Method of manufacturing card-type storage device and card-type storage device

• US 6,567,291 B2
• Filed: 06/24/2002
• Issued: 05/20/2003
• Est. Priority Date: 09/16/1999
• Status: Expired due to Fees

• Current Assignee: Kabushiki Kaisha Toshiba (Toshiba Corporation), Toshiba Corporation
• Original Assignee: Kabushiki Kaisha Toshiba (Toshiba Corporation)
• Inventors: Iwasaki, Hiroshi, Suzuki, Osami
• Primary Examiner(s): Nguyen, Viet Q.
• Application Number:
  US10/177,020
• Publication Number:
  US 20020154530A1
• Time in Patent Office: 330 Days
• Field of Search: 365/63, 257/725, 257/726, 361/728, 361/731
• US Class Current: 365/63
• CPC Class Codes: G06K 19/077 Constructional details, e.g. mounting of circuits in the carrier
• CPC Class Codes: G06K 19/07745 Mounting details of integrated circuit chips
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: Y10T 29/49126 Assembling bases
• CPC Class Codes: Y10T 29/4913 Assembling to base an electrical component, e.g., capacitor, etc.
• CPC Class Codes: Y10T 29/49155 Manufacturing circuit on or in base
• CPC Class Codes: Y10T 29/49172 by molding of insulating material
• CPC Class Codes: Y10T 29/49176 with molding of electrically insulating material

Abstract

A method of manufacturing a small, thin card-type storage device is capable of easily manufacturing a frame for the storage device from a variety of resin materials without molding a very thin recessed bottom of the supporter. The method prepares a card-type support frame member from resin and a sheet material, cuts the sheet material into the size of the support frame member, to form a support sheet, bonds the support sheet to a bottom surface of the support frame member, to form a frame, and fits a memory module to be fixed in an opening of the support frame member in the frame, thereby completing the card-type storage device.

Claims

1. A card-type storage device, comprising:

a card-type support frame member including a first recess and a circular shaped second recess, each being on a surface of the support frame member; and

a non-volatile semiconductor memory module placed in the first recess so as to fill the first recess and to expose a plurality of electrically isolated conductive areas thereof, wherein a material of the card-type support frame member is transparent or translucent resin.

2. The card-type storage device according to claim 1, wherein said conductive areas are isolated from each other by waveform pattern.

3. The card-type storage device according to claim 1, wherein said resin contains polycarbonate.

4. The card-type storage device according to claim 1, wherein an exposed surface of said non-volatile semiconductor memory module and the surface of said card-type support frame member are formed as flat.

5. The card-type storage device according to claim 1, wherein said first recess is formed as smooth-mannered rectangular shape.

6. The card-type storage device according to claim 1, wherein a write-protect seal which prohibits to write data into the memory is to be affixed to the circular shaped second recess.

7. The card-type storage device according to claim 6, wherein a surface of said write-protect seal is conductive.

8. A card-type storage device, comprising:

a card-type support frame member including a recess and a circular shaped area, each being on a surface of the support frame member; and

a non-volatile semiconductor memory module placed in the first recess so as to fill the recess and to expose a plurality of electrically isolated conductive areas thereof, wherein a material of the card-type support frame member is transparent or translucent resin.

9. The card-type storage device according to claim 8, wherein said conductive areas are isolated from each other by waveform pattern.

10. The card-type storage device according to claim 8, wherein said resin contains polycarbonate.

11. The card-type storage device according to claim 8, wherein an exposed surface of said non-volatile semiconductor memory module and the surface of said card-type support frame member are formed as flat.

12. The card-type storage device according to claim 8, wherein said recess is formed as smooth-mannered rectangular shape.

13. The card-type storage device according to claim 8, wherein a write-protect seal which prohibits to write data into the memory is to be affixed to the circular shaped area.

14. The card-type storage device according to claim 13, wherein a surface of said write-protect seal is conductive.