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Method and apparatus for forming deposition film, and method for treating substrate

  • US 6,562,400 B2
  • Filed: 04/30/2001
  • Issued: 05/13/2003
  • Est. Priority Date: 05/01/2000
  • Status: Expired due to Fees
First Claim
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1. A method for treating a substrate comprising the steps of:

  • (a) reeling off a rolled substrate in a first vacuum chamber;

    (b) treating the substrate;

    (c) reeling up the substrate on a roll in a second vacuum chamber, said second vacuum chamber also containing a rolled surface protection sheet; and

    (d) simultaneously reeling up said rolled surface protection sheet and said substrate in said second vacuum chamber in axial alignment with each other, wherein a gas is released from the surface of said surface protection sheet during step (d) in amounts from 1.3×

    10

    6
    to 1.3×

    10

    1
    Pa·

    l/s-cm2.

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