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Three dimensional structure integrated circuit

  • US 6,563,224 B2
  • Filed: 05/15/2002
  • Issued: 05/13/2003
  • Est. Priority Date: 04/04/1997
  • Status: Expired due to Term
First Claim
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1. An integrated circuit memory structure comprising:

  • a first substrate; and

    a second substrate bonded to the first substrate to form conductive paths between the first substrate and the second substrate, wherein the second substrate is a thinned substrate having circuitry formed thereon.

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