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Integrated on-chip half-wave dipole antenna structure

  • US 6,563,464 B2
  • Filed: 03/19/2001
  • Issued: 05/13/2003
  • Est. Priority Date: 03/19/2001
  • Status: Expired due to Fees
First Claim
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1. An antenna formed on a semiconductor structure, said semiconductor structure comprising:

  • a substrate, containing electrical circuits operationally related to the functionality of the antenna;

    a first antenna element and a second antenna element formed on said substrate, wherein said first and second antenna elements each have a longitudinal axis and each of said longitudinal axes lies along substantially the same linear axis, and are separated by a gap;

    wherein each of said first and second antenna elements are in electrical contact with said electrical circuits; and

    wherein each of said first and second antenna elements are solder bumps.

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