High frequency circuit integrated-type antenna component

• US 6,556,169 B1
• Filed: 10/18/2000
• Issued: 04/29/2003
• Est. Priority Date: 10/22/1999
• Status: Expired due to Fees

• Current Assignee: Kyocera Corporation
• Original Assignee: Kyocera Corporation
• Inventors: Fukuura, Atsuomi, Sato, Akinori
• Primary Examiner(s): Wimer, Michael C.
• Application Number:
  US09/691,453
• Time in Patent Office: 923 Days
• Field of Search: H01/Q.138, 343/700.MS, 343/853, 343/767, 343/702
• US Class Current: 343/700.0MS
• CPC Class Codes: H01Q 1/38 formed by a conductive layer on an insulating support patch antennas H01Q9/0407; microstrip dipole antennas H01Q9/065; microstrip slot antennas H01Q13/106; transmission line microstrip antennas H01Q13/206; manufacturing reflecting surfaces using insulating material for supporting the reflecting surface H01Q15/142
• CPC Class Codes: H01Q 21/30 Combinations of separate antenna units operating in different wavebands and connected to a common feeder system
• CPC Class Codes: H01Q 23/00 Antennas with active circuits or circuit elements integrated within them or attached to them
• CPC Class Codes: H01Q 9/0407 Substantially flat resonant element parallel to ground plane, e.g. patch antenna dipole H01Q9/285; monopole H01Q9/40

Abstract

A high frequency circuit integrated-type antenna component including a dielectric board having a high frequency circuit formed on its surface or in its inner part, a grounding layer formed on a surface, where the high frequency circuit is not formed, of the dielectric board, an antenna element provided in or on the grounding layer, and a coupling circuit for signal transmission between the antenna element and the high frequency circuit. The high frequency circuit includes a demultiplexing circuit or a multiplexer, for example. The antenna element may be formed on an antenna board fixed to a grounding layer, and may be a slot antenna formed in the grounding layer.

Claims

1. A high frequency circuit integrated-type antenna component, comprising:

a dielectric board having two opposed surfaces and an inner part defining the portion of the board between the two opposed surfaces and having a high frequency circuit formed on one of the surfaces or in the inner part;

a grounding layer formed on a portion of one surface of the dielectric board where the high frequency circuit is not formed;

an antenna element provided in or on the grounding layer; and

coupling means for coupling the antenna element with the high frequency circuit for signal transmission therebetween,

wherein the high frequency circuit includes one or more circuits selected from the group consisting of a demultiplexer and a multiplexer.

2. The antenna component according to claim 1, wherein

the demultiplexing circuit and/or the multiplexer includes a directional coupling circuit and a ring resonance circuit.

3. The antenna component according to claim 1, wherein

the antenna element provided on the grounding layer includes a planar antenna element.

4. The antenna component according to claim 3, wherein

the planar antenna element includes a microstrip antenna.

5. The antenna component according to claim 1, wherein

the high frequency circuit includes a demultiplexing circuit, the demultiplexing circuit including a directional filtering circuit having a directional coupling circuit and a ring resonance circuit.

6. The antenna component according to claim 1, wherein

an antenna board having the antenna element provided on one surface of a dielectric board is integrally fixed to the grounding layer.

7. The antenna component according to claim 6, wherein

the grounding layer is formed on one of surfaces, a surface of the antenna board, or an antenna mounting surface of the dielectric board provided with the high frequency circuit.

8. The antenna component according to claim 6, wherein

the antenna board and the dielectric board provided with the high frequency circuit respectively have grounding layers, and the grounding layers are electrically connected to each other.

9. The antenna component according to claim 6, wherein

the dielectric board in the antenna board and the dielectric board provided with the high frequency circuit are integrated with each other, and an antenna element is formed on a surface of the integrated dielectric boards.

10. The antenna component according to claim 9, wherein

a plurality of antenna elements which differ in frequencies to be used are formed on the surface of the integrated dielectric boards.

11. The antenna component according to claim 10, wherein

the plurality of antenna elements which differ in frequencies to be used are provided on the grounding layer.

12. The antenna component according to claim 10, wherein

the plurality of antenna element boards respectively provided with the antenna elements which differ in frequencies to be used are integrally fixed to the grounding layer.

13. The antenna component according to claim 1, wherein

the antenna element provided on the grounding layer includes a dielectric resonator antenna disposed on the grounding layer.

14. The antenna component according to claim 13, wherein

the coupling means includes a through conductor penetrating through the dielectric board from the high frequency circuit and extending into the dielectric resonator antenna.

15. The antenna component according to claim 1, wherein

the antenna element includes an antenna element formed in the grounding layer.

16. The antenna component according to claim 1, wherein

the antenna element provided in the grounding ayer includes a slot antenna.

17. The antenna component according to claim 16, wherein

the coupling means includes means for electromagnetically coupling the slot antenna and the high frequency circuit.

18. A high frequency circuit integrated-type antenna component, comprising:

a dielectric board having two opposed surfaces and an inner part defining the portion of the board between the two opposed surfaces and having a high frequency circuit formed on one of the surfaces or in the inner part;

a grounding layer formed on a portion of one surface of the dielectric board where the high frequency circuit is not formed;

an antenna element provided in or on the grounding layer; and

coupling means for coupling the antenna element with the high frequency circuit for signal transmission therebetween wherein

the high frequency circuit includes a demultiplexing circuit, the demultiplexing circuit including a plurality of directional filtering circuits which differ in operation frequencies.

19. The antenna component according to claim 18, wherein

the plurality of directional filtering circuits are arranged in descending order of their operation frequencies from a side of power feeding.

20. A chip antenna component comprising:

at least one antenna element; and

a stacked circuit section integrated with the antenna element and including at least one signal input terminal and two or more signal output terminals, at least one of the signal output terminals being connected to the antenna element,

wherein a demultiplexing circuit and/or a multiplexer is formed on the stacked circuit section, and

wherein at least one signal input terminal and at least one the signal output terminals are each introduced into a bottom surface of the stacked circuit section for electrically connecting the signal input terminal and the at least one of the signal output terminals to another wiring circuit board.

21. The chip antenna component according to claim 20, wherein the demultiplexing circuit and/or the multiplexer includes a directional coupling circuit and a ring resonance circuit.

22. The chip antenna component according to claim 20, wherein

the antenna element is a planar antenna.

23. The chip antenna component according to claim 22, wherein

the planar antenna includes a microstrip antenna.