Microwave waveguide assembly and method for making same

• US 6,560,850 B2
• Filed: 04/04/2001
• Issued: 05/13/2003
• Est. Priority Date: 04/04/2001
• Status: Expired due to Term

• Current Assignee: Hughes Network Systems LLC (Echostar Corporation)
• Original Assignee: Hughes Electronics Corporation (Rtx Corporation)
• Inventors: Lankford, Barre, Stowell, Steve, St. John, Marc
• Primary Examiner(s): Huson, Gregory L.
• Assistant Examiner(s): DEVORE, PETER T
• Application Number:
  US09/825,624
• Publication Number:
  US 20020144392A1
• Time in Patent Office: 769 Days
• Field of Search: 296/00, 156/292, 156/304.2, 156/64, 156/153, 156/277, 333/239, 333/248, 333/240, 333/241, 333/242, 138/157, 138/170
• US Class Current: 29/600
• CPC Class Codes: H01P 1/161 sustaining two independent orthogonal modes, e.g. orthomode transducer combining or separating polarisations and frequencies H01P1/2131
• CPC Class Codes: H01P 1/213 combining or separating two or more different frequencies H01P1/215 takes precedence
• CPC Class Codes: H01P 11/00 Apparatus or processes specially adapted for manufacturing waveguides or resonators, lines, or other devices of the waveguide type
• CPC Class Codes: H01P 11/002 Manufacturing hollow waveguides
• CPC Class Codes: H01Q 13/0283 Apparatus or processes specially provided for manufacturing horns
• CPC Class Codes: Y10T 29/49016 Antenna or wave energy "plumbing" making

Abstract

A waveguide and a method for assembling the same are provided. The waveguide comprises a first half and a second half. A gasket is applied to a first mating surface of the first half. The first mating surface of the first half is aligned with a second mating surface of the second half. The gasket is positioned between the first mating surface of the first half and the second mating surface of the second half. The first half is fastened to the second half to form the assembled waveguide.

Claims

1. A method of assembling a waveguide having an electrically conductive first half and an electrically conductive second half, said method comprising the steps of:

applying an electrically conductive gasket to a first mating surface of said first half; and

fastening said second half to said first half, so that said gasket is disposed between a first mating surface of said first half and a second mating surface of said second half.

2. A method as in claim 1 further comprising the steps of:

cleaning said first half before the step of applying said gasket; and

cleaning said second half before the step of applying said gasket.

3. A method as in claim 1 wherein the step of applying said gasket comprises the step of applying a preformed metallic gasket.

4. A method as in claim 1 wherein the step of applying said gasket comprises the step of applying an electrically conductive gasket.

5. A method as in claim 1 wherein the step of applying said gasket forms a mechanical bond between said first half and said second half.

6. A method as in claim 1 wherein the step of applying said gasket comprises the step of applying a first layer of adhesive to said first mating surface of said first half.

7. A method as in claim 6 further comprising the step of applying a second layer of adhesive to said first mating surface of said first half.

8. A method as in claim 7 wherein the step of applying a first layer of said adhesive to said first mating surface of said first half comprises the step of applying said adhesive by stenciling or screening.

9. A method as in claim 6 wherein the step of applying a first layer of said adhesive comprises the step of applying a first layer of an epoxy.

10. A method as in claim 6 further comprising the step of applying said adhesive to a second mating surface of said second half.

11. A method as in claim 10 further comprising the step of curing said adhesive to said first mating surface of said first half and to said second mating surface of said second half.

12. A method as in claim 11 wherein the step of curing comprises the step of forming a moisture seal between said first mating surface of said first half and said second mating surface of said second half.

13. A method as in claim 6 further comprising the step of machining flange faces on said waveguide.

14. A method as in claim 1 further comprising the steps of:

cleaning said first half after applying said gasket; and

cleaning said second half after applying said gasket.

15. A waveguide formed according to method of claim 1.

16. A method of assembling a waveguide having an electrically conductive first half and an electrically conductive second half, said method comprising the steps of:

applying an electrically conductive epoxy to a first mating surface of said first half by a stencil or a screen machine;

positioning said epoxy between said first mating surface of said first half and said second mating surface of said second half;

fastening said second half to said first half to form the waveguide; and

curing said epoxy.

17. A method as in claim 16 wherein prior to the step of applying, further comprising the steps of:

cleaning a first mating surface of said first half; and

cleaning a second mating surface of said second half.

18. A method as in claim 16 wherein the step of curing comprises the step of curing said epoxy to form a moisture seal between said first mating surface of said first half and said second mating surface of said second half.

19. A method as in claim 16 further comprising the step of machining a flange face after the step of curing.

20. A method as in claim 16 wherein prior to the step of curing, further comprises the step of electrically testing the waveguide.

21. A method as in claim 20 further comprises the step of reworking said first half and said second half of the waveguide wherein said step of electrically testing indicates noncompliance.

22. A method as in claim 21 wherein said step of reworking comprises removing said epoxy, reapplying said epoxy, or repositioning said first mating surface relative to said second mating surface.

23. A waveguide comprising:

an electrically conductive first half having a first mating surface;

an electrically conductive second half having a second mating surface fastened to said first half so that said first mating surface is aligned with said second mating surface; and

an electrically conductive gasket disposed between said first mating surface of said first half and said second mating surface of said second half.

24. A waveguide as in claim 23 wherein said gasket comprises an adhesive epoxy.

25. A waveguide as in claim 23 wherein said gasket comprises a preformed metallic gasket.