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Manufacturing method of head suspension assembly with IC chip

  • US 6,564,988 B1
  • Filed: 05/05/2000
  • Issued: 05/20/2003
  • Est. Priority Date: 05/24/1999
  • Status: Expired due to Fees
First Claim
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1. A method of manufacturing a head suspension assembly comprising the steps of:

  • attaching underfill to a mounting portion on which an IC chip with a circuit for a thin-film magnetic head element is to be mounted;

    disposing said IC chip on the attached underfill; and

    performing ultrasonic bonding of said IC chip.

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