Electronic package having substrate with electrically conductive through holes filled with polymer and conductive composition

• US 6,555,762 B2
• Filed: 07/01/1999
• Issued: 04/29/2003
• Est. Priority Date: 07/01/1999
• Status: Expired due to Term

• Current Assignee: GlobalFoundries, Inc.
• Original Assignee: International Business Machines Corporation
• Inventors: Gelorme, Jeffrey D., Papathomas, Kostas, Purushothaman, Sampath, Markovich, Voya R., Kang, Sung Kwon, Appelt, Bernd K.
• Primary Examiner(s): Talbott, David L.
• Assistant Examiner(s): ALCALA, JOSE H
• Application Number:
  US09/345,428
• Publication Number:
  US 20030006066A1
• Time in Patent Office: 1,398 Days
• Field of Search: 174/253, 174/262, 174/264, 174/265, 174/261, 174/257, 174/258, 361/792, 361/793, 361/794, 361/795
• US Class Current: 174/264
• CPC Class Codes: H01B 1/02 mainly consisting of metals or alloys
• CPC Class Codes: H01B 1/22 the conductive material comprising metals or alloys
• CPC Class Codes: H01L 23/49827 Via connections through the substrates, e.g. pins going through the substrate, coaxial cables H01L23/49822, H01L23/49833, H01L23/4985, H01L23/49861 take precedence
• CPC Class Codes: H01L 23/49866 characterised by the materials materials of the substrates H01L23/14, of the lead-frames H01L23/49579
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H05K 1/095 for polymer thick films, i.e. having a permanent organic polymeric binder
• CPC Class Codes: H05K 3/4069 for via connections in organic insulating substrates
• CPC Class Codes: Y10T 428/12181 Composite powder [e.g., coated, etc.]
• CPC Class Codes: Y10T 428/2991 Coated
• CPC Class Codes: Y10T 428/2993 Silicic or refractory material containing [e.g., tungsten oxide, glass, cement, etc.]
• CPC Class Codes: Y10T 428/2998 including synthetic resin or polymer

Abstract

The present invention provides a unique, high density, electronic package having a conductive composition for filling vias or through holes to make reliable vertical or Z-connects from a dielectric layer to adjacent electrical circuits. The through holes may be plated or non-plated prior to filling. A description for making high density electronic packaging using this feature is also disclosed.

Claims

1. A microelectronic package, whose circuitry has a cross-section width of between 0.7 mil and 2.0 mil, said microelectronic package comprising:

a) a dielectric substrate having upper and lower lateral faces and at least one via being defined by a wall;

b) electronic circuitry and features affixed to at least one of said lateral surfaces, said circuitry having a cross-sectional width of between 0.7 mil and 2.0 mil; and

c) a composition comprising an interpenetrating network substantially filling said via, said network comprising a first matrix of cured thermosetting or thermoplastic material and a second matrix comprising an electrically conductive composition electrically connecting said via to said electronic circuitry.

2. The microelectronic package recited in claim 1 wherein said second matrix comprises a core-shell particle heating above the fusing point thereof.

3. The microelectronic package as recited in claim 1 further comprising a substantially homogeneous conductive layer disposed between said interpenetrating network composition and said wall.