Structure for mounting components

• US 6,566,742 B1
• Filed: 11/28/2000
• Issued: 05/20/2003
• Est. Priority Date: 12/27/1993
• Status: Expired due to Fees

• Current Assignee: Hitachi, Ltd.
• Original Assignee: Hitachi, Ltd.
• Inventors: Miki, Masayuki, Suzuki, Seikou, Matsumoto, Masahiro
• Primary Examiner(s): Clark, Jasmine J B
• Application Number:
  US09/722,530
• Time in Patent Office: 903 Days
• Field of Search: 257/678, 257/723, 257/704, 257/684, 257/729, 257/703, 257/705, 257/699, 257/573, 257/602, 257/31.106, 257/31.119
• US Class Current: 257/678
• CPC Class Codes: G01P 15/125 by capacitive pick-up
• CPC Class Codes: G01P 15/18 in two or more dimensions
• CPC Class Codes: G01P 2015/0828 the mass being of the paddle type being suspended at one of its longitudinal ends
• CPC Class Codes: H01L 2224/45144 Gold (Au) as principal constituent
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48137 the bodies being arranged next to each other, e.g. on a common substrate
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details

Abstract

An acceleration sensor is disclosed which includes a capacitance-type acceleration detection element mounted on a ceramic base plate. The element comprises a movable electrode mounted between a pair of fixed electrodes. Acceleration of the sensor in a measurement direction causes the movable electrode to move relative to the fixed electrodes and the element has opposite ends in a direction perpendicular to the measurement direction. The acceleration detection element is mounted on the base at a first one of the opposite ends. Accordingly, the mounting surface of the acceleration sensor is parallel to the direction of acceleration to be detected. Thus the acceleration sensor can be surface-mounted on a printed board, and more be easily mounted in an automobile air bag control system or the like.

Claims

1. A structure for mounting electronic components comprising:

a housing including a ceramic substrate;

conductor patterns formed on the housing; and

electronic components including an acceleration detector which is bonded on the inside of the housing and is connected to the conductor patterns, wherein;

the housing is composed of a ceramic substrate and a ceramic cover.

2. A structure for mounting a housing containing electronic components therein comprising:

a housing;

conductor patterns formed on the housing;

a gold connection on a surface of the conductor patterns; and

a base board for mounting the housing thereon, the housing being soldered on the base board and electrically connected thereto at portions where the conductor patterns are formed.

3. A structure for mounting a housing containing electronic components therein according to claim 2, wherein said gold connection is a gold film having a thickness of more than 0.07 μ

m.

4. A structure for mounting a housing containing electronic components therein according to claim 3, wherein the conductor patterns further include a base film of silver or a silver alloy on the housing, the gold film being formed on the base film.

5. A structure for mounting a housing containing electronic components therein according to claim 3, wherein the electronic components comprise an acceleration detector and an electronic circuit generating an electrical signal in accordance with the acceleration detected by said acceleration detector, wherein said electronic circuit is electrically connected to said conductor patterns and is placed in conduction with said base board through said conductor patterns.

6. A structure for mounting a housing containing electronic components therein according to claim 5, wherein a processing circuit is provided on said base board to process said electrical signal and said processing circuit is electrically connected to said electronic circuit through said conductor patterns.

7. A structure for mounting a housing containing electronic components therein according to claim 6, wherein said acceleration detector comprises a weight and a beam supporting said weight formed on a silicon plate.

8. A structure for mounting a housing containing electronic components therein according to claim 7, wherein said housing is soldered on said base board so that said silicon plate is substantially perpendicular to said base board.

9. A structure for mounting a housing containing electronic components according to claim 5, wherein said housing is composed of ceramic and said acceleration detector and said electronic circuit are hermetically sealed internally of said housing.

10. A structure for mounting a housing containing electronic components according to claim 5, wherein said housing is composed of a ceramic substrate and a ceramic cover.