Dual wafer load lock

• US 6,558,509 B2
• Filed: 07/16/2001
• Issued: 05/06/2003
• Est. Priority Date: 11/30/1999
• Status: Expired due to Term

• Current Assignee: Applied Materials Incorporated
• Original Assignee: Applied Materials Incorporated
• Inventors: Strassner, James David, Kraus, Joseph Arthur
• Primary Examiner(s): Niebling, John F.
• Assistant Examiner(s): Stevenson, Andre′ C.
• Application Number:
  US09/906,887
• Publication Number:
  US 20020005168A1
• Time in Patent Office: 659 Days
• Field of Search: 438/14, 156/345, 118/723, 118/719, 392/418
• US Class Current: 156/345.54
• CPC Class Codes: H01L 21/67017 Apparatus for fluid treatment H01L21/67126, H01L21/6715 take precedence
• CPC Class Codes: H01L 21/67109 mainly by convection
• CPC Class Codes: H01L 21/67115 mainly by radiation
• CPC Class Codes: H01L 21/67161 characterized by the layout of the process chambers
• CPC Class Codes: H01L 21/67167 surrounding a central transfer chamber
• CPC Class Codes: H01L 21/67184 characterized by the presence of more than one transfer chamber
• CPC Class Codes: H01L 21/6719 characterized by the construction of the processing chambers, e.g. modular processing chambers
• CPC Class Codes: H01L 21/67196 characterized by the construction of the transfer chamber
• CPC Class Codes: H01L 21/67201 characterized by the construction of the load-lock chamber
• CPC Class Codes: H01L 21/67253 Process monitoring, e.g. flow or thickness monitoring
• CPC Class Codes: H01L 21/67745 characterized by movements or sequence of movements of transfer devices

Abstract

A method and apparatus for transferring a substrate between a first environment having a first pressure and a second environment having a vacuum pressure is provided. In one embodiment, the apparatus comprises a chamber body having a first port disposed in a first wall and a second port disposed in a second wall that seals the chamber from the first and second environments. A cooling plate, a first substrate holder and a second substrate holder are disposed within the chamber body. The cooling plate is disposed at the bottom of the chamber body. The first port and the second port area sequentially opened and the pressure within the load lock regulated to allow substrate to pass through the load lock. A window is disposed in the top of the chamber body that allows a metrology device to view the chamber volume.

Claims

1. Apparatus for transferring a semiconductor substrate between a first environment having a first pressure and a second environment having a vacuum pressure, the apparatus comprising:

a chamber body having a first side wall, a second side wall, a top and a bottom defining a chamber volume therebetween;

a first port disposed in the first wall sealable from the first environment;

a second port disposed in the second wall sealable from the second environment;

a first substrate holder disposed between the top and the bottom of the chamber body;

a second substrate holder disposed between the top of the chamber body and the first substrate holder;

a window disposed in the top of the chamber; and

a metrology device disposed on the chamber body, wherein the metrology device is positioned to view the chamber volume through the window.

2. The chamber of claim 1 further comprising:

a heater disposed on the window external to the chamber body.

3. The chamber of claim 2, wherein the heater is a radiant heater.

4. The chamber of claim 1, wherein the window is comprised of quartz.

5. The chamber of claim 1, wherein a cooling plate has a first position adapted to contact the substrate disposed in the first substrate holder and a second position closer to the bottom of the chamber body than the first position.

6. The chamber of claim 1 further comprising:

a cooling plate disposed between the bottom of the chamber body and the first substrate holder.

7. The chamber of claim 6, wherein the cooling plate has a rotating upper portion.

8. The chamber of claim 6, wherein the cooling plate rotates the substrate disposed in the second substrate holder, wherein an optical sensor is adapted to detect an orientation or center of the substrate.

9. The chamber of claim 1, wherein the metrology device further comprises:

an optical sensor disposed on the window external to the chamber body.

10. The chamber of claim 1, wherein the first substrate holder further comprises:

a first member having a curved inner portion;

a second member having a curved inner portion;

a lip extending from each curved inner portion adapted to support the first substrate from opposite portions of a perimeter of the first substrate; and

wherein the second substrate holder further comprises;

a third member coupled to the first member, the third member having a curved inner portion concentric to the curved inner portion of the first member;

a fourth member coupled to the second member, the third member having a curved inner portion concentric to the curved inner portion of the second member,

a lip extending from the curved inner portions of the third and the fourth members and adapted to support the second substrate from opposite portions of a perimeter of the second substrate.

11. The chamber of claim 1 further comprising:

a first stanchion and a second stanchion.

12. The chamber of claim 1 further comprising:

a pump coupled to the chamber bottom; and

a vent passage disposed in the top of the chamber.

13. The chamber of claim 12 further comprising:

a filter fluidly coupled to the vent passage.

28. The chamber of claim 1, wherein the metrology device is selected from the group consisting of a wafer type sensor, a wafer topography sensor, an orientation sensor and a film thickness sensor.

14. Apparatus for transferring a semiconductor substrate between a first environment having a first pressure and a second environment having a vacuum pressure, the apparatus comprising:

a chamber body having a first side wall, a second side wall, a top and a bottom defining a chamber volume therebetween;

a window disposed in the top of the chamber body;

a heater module disposed on the chamber body and at least partially covering the window;

a first port disposed in the first wall sealable from the first environment;

a second port disposed in the second side wall sealable from the second environment;

a first substrate holder disposed between the top and the bottom of the chamber body;

a second substrate holder disposed between the top of the chamber body and the first substrate holder;

a cooling plate disposed between the bottom of the chamber body and the first substrate holder; and

a metrology device disposed on the chamber body, wherein the metrology device is positioned to view the chamber volume through the window.

15. The chamber of claim 14, wherein the cooling plate has a first position adapted to contact the substrate disposed in the first substrate holder and a second position closer to the bottom of the chamber body than the first position.

16. The chamber of claim 14, wherein the cooling plate has a rotating upper portion.

17. The chamber of claim 16 further comprising a metrology device mounted on top of the chamber body, wherein the metrology device views an interior of the chamber through the window.

18. The chamber of claim 14, wherein the metrology device is selected from the group consisting of a wafer type sensor, a wafer topography sensor, an orientation sensor and a film thickness sensor.

19. The chamber of claim 14, wherein the cooling plate rotates the substrate disposed in the first substrate holder.

20. The chamber of claim 19, wherein the metrology device further comprises:

an optical sensor disposed on a window exterior to the chamber body is adapted to detect an orientation or center of the substrate.

21. The chamber of claim 14, wherein the first substrate holder further comprises:

a first member having a curved inner portion;

a second member having a curved inner portion;

a lip extending from each curved inner portion adapted to support the first substrate from opposite portions of a perimeter of the first substrate; and

wherein the second substrate holder further comprises;

a third member coupled to the first member, the third member having a curved inner portion concentric to the curved inner portion of the first member;

a fourth member coupled to the second member, the third member having a curved inner portion concentric to the curved inner portion of the second member,

a lip extending from the curved inner portions of the third and the fourth members and adapted to support the second substrate from opposite portions of a perimeter of the second substrate.

22. The chamber of claim 14 further comprising:

a pump coupled to the chamber bottom; and

a vent passage disposed in the top of the chamber.

23. The chamber of claim 22 further comprising a filter fluidly coupled to the vent passage.

24. Apparatus for transferring a semiconductor substrate between a first environment having a first pressure and a second environment having a vacuum pressure, the apparatus comprising:

a chamber body having a first side wall, a second side wall, a top and a bottom defining a chamber volume therebetween;

a window disposed in the top of the chamber body;

a heater module disposed on the chamber body and at least partially covering the window;

a first port disposed in the first wall sealable from the first environment;

a second port disposed in the second wall sealable from the second environment;

a first substrate holder disposed between the top and the bottom of the chamber body;

a second substrate holder disposed between the top of the chamber body and the first substrate holder;

a rotating cooling plate disposed between the bottom of the chamber body and the first substrate holder; and

a metrology device disposed on the chamber body, wherein the metrology device is positioned to view the chamber volume through the window.

25. The apparatus of claim 24, wherein the heater module further comprise:

a ceramic socket; and

a lamp disposed in the ceramic socket.

26. The apparatus of claim 25, wherein the heater module further comprises:

a cooling device coupled to the socket.

27. The apparatus of claim 26, wherein the cooling device is a fluid circulation tube.

29. An apparatus for transferring a semiconductor substrate between a first environment having a first pressure and a second environment having a vacuum pressure, the apparatus comprising:

a chamber body having a first side wall, a second side wall, a top and a bottom defining a chamber volume therebetween;

a first port disposed in the first wall sealable from the first environment;

a second port disposed in the second wall sealable from the second environment;

a first substrate holder disposed between the top and the bottom of the chamber body;

a second substrate holder disposed between the top of the chamber body and the first substrate holder;

a window disposed in the top of the chamber;

a metrology device disposed on the chamber body, wherein the metrology device is positioned to view the chamber volume through the window;

the first substrate holder further comprising;

a first member having a curved inner portion;

a second member having a curved inner portion;

a lip extending from each curved inner portion adapted to support the first substrate from opposite portions of a perimeter of the first substrate; and

wherein the second substrate holder further comprises;

a third member coupled to the first member, the third member having a curved inner portion concentric to the curved inner portion of the first member;

a fourth member coupled to the second member, the third member having a curved inner portion concentric to the curved inner portion of the second member; and

a lip extending from the curved inner portions of the third and the fourth members and adapted to support the second substrate from opposite portions of a perimeter of the second substrate.

30. An apparatus for transferring a semiconductor substrate between a first environment having a first pressure and a second environment having a vacuum pressure, the apparatus comprising:

a chamber body having a first side wall, a second side wall, a top and a bottom defining a chamber volume therebetween;

a window disposed in the top of the chamber body;

a heater module disposed on the chamber body and at least partially covering the window;

a first port disposed in the first wall sealable from the first environment;

a second port disposed in the second side wall sealable from the second environment;

a first substrate holder disposed between the top and the bottom of the chamber body;

a second substrate holder disposed between the top of the chamber body and the first substrate holder;

a cooling plate disposed between the bottom of the chamber body and the first substrate holder;

a metrology device disposed on the chamber body, wherein the metrology device is positioned to view the chamber volume through the window; and

wherein the metrology device is selected from the group consisting of a wafer type sensor, a wafer topography sensor, an orientation sensor and a film thickness sensor.

31. An apparatus for transferring a semiconductor substrate between a first environment having a first pressure and a second environment having a vacuum pressure, the apparatus comprising:

a chamber body having a first side wall, a second side wall, a top and a bottom defining a chamber volume therebetween;

a window disposed in the top of the chamber body;

a heater module disposed on the chamber body and at least partially covering the window;

a first port disposed in the first wall sealable from the first environment;

a second port disposed in the second side wall sealable from the second environment;

a first substrate holder disposed between the top and the bottom of the chamber body;

a second substrate holder disposed between the top of the chamber body and the first substrate holder;

a cooling plate disposed between the bottom of the chamber body and the first substrate holder, wherein the cooling plate rotates the substrate disposed in the first substrate holder;

a metrology device disposed on the chamber body, wherein the metrology device is positioned to view the chamber volume through the window; and

wherein the metrology device further comprises;

an optical sensor adapted to detect an orientation or center of the substrate disposed on the window exterior to the chamber body.

32. An apparatus for transferring a semiconductor substrate between a first environment having a first pressure and a second environment having a vacuum pressure, the apparatus comprising:

a chamber body having a first side wall, a second side wall, a top and a bottom defining a chamber volume therebetween;

a window disposed in the top of the chamber body;

a heater module disposed on the chamber body and at least partially covering the window;

a first port disposed in the first wall sealable from the first environment;

a second port disposed in the second side wall sealable from the second environment;

a first substrate holder disposed between the top and the bottom of the chamber body;

wherein the first substrate holder comprises;

a first member having a curved inner portion;

a second member having a curved inner portion;

a lip extending from each curved inner portion adapted to support the first substrate from opposite portions of a perimeter of the first substrate; and

wherein the second substrate holder further comprises;

a third member coupled to the first member, the third member having a curved inner portion concentric to the curved inner portion of the first member;

a fourth member coupled to the second member, the third member having a curved inner portion concentric to the curved inner portion of the second member;

a lip extending from the curved inner portions of the third and the fourth members and adapted to support the second substrate from opposite portions of a perimeter of the second substrate;

a second substrate holder disposed between the top of the chamber body and the first substrate holder;

a cooling plate disposed between the bottom of the chamber body and the first substrate holder; and

a metrology device disposed on the chamber body, wherein the metrology device is positioned to view the chamber volume through the window.

33. An apparatus for transferring a semiconductor substrate between a first environment having a first pressure and a second environment having a vacuum pressure, the apparatus comprising:

a chamber body having a first side wall, a second side wall, a top and a bottom defining a chamber volume therebetween;

a window disposed in the top of the chamber body;

a first port disposed in the first wall sealable from the first environment;

a second port disposed in the second wall sealable from the second environment;

a first substrate holder disposed between the top and the bottom of the chamber body;

a second substrate holder disposed between the top of the chamber body and the first substrate holder;

a rotating cooling plate disposed between the bottom of the chamber body and the first substrate holder,

a metrology device disposed on the chamber body, wherein the metrology device is positioned to view the chamber volume through the window; and

a heater module disposed on the chamber body at least partially covering the window;

wherein the heater module further comprises;

a ceramic socket;

a lamp disposed in the ceramic socket;

a cooling device coupled to the socket.

34. The apparatus of claim 33 wherein the cooling device is a fluid circulation tube.