Stack of multilayer modules with heat-focusing metal layer

• US 6,560,109 B2
• Filed: 09/07/2001
• Issued: 05/06/2003
• Est. Priority Date: 09/07/2001
• Status: Expired due to Term

• Current Assignee: Nytell Software LLC (Intellectual Ventures LLC)
• Original Assignee: Irvine Sensors Corp.
• Inventors: Ozguz, Volkan H., Camien, Andrew Nelson, Pepe, Angel Antonio, Yamaguchi, James Satsuo
• Primary Examiner(s): Thompson, Gregory
• Application Number:
  US09/949,024
• Publication Number:
  US 20030048609A1
• Time in Patent Office: 606 Days
• Field of Search: 156/264, 156/295, 174/252, 257/777, 257/686, 257/683, 361/735, 361/744, 361/704-705, 361/707-708, 361/709-710, 361/790, 361/803, 438/109, 438/249
• US Class Current: 361/704
• CPC Class Codes: H01L 2224/16145 the bodies being stacked
• CPC Class Codes: H01L 2225/1023 the support being an insulating substrate
• CPC Class Codes: H01L 2225/1064 Electrical connections provided on a side surface of one or more of the containers
• CPC Class Codes: H01L 23/3735 Laminates or multilayers, e.g. direct bond copper ceramic substrates
• CPC Class Codes: H01L 23/3737 Organic materials with or without a thermoconductive filler
• CPC Class Codes: H01L 25/0652 the devices being arranged next and on each other, i.e. mixed assemblies
• CPC Class Codes: H01L 25/105 the devices being of a type provided for in group H01L27/00
• CPC Class Codes: H05K 2201/0129 Thermoplastic polymer, e.g. auto-adhesive layer; Shaping of thermoplastic polymer
• CPC Class Codes: H05K 2203/1105 Heating or thermal processing not related to soldering, firing, curing or laminating, e.g. for shaping the substrate or during finish plating
• CPC Class Codes: H05K 2203/1536 Temporarily stacked PCBs
• CPC Class Codes: H05K 2203/167 Using mechanical means for positioning, alignment or registration, e.g. using rod-in-hole alignment
• CPC Class Codes: H05K 3/0052 Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards
• CPC Class Codes: H05K 3/0097 Processing two or more printed circuits simultaneously, e.g. made from a common substrate, or temporarily stacked circuit boards H05K3/0052 takes precedence
• CPC Class Codes: H05K 3/403 Edge contacts; Windows or holes in the substrate having plural connections on the walls thereof H05K3/4092 takes precedence

Abstract

A stack of multilayer modules has a segmentation layer disposed between neighboring multilayer modules. The segmentation layer facilitates the separation of neighboring multilayer modules. The stack of multilayer modules includes a first multilayer module and a second multilayer module. Each multilayer module includes a plurality of active layers each comprising a substrate, at least one electronic element, and a plurality of electrically-conductive traces. The second multilayer module is disposed to be neighboring the first multilayer module with at least one segmentation layer between the first and second multilayer modules. The segmentation layer includes a metal layer and at least one thermoplastic adhesive layer. When heat is applied, the metal layer conducts heat to the thermoplastic adhesive layer.

Claims

1. A stack of multilayer modules with a segmentation layer disposed between neighboring multilayer modules, the segmentation layer facilitating the separation of neighboring multilayer modules, the stack of multilayer modules comprising:

a first multilayer module comprising, a plurality of active layers each comprising a substrate, at least one electronic element, and a plurality of electrically-conductive traces;

a second multilayer module comprising a plurality of active layers each comprising a substrate, at least one electronic element, and a plurality of electrically-conductive traces, the second multilayer module disposed to be neighboring the first multilayer module; and

at least one segmentation layer between the first and second multilayer modules, the segmentation layer comprising a metal layer and at least one thermoplastic adhesive layer wherein when heat is applied, the metal layer conducts heat to the thermoplastic adhesive layer.

2. The stack of multilayer modules of claim 1, wherein the metal layer comprises copper or aluminum.

3. A method of releasably adhering together neighboring multilayer modules of a stack of multilayer modules, the method comprising:

providing a first multilayer module comprising a plurality of active layers each comprising a substrate, at least one electronic element, and a plurality of electrically-conductive traces;

providing a second multilayer module comprising a plurality of active layers each comprising a substrate, at least one electronic element, and a plurality of electrically-conductive traces, the second multilayer module disposed to be neighboring the first multilayer module; and

disposing a segmentation layer between the first multilayer module and second multilayer module, the segmentation layer comprising a metal layer and a thermoplastic adhesive layer wherein when heat is applied, the metal layer conducts heat to the thermoplastic adhesive layer.

4. A stack of multilayer modules, each multilayer module having a plurality of layers wherein each layer has a substrate therein, the stack of multilayer modules comprising:

a first multilayer module comprising a first layer having a top side and bottom side, the first layer comprising a substrate, at least one electronic element, and a plurality of electrically-conductive traces;

a second multilayer module comprising a second layer having a top side and bottom side, the second layer comprising a substrate, at least one electronic element, and a plurality of electrically-conductive traces; and

a metal layer disposed between and adhered to the top side of the first layer and the bottom side of the second layer.

5. The stack of multilayer modules of claim 4, further comprising a thermoplastic adhesive which releasably adheres the first multilayer module to the second multilayer module.

6. The stack of multilayer modules of claim 4, wherein the metal layer comprises copper or aluminum.

7. A method of providing a stack of multilayer modules, each multilayer module having a plurality of layers wherein each layer has a substrate therein, the method comprising:

providing a first multilayer module comprising a first layer having a top side and bottom side, the first layer comprising a substrate, at least one electronic element, and a plurality of electrically-conductive traces;

providing a second multilayer module comprising a second layer having a top side and bottom side, the second layer comprising a substrate, at least one electronic element, and a plurality of electrically-conductive traces;

adhering a metal layer to the top side of the first layer and the bottom side of the second layer; and

releasably adhering the first multilayer module to the second multilayer module with the metal layer disposed between the first multilayer module and the second multilayer module.

8. A stack of multilayer modules with a segmentation layer disposed between neighboring multilayer modules, the segmentation layer facilitating the separation of neighboring multilayer modules, the stack of multilayer modules comprising:

a first multilayer module comprising a plurality of active layers each comprising a substrate, at least one electronic element, and a plurality of electrically-conductive traces;

a second multilayer module comprising a plurality of active layers each comprising a substrate, at least one electronic element, and a plurality of electrically-conductive traces, the second multilayer module disposed to be neighboring the first multilayer module; and

at least one segmentation layer between the first and second multilayer modules, the segmentation layer comprising a plurality of metal layers and at least one thermoplastic adhesive layer wherein when heat is applied, the metal layers conducts heat to the thermoplastic adhesive layer.

9. A method of providing a stack of multilayer modules with a segmentation layer disposed between neighboring multilayer modules, the method comprising:

providing a first multilayer module comprising a plurality of active layers each comprising a substrate, at least one electronic element, and a plurality of electrically-conductive traces;

providing a second multilayer module comprising a plurality of active layers each comprising a substrate, at least one electronic element, and a plurality of electrically-conductive traces, the second multilayer module disposed to be neighboring the first multilayer module; and

releasably adhering the first multilayer module and the second multilayer module by disposing at least one segmentation layer between the first and second multilayer modules, the segmentation layer comprising a plurality of metal layers and at least one thermoplastic adhesive layer wherein when heat is applied, the metal layers conducts heat to the thermoplastic adhesive layer.

10. A stack of multilayer modules with a segmentation layer disposed between neighboring multilayer modules, the segmentation layer facilitating the separation of neighboring multilayer modules, the stack of multilayer modules comprising:

a first multilayer module comprising a first active layer comprising a substrate, at least one electronic element, and a plurality of electrically-conductive traces;

a second multilayer module comprising a second active layer comprising a substrate, at least one electronic element, and a plurality of electrically-conductive traces, the second active layer disposed to be neighboring the first active layer; and

at least one segmentation layer between the first and second active layers, the segmentation layer comprising a metal layer and at least one thermoplastic adhesive layer wherein when heat is applied, the metal layer conducts heat to the thermoplastic adhesive layer.