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Method for assembling a tiled, flat-panel microdisplay array having reflective microdisplay tiles and attaching thermally-conductive substrate

  • US 6,556,261 B1
  • Filed: 06/21/2000
  • Issued: 04/29/2003
  • Est. Priority Date: 02/15/1999
  • Status: Expired due to Term
First Claim
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1. A method for assembling a plurality of microdisplay tiles into a tiled, microdisplay, the projected image of said microdisplay having visually imperceptible seams in reflection, the steps comprising:

  • a) providing a plurality of monolithic, reflective microdisplay tiles, each microdisplay having a front, active face and a rear, mounting face, at least one inner, precision finished edge, each of said microdisplay tiles comprising an array of pixels having a predetermined pixel pitch and each tile having an integrated circuit silicon backplane embedded therein and a predetermined thermal coefficient of expansion (TCE);

    b) three-dimensionally arranging said plurality of microdisplay tiles with respect to one another with said at least one inner, precision finished edge of a first one, of said plurality of microdisplay tiles adjacent to said at least one precision finished edge of a second one of said plurality of microdisplay tiles;

    c) releasably attaching said plurality of microdisplay tiles to an optically flat carrier;

    d) after said arranging step (b) and said attaching step (c), applying a filling material to said rear faces of said plurality of microdisplay tiles, if required, to fill any gaps between said inner, precision finished edges of said microdisplay tiles;

    e) after completing said arranging step (d), attaching a thermally-conductive, common silicon substrate having a TCE substantially equal to said predetermined TCE of said microdisplay tiles to said rear faces of said plurality of microdisplay tiles;

    f) after said attaching step (e), removing said plurality of microdisplay tiles from said optically flat carrier and polishing said front active faces of each of said plurality of microdisplay tiles to an optical local flatness of less than approximately 100 nm;

    g) attaching a common transparent cover plate proximate said front faces of said plurality of microdisplay tiles; and

    h) placing liquid crystal material between said front faces of said plurality of microdisplay tiles and said common cover plate to complete a liquid crystal cell.

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