comprised of an ultra fine mesh.

4. The FIA of claim 3, wherein the ultra fine mesh is comprised of a silver etched screen.

5. The FIA of claim 1, wherein the lower shield layer is comprised of a grounding mesh plane.

6. The FIA of claim 5, wherein the grounding mesh plane is comprised of a copper material.

7. The FIA of claim 1, wherein the conductive layer is comprised of copper traces.

8. The FIA of claim 1, wherein the conductive layer and the upper shield layer are separated by at least two insulative layers having a combined thickness of less than 0.070 millimeters and exhibit an impedance of about 100 ohms.

9. The FIA of claim 1, further comprising a second upper insulative layer above the upper shield layer and a second lower insulative layer below the lower shield layer.

10. The FIA of claim 2, wherein the conductive vias have a spacing along the length of the FIA of about ¼

of the wavelength of the low voltage differential signals.

11. A data processing arrangement comprising:

a display unit;

a data processing unit; and

a flexible interconnect arrangement (FIA) adapted to be coupled between the display unit and the data processing unit and transmit low voltage differential signals to the display unit along a length of the flexible interconnect arrangement, wherein the flexible interconnect arrangement includes;

a conductive layer extending parallel to a plane along the length of the FIA, an upper insulative layer and a lower insulative layer respectively above and below the conductive layer, and an upper shield layer and lower shield layer respectively above and below the upper insulative layer and the lower insulative layer, said layers forming at least first and second opposing sides orthogonal to the plane of the conductive layer; and

at least two conductive shield members adapted to face the first and second opposing sides of said layers respectively and to electrically connect the upper shield layer and the lower shield layer on each opposing side, respectively, wherein the conductive shield members and the shield layers are adapted to inhibit EMI about the length of the FIA.

12. The data processing arrangement of claim 11, wherein the flexible interconnect arrangement further includes a portion adapted to be coupled to the display unit and enable an audio circuit and a touch screen circuit disposed in the display unit.

13. The data processing arrangement of claim 11, wherein the upper shield layer is comprised of an ultra fine conductive mesh adapted to provide a high radius of flexibility, therein alleviating the fatigue in the FIA caused by movement of the display unit.

14. The data processing arrangement of claim 11, wherein the conductive shield members include conductive vias have a spacing along the length of the FIA of about ¼

of the wavelength of the transmitted signals, wherein the conductive vias and the upper and lower shield layers form an EMI shield about the FIA.

15. The data processing arrangement of claim 13, wherein the lower shield layer is comprised of a copper mesh grounding plane.

16. The data processing arrangement of claim 11, wherein the data processing unit includes an implant programming unit.

17. A cable arrangement for use with a data processing arrangement comprising;

a first end adapted to be coupled to a display unit;

a second end adapted to be coupled to a data processing unit; and

a flexible interconnect arrangement (FIA) adapted to be coupled to the first and second ends and transmit low voltage differential signals along a length of the FIA, wherein the flexible interconnect arrangement includes;

a conductive layer extending along a plane in the direction of the length of the FIA, an upper insulative layer and a lower insulative layer respectively above and below the conductive layer, and an upper shield layer and lower shield layer above and below the upper insulative layer and the lower insulative layer, said layers forming at least first and second opposing sides orthogonal to the plane of the conductive layer; and

at least two conductive shield members adapted to face the first and second opposing sides of said layers and to electrically connect the upper shield layer and the lower shield layer on each opposing side, respectively, wherein the conductive shield members and the shield layers are adapted to inhibit EMI about the length of the FIA.

18. The cable arrangement of claim 17, wherein the conductive shield members of the FIA include conductive vias have a spacing along the length of the FIA of about ¼

of the wavelength of the low voltage differential signals, wherein the conductive vias and the upper and lower shield layers form an EMI shield about the FIA.

19. The cable arrangement of claim 17, wherein the upper shield layer of the FIA is comprised of an ultra fine conductive mesh.

20. The cable arrangement of claim 17, further comprising a second upper insulative layer above the upper shield layer and a second lower insulative layer below the lower shield layer of the FIA.