Multi depth substrate fabrication processes

• US 6,569,607 B2
• Filed: 05/01/2001
• Issued: 05/27/2003
• Est. Priority Date: 05/03/2000
• Status: Expired due to Term

• Current Assignee: Caliper Technologies Corp (Revvity, Inc.)
• Original Assignee: Caliper Technologies Corp (Revvity, Inc.)
• Inventors: McReynolds, Richard J.
• Primary Examiner(s): Huff, Mark F.
• Assistant Examiner(s): Sagar, Kripa
• Application Number:
  US09/846,679
• Publication Number:
  US 20020004182A1
• Time in Patent Office: 756 Days
• Field of Search: 430/312, 430/316, 430/322, 430/323, 430/394, 216/80, 216/97, 438/723
• US Class Current: 430/322
• CPC Class Codes: B81C 1/00428 Etch mask forming processes not provided for in groups B81C1/00396 - B81C1/0042
• CPC Class Codes: G03F 7/2024 of the already developed image
• CPC Class Codes: G03F 7/40 Treatment after imagewise removal, e.g. baking

Abstract

Method of fabricating microstructures on a substrate. The method comprises providing a substrate layer having a first surface with a resist layer. First selected regions of the resist layer are exposed to an environment that renders the resist layer more or less soluble in a developer solution. The resist layer is then developed in the developer solution to expose selected regions of the substrate surface. Second selected regions of the resist layer are then exposed to an environment that renders the resist layer more or less soluble in the developer solution by aligning exposure of the second selected regions to the first selected regions. The first selected regions of the substrate surface are etched. Second selected regions of the resist layer are then developed to expose the second selected regions of the substrate surface.

Claims

1. A method of fabricating microstructures on a substrate, comprising the following steps in the order named:

a) providing a substrate having a first surface and a first resist layer disposed thereon;

b) exposing first selected regions of the first resist layer to an environment that renders the first resist layer more soluble in a developer solution;

c) developing the first resist layer in the developer solution to expose first selected regions of the first surface;

d) exposing second selected regions of the resist layer to an environment that renders the resist layer more soluble in the developer solution;

e) etching the first selected regions of the first surface;

f) developing the first resist layer to expose second selected regions of the first surface; and

g) etching the first and second selected regions of the first surface.

2. The method of claim 1, wherein steps e) and g) provide etches of differing depths.

3. The method of claim 1, wherein at least a portion of the second selected regions overlaps with at least a portion of the first selected regions.

4. The method of claim 1, wherein the etches of steps e) and g) provide etches of substantially equal depths.

5. The method of claim 4, wherein at least a portion of the second selected regions overlap with at least a portion of the first selected regions, resulting in a deeper etch in an overlapping portion of the first and second selected regions than in a non-overlapping region of the first and second selected regions.

6. The method of claim 1, wherein at least a portion of the essentially of glass.

7. The method of claim 1, wherein the substrate consists essentially of quartz.

8. The method of claim 1, wherein the etched first and second selected regions comprise channel patterns, each channel in a channel pattern comprising a width of less than 1000 μ

m.

9. The method of claim 1, wherein the etching step of step e) is carried out for a longer period of time than an etching step of step g).

10. The method of claim 9, wherein the etching of step e) produces a first groove or series of grooves in the first surface of the substrate, and the etching in step g) produces a second groove or series of grooves in the surface of the substrate, a portion of the groove(s) in the second series of grooves overlapping with the first series of grooves, the second series of grooves comprising a different depth from the first set of grooves produced in step e).

11. The method of claim 1, wherein the first resist layer comprises a first photoresist layer, and exposing steps b) and d) comprise exposing the first and second selected regions, respectively, to light at an appropriate wavelength to render the resist more soluble.

12. The method of claim 11, wherein the first photoresist layer comprises a positive photoresist.

13. The method of claim 1, wherein exposing step d) comprises aligning the second selected region with the first selected region.

14. The method of claim 1, further comprising the step of baking the resist layer after step d) but before step e).