Electronics package with specific areas having low coefficient of thermal expansion

• US 6,566,743 B1
• Filed: 02/21/2002
• Issued: 05/20/2003
• Est. Priority Date: 02/21/2002
• Status: Expired due to Term

• Current Assignee: Thermal Corporation (Roper Technologies, Inc.)
• Original Assignee: Thermal Corporation (Roper Technologies, Inc.)
• Inventors: Zuo, Jon
• Primary Examiner(s): Nelms, David
• Assistant Examiner(s): TRAN, LONG K
• Application Number:
  US10/081,470
• Time in Patent Office: 453 Days
• Field of Search: 257/81, 257/99, 257/177-181, 257/584, 257/625, 257/675, 257/688, 257/705-707, 257/712-722, 257/796, 438/22, 438/24, 438/122-127, 438/117, 361/700
• US Class Current: 257/678
• CPC Class Codes: H01L 2224/16 of an individual bump connector
• CPC Class Codes: H01L 2224/73253 Bump and layer connectors
• CPC Class Codes: H01L 23/3735 Laminates or multilayers, e.g. direct bond copper ceramic substrates
• CPC Class Codes: H01L 23/427 Cooling by change of state, e.g. use of heat pipes by liquefied gas H01L23/445
• CPC Class Codes: H01L 2924/16152 Cap comprising a cavity for hosting the device, e.g. U-shaped cap

Abstract

A semiconductor package including at least one semiconductor chip disposed within a housing, the housing including a lid which overlies the at least one semiconductor chip and a heat-dissipating device coupled to the housing, the heat-dissipating device including at least one area formed of a material with a low coefficient of thermal expansion.

Claims

1. A semiconductor package comprising:

at least one semiconductor chip disposed within a housing, said housing including a lid which overlies the at least one semiconductor chip; and

,

a heat-dissipating device coupled to the housing, said heat-dissipating device including at least one plate formed of a material with a coefficient of thermal expansion that is intermediate of the coefficients of thermal expansion of said at least one semiconductor chip and a remainder of said housing.

2. The semiconductor package of claim 1, wherein the heat-dissipating device comprises a heat pipe.

3. The semiconductor package of claim 1, further comprising:

a substrate, said at least one semiconductor chip being bonded to the substrate.

4. The semiconductor package of claim 3, wherein the at least one semiconductor chip is disposed between the substrate and the lid.

5. The semiconductor package of claim 1, wherein the at least one plate of the heat-dissipating device formed of a material having a coefficient of thermal expansion that is intermediate of the coefficients of thermal expansion of said at least one semiconductor chip and a remainder of said housing is disposed proximate to the at least one semiconductor chip.

6. The semiconductor package of claim 1, wherein the at least one area comprises at least two areas separated by a specified distance.

7. The semiconductor package of claim 1, wherein said at least one plate is disposed on a surface of the heat-dissipating apparatus.

8. The semiconductor package of claim 1, wherein the at least one plate is located within an area including a channel formed in the heat-dissipating apparatus.

9. A computer comprising:

at least one semiconductor package including at least one semiconductor chip positioned within a housing, said housing including a lid which overlies the at least one semiconductor chip and, a heat-dissipating device coupled to the housing, said heat dissipating device including at least one plate formed from a material having coefficient of thermal expansion that is Intermediate of the coefficients of thermal expansion of said at least one semiconductor chip and a remainder of said housing.