Manufacturing method of head suspension assembly with IC chip

• US 6,564,988 B1
• Filed: 05/05/2000
• Issued: 05/20/2003
• Est. Priority Date: 05/24/1999
• Status: Expired due to Fees

• Current Assignee: TDK Corporation
• Original Assignee: TDK Corporation
• Inventors: Shiraishi, Masashi, Wada, Takeshi, Kawai, Mitsuyoshi
• Primary Examiner(s): Elve, M. Alexandra
• Assistant Examiner(s): Kerns, Kevin P.
• Application Number:
  US09/565,554
• Time in Patent Office: 1,110 Days
• Field of Search: 228/1.1, 228/110.1, 228/180.22, 228/215, 156/73.1
• US Class Current: 228/110.1
• CPC Class Codes: B23K 1/0016 Brazing of electronic components
• CPC Class Codes: B23K 1/06 making use of vibrations, e.g. supersonic vibrations
• CPC Class Codes: B23K 20/10 making use of vibrations, e.g. ultrasonic welding
• CPC Class Codes: B23K 2101/40 Semiconductor devices
• CPC Class Codes: G11B 5/3103 Structure or manufacture of integrated heads or heads mechanically assembled and electrically connected to a support or housing
• CPC Class Codes: G11B 5/4853 Constructional details of the electrical connection between head and arm
• CPC Class Codes: G11B 5/486 with provision for mounting or arranging electrical conducting means or circuits on or along the arm assembly
• CPC Class Codes: H01L 21/563 Encapsulation of active face of flip-chip device, e.g. underfilling or underencapsulation of flip-chip, encapsulation preform on chip or mounting substrate
• CPC Class Codes: H01L 2224/13144 Gold [Au] as principal constituent
• CPC Class Codes: H01L 2224/13147 Copper [Cu] as principal constituent
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/27013 for holding or confining the layer connector, e.g. solder flow barrier
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/73203 Bump and layer connectors
• CPC Class Codes: H01L 2224/73204 the bump connector being embedded into the layer connector
• CPC Class Codes: H01L 2224/75 Apparatus for connecting with bump connectors or layer connectors
• CPC Class Codes: H01L 2224/75301 Bonding head
• CPC Class Codes: H01L 2224/81801 Soldering or alloying
• CPC Class Codes: H01L 2224/83051 Forming additional members, e.g. dam structures
• CPC Class Codes: H01L 2224/83192 wherein the layer connectors are disposed only on another item or body to be connected to the semiconductor or solid-state body
• CPC Class Codes: H01L 24/29 : of an individual layer connector
• CPC Class Codes: H01L 24/32 : of an individual layer connector
• CPC Class Codes: H01L 24/75 : Apparatus for connecting with bump connectors or layer connectors
• CPC Class Codes: H01L 24/81 : using a bump connector
• CPC Class Codes: H01L 24/83 : using a layer connector
• CPC Class Codes: H01L 2924/00 : Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 : Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01004 : Beryllium [Be]
• CPC Class Codes: H01L 2924/01005 : Boron [B]
• CPC Class Codes: H01L 2924/01006 : Carbon [C]
• CPC Class Codes: H01L 2924/01013 : Aluminum [Al]
• CPC Class Codes: H01L 2924/01015 : Phosphorus [P]
• CPC Class Codes: H01L 2924/01029 : Copper [Cu]
• CPC Class Codes: H01L 2924/01033 : Arsenic [As]
• CPC Class Codes: H01L 2924/01075 : Rhenium [Re]
• CPC Class Codes: H01L 2924/01079 : Gold [Au]
• CPC Class Codes: H01L 2924/01082 : Lead [Pb]
• CPC Class Codes: H01L 2924/01322 : Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
• CPC Class Codes: H01L 2924/014 : Solder alloys
• CPC Class Codes: H01L 2924/14 : Integrated circuits
• CPC Class Codes: H01L 2924/351 : Thermal stress

Abstract

A method of manufacturing a head suspension assembly includes attaching underfill to a portion on which an IC chip with a circuit for a thin-film magnetic head element is to be mounted, disposing the IC chip on the attached underfill, and performing ultrasonic bonding of the IC chip.

Claims

1. A method of manufacturing a head suspension assembly comprising the steps of:

attaching underfill to a mounting portion on which an IC chip with a circuit for a thin-film magnetic head element is to be mounted;

disposing said IC chip on the attached underfill; and

performing ultrasonic bonding of said IC chip.

2. The method as claimed in claim 1, wherein said method further includes the step of forming Au or Cu bumps on first connection terminals of said IC chip before said ultrasonic bonding.

3. The method as claimed in claim 2, wherein said forming step of Au or Cu bumps includes forming Au or Cu bumps on said first connection terminals by using Au or Cu balls.

4. The method as claimed in claim 2, wherein said method further includes the step of forming Au or Cu pads as second connection terminals to which said first connection terminals of said IC chip are bonded, before said ultrasonic bonding.

5. The method as claimed in claim 1, wherein said method further includes the step of forming Au or Cu bumps on second connection terminals to which first connection terminals of said IC chip are bonded, before said ultrasonic bonding.

6. The method as claimed in claim 5, wherein said forming step of Au or Cu bumps includes forming Au or Cu bumps on said second connection terminals by using Au or Cu balls.

7. The method as claimed in claim 5, wherein said method further includes the step of forming Au or Cu pads as said first connection terminals of said IC chip before said ultrasonic bonding.

8. The method as claimed in claim 1, wherein said underfill attaching step includes dropping the underfill to a position of said mounting portion on which said IC chip is to be mounted.

9. The method as claimed in claim 8, wherein said dropping of the underfill is executed so that a central part of an attached underfill has a convex form toward an upper part.

10. A method of manufacturing a head suspension assembly which includes a magnetic head slider with at least one thin-film magnetic head element, a support member for supporting said magnetic head slider, an IC chip with a circuit for said at least one thin-film magnetic head element, a lead conductor member on which said IC chip is bonded, and underfill filled in a clearance between a bottom face of said IC chip and said lead conductor member, said method comprising the steps of:

attaching underfill to a mounting position of said lead conductor member, at which position said IC chip is mounted; and

thereafter, performing ultrasonic bonding of said IC chip with said lead conductor member.

11. The method as claimed in claim 10, wherein said lead conductor member has a first portion formed on said support member and a second portion elongated out of said support member, and wherein said mounting position is located within said first portion of said lead conductor member.

12. The method as claimed in claim 10, wherein said lead conductor member has a first portion formed on said support member and a second portion elongated out of said support member, and wherein said mounting position is located within said second portion of said lead conductor member.

13. The method as claimed in claim 10, wherein said method further includes the step of forming Au or Cu bumps on first connection terminals of said IC chip before said ultrasonic bonding.

14. The method as claimed in claim 13, wherein said forming step of Au or Cu bumps includes forming Au or Cu bumps on said first connection terminals by using Au or Cu balls.

15. The method as claimed in claim 13, wherein said method further includes the step of forming Au or Cu pads as second connection terminals to which said first connection terminals of said IC chip are bonded, before said ultrasonic bonding.

16. The method as claimed in claim 10, wherein said method further includes the step of forming Au or Cu bumps on second connection terminals to which first connection terminals of said IC chip are bonded, before said ultrasonic bonding.

17. The method as claimed in claim 16, wherein said forming step of Au or Cu bumps includes forming Au or Cu bumps on said second connection terminals by using Au or Cu balls.

18. The method as claimed in claim 16, wherein said method further includes the step of forming Au or Cu pads as said first connection terminals of said IC chip before said ultrasonic bonding.

19. The method as claimed in claim 10, wherein said underfill attaching step includes dropping the underfill to said mounting position of said lead conductor member.

20. The method as claimed in claim 19, wherein said dropping of the underfill is executed so that a central part of the attached underfill has a convex form toward an upper part.