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Resin structure in which manufacturing cost is cheap and sufficient adhesive strength can be obtained and method of manufacturing it

  • US 6,564,448 B1
  • Filed: 04/20/2000
  • Issued: 05/20/2003
  • Est. Priority Date: 05/08/1998
  • Status: Expired due to Fees
First Claim
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1. A method of manufacturing a build-up multiple-layer circuit board, comprising:

  • providing a core board;

    providing an insulating layer formed of resin material;

    forming at least one of a via-hole and a through-hole in said insulating layer;

    making at least a portion of an inner surface of said at least one of a via-hole hole and said through-hole rough such that a surface roughness of said inner surface is in a range of 0.1 microns to 10 microns;

    laminating said insulating layer of said core board; and

    forming an electronic circuit on said rough surface of said resin substrate; and

    forming a metal layer on said rough inner surface of said at least one of a via-hole hole and said through-hole.

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