Piezoelectric/electrostrictive device and method of manufacturing same

• US 6,566,789 B2
• Filed: 08/21/2002
• Issued: 05/20/2003
• Est. Priority Date: 10/01/1999
• Status: Expired due to Fees

• Current Assignee: NGK Insulators Limited
• Original Assignee: NGK Insulators Limited
• Inventors: Kimura, Koji, Takeuchi, Yukihisa, Ikeda, Koji, Nanataki, Tsutomu, Shibata, Kazuyoshi
• Primary Examiner(s): Feild, Lynn D.
• Assistant Examiner(s): Zarroli, Michael C.
• Application Number:
  US10/225,061
• Publication Number:
  US 20030001455A1
• Time in Patent Office: 272 Days
• Field of Search: 310/321, 310/328, 29/253.5
• US Class Current: 310/321
• CPC Class Codes: H10N 30/05 Manufacture of multilayered piezoelectric or electrostrictive devices, or parts thereof, e.g. by stacking piezoelectric bodies and electrodes
• CPC Class Codes: H10N 30/204 using bending displacement, e.g. unimorph, bimorph or multimorph cantilever or membrane benders
• CPC Class Codes: H10N 30/2043 connected at their free ends, e.g. parallelogram type
• CPC Class Codes: Y10T 29/42 Piezoelectric device making

Abstract

A piezoelectric/electrostrictive device comprises a pair of mutually opposing thin plate sections, a movable section, and a fixation section for supporting the thin plate sections and the movable section. A piezoelectric/electrostrictive element is arranged on at least one thin plate section of the pair of thin plate sections. A hole is formed by the inner walls of the pair of thin plate sections, the movable section and the fixation section. A central portion of the movable section is cut off to form mutually opposing end surfaces in the movable section.

Claims

1. A method for producing a piezoelectric/electrostrictive device comprising:

a pair of mutually opposing thin plate sections, a movable section, and a fixation section for supporting said thin plate sections and said movable section;

one or more piezoelectric/electrostrictive elements arranged on at least one thin plate section of said pair of thin plate sections; and

a hole formed by both inner walls of said pair of thin plate sections, an inner wall of said movable section, and an inner wall of said fixation section, said method comprising;

a step of forming said movable section or said fixation section having mutually opposing end surfaces by cutting off a predetermined part of any one of a portion to be formed into said movable section or a portion to be formed into said fixation section after producing at least said piezoelectric/electrostrictive element.

2. The method for producing said piezoelectric/electrostrictive device according to claim 1, further comprising a step of allowing a member different from a constitutive member of said movable section and said fixation section to intervene between said mutually opposing end surfaces.

3. The method for producing said piezoelectric/electrostrictive device according claim 2, wherein organic resin is used as said member.

4. A method for producing a piezoelectric/electrostrictive device comprising:

a pair of mutually opposing thin plate sections, a movable section, and a fixation section for supporting said thin plate sections and said movable section;

one or more piezoelectric/electrostrictive elements arranged on at least one thin plate section of said pair of thin plate sections; and

a hole formed by both inner walls of said pair of thin plate sections, an inner wall of said movable section, and an inner wall of said fixation section;

said method comprising;

a step of producing a ceramic stack by integrally sintering a ceramic green stack including at least a ceramic green sheet having a window for forming at least said hole thereafter and ceramic green sheets to be formed into said thin plate sections thereafter to produce said ceramic stack;

a step of forming said piezoelectric/electrostrictive element on an outer surface of a portion of said ceramic stack to be formed into said thin plate section; and

a cutoff step of forming said movable section or said fixation section having at least mutually opposing end surfaces by means of at least one time of cutoff treatment for said ceramic stack formed with said piezoelectric/electrostrictive element.

5. The method for producing said piezoelectric/electrostrictive device according to claim 4, wherein:

in said step of producing said ceramic stack, said ceramic stack is produced by integrally sintering a ceramic green stack including a ceramic green sheet having a window for forming said movable section or said fixation section having at least said mutually opposing end surfaces, and said ceramic green sheets to be formed into said thin plate sections thereafter to produce said ceramic stack; and

in said cutoff step, said movable section or said fixation section having at least said mutually opposing end surfaces is formed by means of said cutoff treatment for said ceramic stack formed with said piezoelectric/electrostrictive element.

6. The method for producing said piezoelectric/electrostrictive device according to claim 4, wherein:

in said step of producing said ceramic stack, said ceramic stack is produced by integrally sintering a ceramic green stack including a ceramic green sheet having a window for forming a portion to be formed into said movable section or a portion to be formed into said fixation section having at least said mutually opposing end surfaces partially connected to one another, and said ceramic green sheets to be formed into said thin plate sections thereafter to produce said ceramic stack; and

in said cutoff step, said portion to be formed into said movable section or said portion to be formed into said fixation section having at least said mutually opposing end surfaces partially connected to one another is formed by means of said cutoff treatment for said ceramic stack formed with said piezoelectric/electrostrictive element, and said movable section or said fixation section having said mutually opposing end surfaces is formed by cutting off said connecting portion.

7. The method for producing said piezoelectric/electrostrictive device according to claim 4, wherein in said cutoff step, said hole is exposed by means of said cutoff treatment for said ceramic stack.