Manufacturing method of head suspension assembly with IC chip
First Claim
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1. A method of manufacturing a head suspension assembly comprising the steps of:
- attaching underfill to a mounting portion on which an IC chip with a circuit for a thin-film magnetic head element is to be mounted;
disposing said IC chip on the attached underfill; and
performing ultrasonic bonding of said IC chip.
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Abstract
A method of manufacturing a head suspension assembly includes attaching underfill to a portion on which an IC chip with a circuit for a thin-film magnetic head element is to be mounted, disposing the IC chip on the attached underfill, and performing ultrasonic bonding of the IC chip.
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Citations
20 Claims
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1. A method of manufacturing a head suspension assembly comprising the steps of:
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attaching underfill to a mounting portion on which an IC chip with a circuit for a thin-film magnetic head element is to be mounted;
disposing said IC chip on the attached underfill; and
performing ultrasonic bonding of said IC chip. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9)
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10. A method of manufacturing a head suspension assembly which includes a magnetic head slider with at least one thin-film magnetic head element, a support member for supporting said magnetic head slider, an IC chip with a circuit for said at least one thin-film magnetic head element, a lead conductor member on which said IC chip is bonded, and underfill filled in a clearance between a bottom face of said IC chip and said lead conductor member, said method comprising the steps of:
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attaching underfill to a mounting position of said lead conductor member, at which position said IC chip is mounted; and
thereafter, performing ultrasonic bonding of said IC chip with said lead conductor member. - View Dependent Claims (11, 12, 13, 14, 15, 16, 17, 18, 19, 20)
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Specification