Electronic component having a coil conductor with photosensitive conductive paste

• US 6,555,913 B1
• Filed: 07/08/1999
• Issued: 04/29/2003
• Est. Priority Date: 07/17/1998
• Status: Expired due to Term

• Current Assignee: Murata Manufacturing Co Limited
• Original Assignee: Murata Manufacturing Co Limited
• Inventors: Kawaguchi, Masahiko, Sasaki, Toshiya, Amaya, Keishiro, Tamezawa, Eita, Uchiyama, Kazuyoshi
• Primary Examiner(s): Eckert, II, George C.
• Assistant Examiner(s): Peralta, Ginette
• Application Number:
  US09/350,038
• Time in Patent Office: 1,391 Days
• Field of Search: 257/773, 257/748, 257/758, 257/775, 257/776, 257/786
• US Class Current: 257/773
• CPC Class Codes: H01F 17/0013 with stacked layers
• CPC Class Codes: H01F 41/043 by thick film techniques
• CPC Class Codes: H01L 27/08 including only semiconductor components of a single kind
• CPC Class Codes: H05K 1/092 Dispersed materials, e.g. conductive pastes or inks
• CPC Class Codes: H05K 1/165 incorporating printed inductors
• CPC Class Codes: H05K 3/02 in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
• CPC Class Codes: H05K 3/4664 Adding a circuit layer by thick film methods, e.g. printing techniques or by other techniques for making conductive patterns by using pastes, inks or powders H05K3/4647 takes precedence

Abstract

A small size electronic component has a small direct current resistance value of conductor pattern and minimal dimensional irregularity of a conductor pattern. In order to form such a component, a photosensitive conductive paste applied on a ceramic substrate and is then exposed through a photo mask and developed so as to form a lower conductor pattern layer of a coil conductor pattern. Then an insulating paste is applied on the ceramic substrate so as to cover the lower conductor pattern layer and the insulating paste is removed with a solvent until at least the upper surface of the lower conductor pattern layer is exposed so as to form an inter-line insulating layer. Furthermore, after applying a photosensitive conductive paste as a film, the exposure and development operation is conducted again while using the photo mask so as to form an upper conductor pattern layer on the lower conductor pattern layer.

Claims

1. An electronic component comprising:

an insulating substrate;

a conductor pattern having a lower conductor pattern layer disposed on the insulating substrate and an upper conductor pattern layer laminated on the lower conductor pattern layer;

wherein

a ratio of a thickness of the conductor pattern and a width of the conductor pattern is equal to or greater than about 1.

2. The electronic component according to claim 1, wherein the conductor pattern is a coil conductor pattern.

3. The electronic component according to claim 1, wherein the conductor pattern has a spiral shape.

4. The electronic component according to claim 1, wherein the conductor pattern has one of a meandering shape and a linear shape.

5. The electronic component according to claim 1, further comprising a plurality of the conductor patterns disposed on the substrate and including an inter-layer insulating layer provided between the plurality of conductor patterns.