Method of manufacturing micro-display

• US 6,562,640 B1
• Filed: 08/23/2000
• Issued: 05/13/2003
• Est. Priority Date: 08/23/2000
• Status: Expired due to Fees

• Current Assignee: Taiwan Micro Display Corporation
• Original Assignee: Taiwan Micro Display Corporation
• Inventors: Tseng, Ling-Yuan, Cheng, Hao-Ming
• Primary Examiner(s): Nelms, David
• Assistant Examiner(s): Berry, Reneé R
• Application Number:
  US09/644,235
• Time in Patent Office: 993 Days
• Field of Search: 349/187, 349/73, 349/74, 349/113, 349/153, 349/155, 349/158, 438/15, 438/16, 438/17, 438/18
• US Class Current: 438/15
• CPC Class Codes: H01L 21/56 Encapsulations, e.g. encapsulation layers, coatings
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

A method of manufacturing micro-display includes the steps of testing individual chips on a base wafer forming the micro-display, and the tested “void” chips being marked, inputting the testing data into a sealant/glue machine and a laser puncher; sealant/glue forming on the external surrounding of a “passed” chip a sealant frame by the sealant/glue machine; forming an injection hole on an ITO glass panel at a position corresponding to the position of the “passed” chip, by means of the laser puncher; dispensing spacing particles within a chip'"'"'s square box which has been formed with the sealant frame; position-aligning the ITO glass panel onto the wafer based on the wafer testing data; injecting a liquid crystal via the injection hole of the ITO glass panel located on the top layer of the “passed” chip to the space between the chips and the ITO glass; and sealing and dicing handling of the ITO glass panel to precisely manufacture the micro-display with a passed chip circuit so as to precisely screen the good products, and simplify the required number for fabrication and process.

Claims

1. A method of manufacturing micro-displays from a plurality of chips on a wafer, comprising the steps of:

(A) inputting testing data for the wafer to a sealant machine and a laser puncher, the testing data identifying locations of“

passed” and

“

failed”

chips on the wafer;

(B) forming a sealant frame surrounding a perimeter of the identified “

passed”

chips on the wafer with the sealant machine;

(C) punching injection holes through an ITO glass panel with the laser puncher, the injection holes being punched at locations corresponding to positions of the “

passed”

chips on the wafer as defined in the testing data;

(D) dispensing spacing particles within an enclosed area of each of the “

passed”

chips formed by the sealant frame;

(E) position-aligning the wafer with the ITO glass panel such that each injection hole in the ITO glass panel is located to correspond to a respective one of the “

passed”

chips;

(F) injecting liquid crystal into the enclosed area of each of the “

passed”

chips via the corresponding injection holes in the ITO glass panel;

(G) sealing the injection holes on the ITO glass panel with the sealant machine; and

(H) dicing the wafer and ITO glass panel on the wafer and removing the identified “

passed”

chips.

2. The method of manufacturing micro-displays as set forth in claim 1, wherein both the sealant machine and the laser puncher are controlled by a micro-computer and possess X-axis and Y-axis coordinate displacement control.

3. The method of manufacturing micro-displays as set forth in claim 1, wherein the sealing material used in step (B) is epoxy resin.

4. The method of manufacturing micro-displays as set forth in claim 1, wherein the sealing process of step (B) includes the step of forming a notch in one side of the sealant frame for each “

passed”

chip corresponding to the injection holes of the ITO glass panel.

5. The method of manufacturing micro-displays as set forth in claim 1, wherein the punching process of step (C) includes the step of applying an alignment layer treatment to treat a surface of the ITO glass panel.

6. The method of manufacturing micro-displays as set forth in claim 5, wherein in the step of applying an alignment layer includes the step of sputtering a coating of a SiO_x glass material at a tilted angle onto the ITO glass panel.

7. The method of manufacturing micro-displays as set forth in claim 5, wherein in the step of applying an alignment layer includes the step of evaporating a coating of a SiO_x glass material at a tilted angle onto the ITO glass panel.

8. The method of manufacturing micro-displays as set forth in claim 1, wherein the liquid crystal injection of step (F) includes the step of injecting liquid crystal using a liquid crystal dispenser.

9. A method of manufacturing micro-displays from a plurality of chips on a wafer, comprising the steps of:

(A) obtaining wafer testing data for each of the individual chips on the wafer to respectively identify the chips as being “

passed” and

“

void”

chips based on the testing data;

(B) marking the “

void”

chips;

(C) inputting the testing data of the plurality of chips of the wafer to a sealant machine and a laser puncher, the testing data identifying locations of the “

passed” and

the “

void chips;

(D) forming a sealant frame surrounding a perimeter of only the “

passed”

chips on the wafer with the sealant machine;

(E) punching injection holes through an ITO glass panel with the laser puncher, the injection holes being punched at locations corresponding to positions of the “

passed”

chips on the wafer as defined in the testing data;

(F) dispensing spacing particles within an enclosed area of each of the “

passed”

chips formed by the sealant frame;

(G) position-aligning the wafer with the ITO glass panel such that each injection hole in the ITO glass panel is located to correspond to a respective one of the “

passed”

chips;

(H) applying a vacuum environment to the wafer;

(I) injecting liquid crystal into the enclosed area of each of the “

passed”

chips via the corresponding injection holes in the ITO glass panel;

(J) releasing the vacuum environment and allowing the liquid crystal to inject into the enclosed areas of the individual chips via the corresponding injection holes;

(K) sealing the injection holes in the ITO glass panel the sealant machine; and

(L) dicing the wafer and ITO glass panel on the wafer and removing the “

passed”

chips.