Thermosetting polyphenylene ether resin composition, cured resin composition obtained therefrom, and laminated structure

• US 6,558,783 B1
• Filed: 06/28/2000
• Issued: 05/06/2003
• Est. Priority Date: 02/23/1998
• Status: Expired due to Fees

• Current Assignee: Asahi Kasei Kabushiki Kaisha, Choongwae Pharma Corporation
• Original Assignee: Asahi Kasei Kabushiki Kaisha
• Inventors: Kato, Akihiro, Kinoshita, Shozo
• Primary Examiner(s): Thibodeau, Paul
• Assistant Examiner(s): Jackson, Monique R.
• Application Number:
  US09/582,526
• Time in Patent Office: 1,042 Days
• Field of Search: 525/534, 428/457, 428/413, 428/414, 428/416, 428/418, 428/460, 428/297.4, 428/464, 428/301.4, 442/43, 442/58, 442/23, 442/45, 442/233
• US Class Current: 428/297.4
• CPC Class Codes: C08J 2371/12 Polyphenylene oxides
• CPC Class Codes: C08J 5/18 Manufacture of films or sheets
• CPC Class Codes: C08L 63/00 Compositions of epoxy resins; Compositions of derivatives of epoxy resins
• CPC Class Codes: C08L 71/123 not modified by chemical after-treatment
• CPC Class Codes: C08L 71/126 modified by chemical after-treatment
• CPC Class Codes: H01B 3/427 Polyethers
• CPC Class Codes: H05K 1/0326 containing O
• CPC Class Codes: Y10T 428/24994 Fiber embedded in or on the surface of a polymeric matrix
• CPC Class Codes: Y10T 428/249952 At least one thermosetting synthetic polymeric material layer
• CPC Class Codes: Y10T 428/31511 Of epoxy ether
• CPC Class Codes: Y10T 428/31515 As intermediate layer
• CPC Class Codes: Y10T 428/31522 Next to metal
• CPC Class Codes: Y10T 428/31529 Next to metal
• CPC Class Codes: Y10T 428/31678 Of metal
• CPC Class Codes: Y10T 428/31688 Next to aldehyde or ketone condensation product
• CPC Class Codes: Y10T 442/138 Including a metal layer
• CPC Class Codes: Y10T 442/172 Coated or impregnated
• CPC Class Codes: Y10T 442/176 Three or more layers
• CPC Class Codes: Y10T 442/198 Coated or impregnated
• CPC Class Codes: Y10T 442/3423 Plural metallic films or foils or sheets

Abstract

Disclosed are a curable polyphenylene ether (PPE) resin composition comprising (a) a PPE resin and (b) a of a compound having a 3,4-dihydro-3-substituted-1,3-benzoxazine skeleton (DSBS compound), or a mixture of the DSBS compound and a ring-opening polymerization re-action product thereof; a cured PPE resin composition obtainable by curing the curable PPE resin composition; and a laminate structure obtained by using the curable or cured PPE resin composition. The curable PPE resin composition exhibits, after cured, excellent chemical resistance, moisture resistance, dielectric characteristics, heat resistance, flame retardancy and dimensional stability, so that it can be used as a dielectric, insulating or heat resistant material in the electrical, electronic, space and aircraft industries. Especially, it can be advantageously used as a resin composition for forming insulating layers, such as substrates for a single-sided, double-sided or multi-layer printed circuit board, a flexible printed circuit board and a semi-rigid circuit board, and a substrate for a structure having excellent heat removal characteristics.

Claims

1. A curable polyphenylene ether resin composition comprising:

(a) a polyphenylene ether resin; and

(b) a compound having a 3,4-dihydro-3-substituted-1,3-benzoxazine skeleton (DSBS compound), or a mixture of said DSBS compound and a ring-opening polymerization reaction product thereof, and

wherein the amounts of said polyphenylene ether resin (a) and said component (b) are, respectively, from 98 to 20 parts by weight and from 2 to 80 parts by weight, relative to 100 parts by weight of the total of said components (a) and (b).

2. The curable polyphenylene ether resin composition according to claim 1, which further comprises a thermocurable resin (c) other than said components (a) and (b), and wherein the total amount of said components (a) and (b) and the amount of said thermocurable resin (c) are, respectively, from 99 to 1 parts by weight and from 1 to 99 parts by weight, relative to 100 parts by weight of the total of said components (a), (b) and (c).

3. The curable polyphenylene ether resin composition according to claim 1 or 2, which is a film.

4. A cured polyphenylene ether resin composition obtainable by curing the curable polyphenylene ether resin composition of claim 1 or 2.

5. The cured polyphenylene ether resin composition according to claim 4, which is a film.

6. A curable polyphenylene ether resin composition composite material comprising:

the curable polyphenylene ether resin composition of claim 1; and

(d) a reinforcement incorporated in said resin composition, and

wherein the total amount of said components (a) and (b) and the amount of said component (d) are, respectively, from 95 to 10 parts by weight and from 5 to 90 parts by weight, relative to 100 parts by weight of the total of said components (a), (b) and (d).

7. The curable polyphenylene ether resin composition composite material according to claim 6, wherein said curable polyphenylene ether resin composition further comprises a thermocurable resin (c) other than said components (a) and (b), and

wherein the total amount of said components (a) and (b) and the amount of said thermocurable resin (c) are, respectively, from 99 to 1 parts by weight and from 1 to 99 parts by weight, relative to 100 parts by weight of the total of said components (a), (b) and (c), and

wherein the total amount of said components (a), (b) and (c) and the amount of said component (d) are, respectively, from 95 to 10 parts by weight and from 5 to 90 parts by weight, relative to 100 parts by weight of the total of said components (a), (b), (c) and (d).

8. A cured polyphenylene ether resin composition composite material obtainable by curing the curable polyphenylene ether resin composition composite material of claim 6 or 7.

9. A curable laminate structure comprising a primary metallic foil and at least one curable resin composition layer disposed on at least one surface of said primary metallic foil,

said curable resin composition layer comprising the curable polyphenylene ether resin composition of claim 1 or 2 or the curable polyphenylene ether resin composition composite material of claim 6 or 7, with the proviso that when the laminate structure has at least two curable resin composition layers on at least one surface of said primary metallic foil, said at least two curable resin composition layers are the same or different and said at least two curable resin composition layers are disposed one upon another.

10. A metallic foil/insulating layer laminate structure obtainable by curing the curable laminate structure of claim 9.

11. The curable laminate structure according to claim 9, having an additional metallic foil disposed on the outer surface of the curable resin composition layer when the laminate structure has one curable resin composition layer on at least one surface of said primary metallic foil, and wherein, when the laminate structure has at least two curable resin composition layers on at least one surface of said primary metallic foil, said laminate structure has at least one structure selected from the group consisting of a metallic foil-exposed structure wherein there is an additional metallic foil disposed on the outer surface of an outermost curable resin composition layer and a metallic foil-interposed structure wherein there is an additional metallic foil disposed between at least one of the curable resin composition layers and a curable resin composition layer adjacent thereto.

12. A metallic foil/insulating layer material laminate structure obtainable by curing the curable laminate structure of claim 11.

13. A curable composite structure comprising a metallic substrate and at least one curable resin composition layer disposed on at least one surface of said metallic substrate,

said curable resin composition layer comprising the curable polyphenylene ether resin composition of claim 1 or 2 or the curable polyphenylene ether resin composition composite material of claim 6 or 7, with the proviso that when the composite structure has at least two curable resin composition layers on at least one surface of said metallic substrate, said at least two curable resin composition layers are the same or different and said at least two curable resin composition layers are disposed one upon another.

14. A metallic substrate/insulating layer composite structure obtainable by curing the curable composite structure of claim 13.

15. The curable composite structure according to claim 13, having a metallic foil disposed on the outer surface of the curable resin composition layer when the composite structure has one curable resin composition layer on at least one surface of said metallic substrate, and wherein, when the composite structure has at least two curable resin composition layers on at least one surface of said metallic substrate, said composite structure has at least one structure selected from the group consisting of a metallic foil-exposed structure wherein there is a metallic foil disposed on the outer surface of an outermost curable resin composition layer and a metallic foil-interposed structure wherein there is a metallic foil disposed between at least one of the curable resin composition layers and a curable resin composition layer adjacent thereto.

16. A metallic substrate/insulating layer composite structure obtainable by curing the curable composite structure of claim 15.