Curing method to cure epoxy resins in a short time, and a method for absorbing electromagnetic wave through cured epoxy resins obtained by said curing method

• US 6,566,414 B2
• Filed: 07/06/2001
• Issued: 05/20/2003
• Est. Priority Date: 07/11/2000
• Status: Expired due to Fees

• Current Assignee: Nippon Steel Chemical Company Limited (Nippon Steel Corporation)
• Original Assignee: Nippon Liner Co., Ltd. (Sekisui Jushi Corporation), Tohto Resin Products Co., Ltd.
• Inventors: Shimizu, Takashi, Takeshima, Hideo, Yoshino, Takao, Nakanishi, Hiroshi, Matsuura, Makoto
• Primary Examiner(s): Seidleck; James J.
• Assistant Examiner(s): McClendon; Sanza L.
• Application Number:
  US09/899,126
• Publication Number:
  US 20020024170A1
• Time in Patent Office: 683 Days
• Field of Search: 522/100,170,176,74,81,83 204/157.15,157.43 264/489 523/30 526/88,89,90,266
• US Class Current: 522/100
• CPC Class Codes: B29C 2035/0855 using microwave
• CPC Class Codes: B29C 35/08 by wave energy or particle radiation B29C64/00, B29C71/04 take precedence
• CPC Class Codes: B29K 2063/00 Use of EP, i.e. epoxy resins or derivatives thereof, as moulding material
• CPC Class Codes: B29K 2105/0047 Agents changing thermal characteristics
• CPC Class Codes: B29K 2105/16 Fillers
• CPC Class Codes: C08J 2363/00 Characterised by the use of epoxy resins; Derivatives of epoxy resins
• CPC Class Codes: C08J 3/247 Heating methods

Abstract

The present invention is a short time curing method of epoxy resin compositions composed of epoxy resins with more than 1.8 epoxy groups and curing agents which can react with epoxy groups and cure the epoxy resins at ambient temperatures or under the temperature raising conditions radiating microwave in the range of 300 MH_z to 30 GH_z frequency.

Claims

1. A short time curing method for epoxy resin compositions comprising epoxy resins with more than 1.8 epoxy groups and a ferrite as an exothermic accelerator and a curing agent, the method comprising exposing said epoxy resin compositions at ambient temperature to direct microwave radiation in a frequency range of from 1 GHz to 10 GHz.

2. The short time curing method of claim 1, wherein the epoxy resin composition is a non-solvent, one liquid resin composition.

3. The short time curing method of claim 1, wherein the epoxy resin composition is a powder resin composition.

4. The short time curing method of claim 1 further comprising blending 0.1 to 98 weight % of said ferrite as an exothermic accelerator with said epoxy resin composition prior to exposure to said microwave radiation.

5. The short time curing method of claim 4, wherein the epoxy resin composition is a non-solvent, one liquid resin composition.

6. The short time curing method of claim 4, wherein the epoxy resin composition is a powder resin composition.

7. The short time curing method of claim 1 comprising applying said epoxy composition to a substrate and exposing said epoxy resin composition to direct microwave radiation whereby said epoxy resin is cured and unified to said substrate.

8. The short time curing method of claim 7, further comprising blending 0.1 to 98 wt % of said ferrite as an exothermic accelerator with said epoxy resin prior to application to said substrate.

9. A method for absorbing micro magnetic wave energy comprising interposing an epoxy resin product produced according to the method of claim 1 into the path of said energy.

10. The method of claim 9, wherein said epoxy resin produce comprises an epoxy resin with more than 1.8 epoxy groups, a curing agent and an exothermic accelerator.

11. The method of claim 10, wherein said exothermic accelerator is a ferrite.

12. The method of claim 11 wherein said epoxy resin product is produced as a coating on a substrate.

13. A short time curing method for epoxy resin compositions comprising epoxy resins with more than 1.8 epoxy groups and a curing agent, the method comprising exposing said epoxy resin compositions at ambient temperature to direct microwave radiation in a frequency range of from 300 MHz to 30 GHz, wherein the epoxy resin composition is a powder resin composition.

14. A short time curing method for epoxy resin compositions comprising epoxy resins with more than 1.8 epoxy groups and a curing agent, the method comprising exposing said epoxy resin compositions at ambient temperature to direct microwave radiation in a frequency range of from 300 MHz to 30 GHz, blending 0.1 to 98 weight % of an exothermic accelerator with said epoxy resin composition prior to exposure to said microwave radiation, wherein the epoxy resin composition is a powder resin composition.