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Electronic equipment and television game machine having heat radiation structure

  • US 6,565,444 B2
  • Filed: 01/26/2001
  • Issued: 05/20/2003
  • Est. Priority Date: 01/28/2000
  • Status: Expired due to Term
First Claim
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1. An electronic equipment including an electronic game machine, comprising:

  • at least one semiconductor device for causing the game machine of the electronic equipment to effect a desired operation, wherein hear generating occurs during the operation;

    a printed board on which said semiconductor device is mounted;

    a housing having a space for accommodating said printed board and forming an air exit in a first side surface of the housing and an air intake in a second side surface of the housing at a position distant from and corresponding to said air exit, to have an air flow passage allowing air to flow on a line linearly between said air exit and said air intake;

    a hear-radiating member having a first open end portion and a second open end portion, the hear-radiating member arranged on said air flow passage in a manner so that said first open end portion is close to the air exit and the second open end portion is close to the air intake, the heat-radiating member being electrically insulated from said semiconductor device and capable of transferring heat generated from said semiconductor device, and forming a plurality of heat-radiating fins and linear grooves along said air flow passage, said fins and grooves extending between the first and second open end portions of the heat-radiating member, wherein a width of the air exit is smaller than a width in a depth direction of the first side surface of the housing, a width of the air intake is smaller than a width in a depth direction of the second side surface of the housing;

    a fan arranged between at least one of said air intake and said air exit and one end of said heat-radiating member to cause air taken through said air intake to flow along the grooves of said heat-radiating member and forcibly release heat generated from said semiconductor device through said air exit; and

    wherein said printed board and said heat radiating member are located within a case (51a, 51b) located in said housing, and wherein an optical information reading unit and an optical disc are mounted above an upper surface of said case.

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