Method for fabricating an isolated microelectromechanical system device
First Claim
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1. A method for fabricating a MEMS device, comprising the steps of:
- (a) providing a substrate having an upper surface;
(b) depositing a sacrificial layer onto the upper surface of the substrate, wherein the sacrificial layer has an upper surface;
(c) depositing a nonconductive layer onto the upper surface of the sacrificial layer;
(d) depositing a mold onto the substrate, wherein the mold has at least one void aligned with the nonconductive layer;
(e) depositing conductive material into the at least one void to form conductive elements extending from the nonconductive layer;
(f) removing the mold; and
(g) removing the sacrificial layer to release a movable element including the nonconductive layer and conductive material from the substrate.
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Abstract
A method is presented for fabricating an electrically isolated MEMS device having a conductive outer MEMS element, and an inner movable MEMS element spaced apart from the conductive outer MEMS element. The inner element includes a nonconductive base having a plurality of conductive structures extending therefrom. The conductive components are formed by plating a conductive material into a pre-formed mold which defines the shape of the conductor.
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Citations
11 Claims
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1. A method for fabricating a MEMS device, comprising the steps of:
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(a) providing a substrate having an upper surface;
(b) depositing a sacrificial layer onto the upper surface of the substrate, wherein the sacrificial layer has an upper surface;
(c) depositing a nonconductive layer onto the upper surface of the sacrificial layer;
(d) depositing a mold onto the substrate, wherein the mold has at least one void aligned with the nonconductive layer;
(e) depositing conductive material into the at least one void to form conductive elements extending from the nonconductive layer;
(f) removing the mold; and
(g) removing the sacrificial layer to release a movable element including the nonconductive layer and conductive material from the substrate. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11)
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Specification