Closed loop control over delivery of liquid material to semiconductor processing tool

• US 6,561,381 B1
• Filed: 11/20/2000
• Issued: 05/13/2003
• Est. Priority Date: 11/20/2000
• Status: Expired due to Fees

• Current Assignee: Applied Materials Incorporated
• Original Assignee: Applied Materials Incorporated
• Inventors: Osterheld, Thomas H., Bonner, Benjamin A., Richter, Michael W.
• Primary Examiner(s): Mancene, Gene
• Assistant Examiner(s): Cartagena, Melvin A
• Application Number:
  US09/717,720
• Time in Patent Office: 904 Days
• Field of Search: 222/1, 222/56, 222/58, 222/61, 222/335, 222/399
• US Class Current: 222/1
• CPC Class Codes: H01L 21/67253 Process monitoring, e.g. flow or thickness monitoring

Abstract

Liquid material is precisely dispensed to a semiconductor processing tool utilizing closed loop control. In one embodiment, CMP slurry material of known density is supplied from a reservoir/mixing vessel to a dispense module. The dispense module also receives a flow of an inert gas through a gas supply valve. Positive pressure arising within the dispense module due to the inert gas flow causes an outflow of slurry from the dispense module to the CMP platen. The rate of flow of the slurry to the CMP platen over time is determined by monitoring the change (decline) in weight of the filled dispense module. In a similar manner, variation in the rate of flow of slurry over time may be detected by monitoring variation in changes in weight of the filled dispense module over time. A regulator structure in electronic communication with the dispense module and with the gas supply valve receives first signals at different time points indicating the weight change of the dispense module. In response, the regulator structure communicates a second signal to the gas supply valve, reflecting an appropriate change in the rate of flow of CMP slurry material to the platen. This second signal causes the gas supply valve to vary the flow of inert gas to the dispense module in order to control changes in the flow rate of the slurry.

Claims

1. A method for dispensing material to a semiconductor processing tool, the method comprising:

providing the material within a dispense module;

flowing an inert gas into the dispense module through a gas supply valve, such that the material flows from the dispense module to the semiconductor processing tool;

detecting a flow rate of the material from the dispense module by monitoring a weight change of the dispense module;

generating a signal to vary the material flow rate; and

communicating the signal to the gas supply valve to adjust the gas supply valve to vary the material flow rate.

2. The method according to claim 1 further comprising communicating the signal to a pressure release valve in communication with the dispense module and an environment, in response to an excessive material flow rate.

3. The method according to claim 1 wherein communicating the signal comprises communicating an electrical signal to the gas supply valve.

4. The method according to claim 1 wherein communicating the signal comprises communicating an air pressure signal to the gas supply valve.

5. The method according to claim 1 wherein communicating the signal comprises communicating a liquid pressure signal to the gas supply valve.

6. The method according to claim 1 wherein providing the material to the delivery module comprises providing chemical-mechanical polishing slurry.

7. The method according to claim 1 wherein providing the material to the delivery module comprises providing undeveloped photoresist.

8. The method according to claim 1 wherein providing the material to the delivery module comprises providing wet etchant chemistry.