Semiconductor sensor chip and method for producing the chip, and semiconductor sensor and package for assembling the sensor

• US 6,564,634 B2
• Filed: 09/21/2001
• Issued: 05/20/2003
• Est. Priority Date: 04/24/1997
• Status: Expired due to Fees

• Current Assignee: Fuji Electric Systems Company Limited
• Original Assignee: Fuji Electric Company Limited (Fuji Electric Systems Company Limited)
• Inventors: Ueyanagi, Katsumichi, Sasaki, Mitsuo, Nishikawa, Mutsuo
• Primary Examiner(s): MOLLER, RICHARD ALAN
• Application Number:
  US09/957,242
• Publication Number:
  US 20020007678A1
• Time in Patent Office: 606 Days
• Field of Search: 734/93, 734/31
• US Class Current: 73/493
• CPC Class Codes: G01P 1/023 for acceleration measuring devices
• CPC Class Codes: G01P 15/0802 Details
• CPC Class Codes: G01P 15/0888 for indicating angular acceleration
• CPC Class Codes: G01P 15/11 by inductive pick-up
• CPC Class Codes: G01P 15/123 by piezo-resistive elements, e.g. semiconductor strain gauges
• CPC Class Codes: G01P 21/00 Testing or calibrating of apparatus or devices covered by the preceding groups
• CPC Class Codes: H01F 10/126 containing rare earth metals H01F10/133 takes precedence
• CPC Class Codes: H01F 10/265 Magnetic multilayers non exchange-coupled H01F10/32 takes precedence
• CPC Class Codes: H05K 1/18 Printed circuits structurally associated with non-printed electric components H05K1/0201, H05K1/023, H05K1/0243, and H05K1/16 take precedence

Abstract

The present invention is a semiconductor sensor package for incorporating a semiconductor sensor chip. The main surface for mounting the semiconductor sensor chip is formed at a predetermined angle with respect to the surface of a printed circuit board for mounting the package. The main surface is provided with a plurality of terminals along two opposite sides for connecting with the input/output terminals of the semiconductor sensor chip and a bottom surface perpendicular to the main surface with a plurality of pins respectively formed along two sides parallel to the main surface. The plurality of pins are inserted into mounting holes formed in the printed circuit board, and the plurality of terminals provided along parallel sides the pins are electrically connected.

Claims

1. A semiconductor sensor package for incorporating a semiconductor sensor chip characterized in that a main surface for mounting said semiconductor sensor chip is formed at a predetermined angle with respect to a printed circuit board for mounting said package, said main surface is provided with a plurality of terminals along two opposite parallel sides thereof for connecting with input/output terminals of said semiconductor sensor chip, a bottom surface perpendicular to said main surface is provided with a plurality of pins respectively formed along two sides parallel to said main surface, which plurality of pins are inserted into mounting holes formed in said printed circuit board, and said plurality of terminals provided along said two opposite parallel sides and said plurality of pins are electrically connected.

2. The semiconductor sensor package as claimed in claim 1, wherein said main surface for mounting said semiconductor sensor chip is formed substantially perpendicular to the surface of the printed circuit board mounting said package.

3. The semiconductor sensor package as claimed in claim 1, wherein wiring for connecting said plurality of terminals and said plurality of pins is buried in said package.

4. The semiconductor sensor package of claim 1, further comprising a cover.

5. The semiconductor sensor package of claim 1, wherein the main surface for mounting comprises a sensor fixing surface, said sensor fixing surface comprising a plurality of wire bond pads for supplying current to said semiconductor sensor chip and for a detection signal output, and wherein said wire bond pads are electrically connected to said pins.

6. The semiconductor sensor package of claim 5 wherein said wire bond pads are formed of an integral metal thin plate and connected to said pins by soldering.

7. The semiconductor sensor package of claim 1, said package comprising an epoxy resin.