Collar positionable about a periphery of a contact pad and around a conductive structure secured to the contact pads, semiconductor device components including same, and methods for fabricating same

• US 6,569,753 B1
• Filed: 06/08/2000
• Issued: 05/27/2003
• Est. Priority Date: 06/08/2000
• Status: Expired due to Term

• Current Assignee: Micron Technology, Inc.
• Original Assignee: Micron Technology, Inc.
• Inventors: Akram, Salman, Ahmad, Syed Sajid
• Primary Examiner(s): Booth, Richard
• Assistant Examiner(s): LINDSAY JR, WALTER LEE
• Application Number:
  US09/590,418
• Time in Patent Office: 1,083 Days
• Field of Search: 438/106, 438/118, 438/17, 438/612, 438/613, 438/614
• US Class Current: 438/612
• CPC Class Codes: B33Y 10/00 Processes of additive manufacturing
• CPC Class Codes: B33Y 80/00 Products made by additive manufacturing
• CPC Class Codes: H01L 21/44 Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/38 - H01L21/428
• CPC Class Codes: H01L 2224/0401 Bonding areas specifically adapted for bump connectors, e.g. under bump metallisation [UBM]
• CPC Class Codes: H01L 2224/05552 in top view
• CPC Class Codes: H01L 2224/05572 the external layer extending out of an opening
• CPC Class Codes: H01L 2224/06131 being uniform, i.e. having a uniform pitch across the array
• CPC Class Codes: H01L 2224/0615 Mirror array, i.e. array having only a reflection symmetry, i.e. bilateral symmetry
• CPC Class Codes: H01L 2224/10126 Bump collar
• CPC Class Codes: H01L 2224/1148 Permanent masks, i.e. masks left in the finished device, e.g. passivation layers
• CPC Class Codes: H01L 2224/1191 Forming a passivation layer after forming the bump connector
• CPC Class Codes: H01L 2224/13023 the whole bump connector protruding from the surface
• CPC Class Codes: H01L 2224/13099 Material
• CPC Class Codes: H01L 2224/1319 with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
• CPC Class Codes: H01L 2224/16 of an individual bump connector
• CPC Class Codes: H01L 2224/75 Apparatus for connecting with bump connectors or layer connectors
• CPC Class Codes: H01L 2224/81136 involving guiding structures, e.g. spacers or supporting members
• CPC Class Codes: H01L 2224/81801 Soldering or alloying
• CPC Class Codes: H01L 24/11 Manufacturing methods for bumps on insulating substrates H01L21/4853
• CPC Class Codes: H01L 24/12 Structure, shape, material or disposition of the bump connectors prior to the connecting process
• CPC Class Codes: H01L 24/16 : of an individual bump connector
• CPC Class Codes: H01L 24/742 : Apparatus for manufacturing bump connectors
• CPC Class Codes: H01L 24/75 : Apparatus for connecting with bump connectors or layer connectors
• CPC Class Codes: H01L 24/81 : using a bump connector
• CPC Class Codes: H01L 2924/00 : Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/0002 : Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 2924/01005 : Boron [B]
• CPC Class Codes: H01L 2924/01006 : Carbon [C]
• CPC Class Codes: H01L 2924/01029 : Copper [Cu]
• CPC Class Codes: H01L 2924/01033 : Arsenic [As]
• CPC Class Codes: H01L 2924/01039 : Yttrium [Y]
• CPC Class Codes: H01L 2924/01047 : Silver [Ag]
• CPC Class Codes: H01L 2924/0105 : Tin [Sn]
• CPC Class Codes: H01L 2924/01079 : Gold [Au]
• CPC Class Codes: H01L 2924/01082 : Lead [Pb]
• CPC Class Codes: H01L 2924/014 : Solder alloys
• CPC Class Codes: H01L 2924/12042 : LASER
• CPC Class Codes: H01L 2924/351 : Thermal stress
• CPC Class Codes: H05K 2201/10977 : Encapsulated connections applying non-metallic protective coatings for encapsulating mounted components H05K3/284
• CPC Class Codes: H05K 3/3436 : having an array of bottom contacts, e.g. pad grid array or ball grid array components
• CPC Class Codes: Y02P 70/50 : Manufacturing or production processes characterised by the final manufactured product
• CPC Class Codes: Y02P 80/30 : Reducing waste in manufacturing processes; Calculations of released waste quantities

Abstract

Dielectric collars to be disposed around contact pads on a surface of a semiconductor device or another substrate and methods of fabricating and disposing the collars on semiconductor devices and other substrates. Semiconductor devices including the collars and having contact pads exposed through the collars are also disclosed. One or more of the collars are disposed around the contact pads of a semiconductor device or other substrate before or after conductive structures are secured to the contact pads. Upon connecting the semiconductor device face-down to a higher level substrate and establishing electrical communication between contact pads of the semiconductor device and contacts pads of the substrate, the collars prevent the material of conductive structures protruding from the semiconductor device from contacting regions of the surface of the semiconductor device that surround the contact pads thereof. The collars may be preformed structures which are attached to a surface of a semiconductor device or other substrate. Alternatively, the collars can be fabricated on the surface of the semiconductor device or other substrate. A stereolithographic method of fabricating the collars is disclosed. The stereolithographic method may include use of a machine vision system including at least one camera operably associated with a computer controlling a stereolithographic application of material so that the system may recognize the position and orientation of a semiconductor device or other substrate on which the collar is to be fabricated.

Claims

1. A method of fabricating a substrate, comprising:

providing at least one substrate having contact pads exposed at a surface thereof; and

disposing at least one collar comprising a plurality of at least partially superimposed, contiguous, mutually adhered layers around at least one contact pad of said contact pads, said at least one collar protruding from said surface so as to laterally contain material of at least a base portion of a conductive structure securable to said at least one contact pad.

2. The method of claim 1, wherein said disposing at least one collar comprises disposing said at least one collar around said at least one contact pad with at least a portion thereof being exposed through said at least one collar.

3. The method of claim 2, wherein said disposing at least one collar comprises disposing at least one collar configured to laterally surround said at least a base portion of said conductive structure to be secured to said at least one contact pad.

4. The method of claim 3, wherein said disposing at least one collar configured to laterally surround said at least a base portion comprises disposing at least one collar configured to laterally surround substantially all of said conductive structure.

5. The method of claim 2, wherein disposing said at least one collar comprises disposing at least one collar configured to contact said at least a base portion of said conductive structure to be secured to said at least one contact pad.

6. The method of claim 2, further comprising disposing said conductive structure in contact with said at least one contact pad through said at least one collar.

7. The method of claim 6, wherein said disposing comprises defining a configuration of at least a portion of at least one conductive structure with said at least one collar.

8. The method of claim 7, wherein said defining said configuration comprises defining a configuration of substantially all of said at least one conductive structure with said at least one collar.

9. The method of claim 6, wherein said disposing comprises placing a liquid quantity of conductive material in an aperture of said at least one collar.

10. The method of claim 1, wherein said disposing at least one collar comprises disposing said at least one collar so as to laterally surround at least a base portion of at least one conductive structure protruding from said at least one contact pad.

11. The method of claim 10, wherein said disposing at least one collar comprises disposing at least one collar configured to laterally surround said at least a base portion of said at least one conductive structure.

12. The method of claim 11, wherein said disposing at least one collar configured to laterally surround said at least a base portion comprises disposing at least one collar configured to laterally surround substantially all of said at least one conductive structure.

13. The method of claim 10, wherein said disposing at least one collar comprises disposing at least one collar configured to contact said at least a base portion of said at least one conductive structure.

14. The method of claim 1, wherein said disposing at least one collar comprises disposing a plurality of collars on said surface.

15. The method of claim 1, wherein said disposing at least one collar comprises fabricating said at least one collar on said surface.

16. The method of claim 15, wherein said fabricating comprises fabricating each layer of said plurality of at least partially superimposed, contiguous, mutually adhered layers of said at least one collar from a photopolymer.

17. The method of claim 1, wherein said providing comprises providing at least one semiconductor die.

18. The method of claim 1, wherein said providing comprises providing at least one semiconductor wafer with a plurality of semiconductor dice.

19. The method of claim 1, wherein said providing comprises providing at least one chip-scale package.

20. The method of claim 1, wherein said providing comprises providing at least one ball grid array package.

21. The method of claim 1, wherein said disposing comprises adhering at least one preformed collar to said surface.

22. The method of claim 1, further comprising, prior to said disposing, fabricating each of said plurality of at least partially superimposed, contiguous, mutually adhered layers of said at least one collar from a photopolymer material.

23. The method of claim 1, further comprising disposing at least one conductive structure in contact with said at least one contact pad.

24. The method of claim 23, wherein said disposing at least one conductive structure comprises forming at least one solder bump on said at least one contact pad.

25. The method of claim 23, wherein said disposing at least one conductive structure comprises applying at least one structure comprising a solder, a metal, a metal alloy, a conductor filled epoxy, or a z-axis elastomer to said at least one contact pad.

26. A method of fabricating a semiconductor device component, comprising:

providing at least one substrate with contact pads exposed at a surface thereof; and

sequentially forming layers of at least one collar on said surface around at least one contact pad of said contact pads, said at least one collar protruding from said surface so as to laterally contain material of at least a portion of a conductive structure securable to said at least one contact pad.

27. The method of claim 26, wherein said sequentially forming comprises forming each of said layers from a photopolymer.

28. The method of claim 26, wherein said providing at least one substrate comprises providing at least one semiconductor die.

29. The method of claim 28, wherein said providing at least one semiconductor die comprises providing at least one wafer including a plurality of semiconductor dice.

30. The method of claim 26, wherein said providing at least one substrate comprises providing at least one chip scale package.

31. The method of claim 26, wherein said providing at least one substrate comprises providing at least one ball grid array package.

32. The method of claim 26, further comprising, following at least a portion of said sequentially forming, securing a conductive structure to said at least one contact pad.

33. A method of fabricating a semiconductor device component, comprising:

placing at least one substrate with contact pads in a horizontal plane;

recognizing a location and orientation of said at least one substrate; and

stereolithographically fabricating at least one collar comprising at least one layer of at least semisolid material on a surface of said at least one substrate, said at least one collar laterally surrounding at least one contact pad of said contact pads, said at least one collar protruding from said surface so as to laterally contain material of at least a portion of a conductive structure securable to said at least one contact pad.

34. The method of claim 33, further comprising storing data including at least one physical parameter of said at least one substrate and of said at least one collar in computer memory and using the stored data in conjunction with a machine vision system to recognize the location and orientation of said at least one substrate.

35. The method of claim 34, further including in computer memory at least one physical parameter of said at least one contact pad around which said at least one collar is to be fabricated.

36. The method of claim 34, further including in computer memory at least one parameter of another substrate component with which each said at least one substrate is to be assembled.

37. The method of claim 34, further comprising using the stored data, in conjunction with said machine vision system, to effect said stereolithographically fabricating at least one layer of said at least one collar.

38. The method of claim 33, further comprising recognizing a location of said at least one contact pad.

39. The method of claim 33, further including securing said at least one substrate to a carrier prior to placing said at least one substrate in said horizontal plane.

40. A method of connecting a semiconductor device to a carrier substrate, comprising:

providing a semiconductor device having contact pads exposed at a surface thereof;

selecting a carrier substrate having contact pads on a surface thereof, said contact pads being located correspondingly to at least selected ones of said contact pads of said semiconductor device;

securing at least one collar to said surface of said semiconductor device around at least one contact pad of said contact pads, said at least one collar including a plurality of at least partially superimposed, contiguous, mutually adhered layers and protruding from said surface so as to contain material of at least a base portion of at least one conductive structure securable to said at least one contact pad;

securing at least one conductive structure to said at least one contact pad; and

disposing said semiconductor device face down on said carrier substrate with said at least one contact pad in communication with a corresponding one of said contact pads of said carrier substrate.

41. The method of claim 40, wherein said disposing said semiconductor device comprises connecting said at least one conductive structure to said corresponding one of said contact pads.

42. The method of claim 40, wherein, during said disposing, said at least one collar prevents said material of said at least one conductive structure from contacting said surface of said semiconductor device.

43. The method of claim 40, wherein said securing comprises securing at least one prefabricated collar to said surface.

44. The method of claim 43, further comprising stereolithographically fabricating said at least one prefabricated collar.

45. The method of claim 43, wherein said securing comprises adhering said at least one prefabricated collar to said surface.

46. The method of claim 40, wherein said securing comprises fabricating said at least one collar on said surface.

47. The method of claim 46, wherein said fabricating comprises stereolithographically fabricating said at least one collar.

48. The method of claim 40, wherein said securing said at least one conductive structure is effected before said securing said at least one collar.

49. The method of claim 40, further comprising securing said at least one conductive structure to said corresponding one of said contact pads of said carrier substrate.

50. The method of claim 49, wherein said securing said at least one conductive structure to said corresponding one of said contact pads comprises heating said at least one conductive structure to a temperature less than a reflow temperature of said material of said at least one conductive structure.

51. A method for fabricating a substrate, comprising:

providing at least one substrate having contact pads exposed at a surface thereof; and

placing at least one preformed collar around at least one contact pad of said contact pads, said at least one preformed collar protruding from said surface so as to laterally contain material of at least a base portion of a conductive structure securable to said at least one contact pad.

52. The method of claim 51, wherein said placing comprises placing at least one preformed collar around said at least one contact pad with at least a portion of said at least one contact pad being exposed through said at least one collar.

53. The method of claim 52, wherein said placing comprises placing at least one preformed collar configured to laterally surround said at least a base portion of said conductive structure to be secured to said at least one contact pad.

54. The method of claim 52, wherein said placing comprises placing at least one preformed collar configured to laterally surround substantially all of said conductive structure.

55. The method of claim 52, wherein said placing comprises placing at least one preformed collar configured to contact said at least a base portion of said conductive structure to be secured to said at least one contact pad.

56. The method of claim 51, wherein said placing comprises placing at least one preformed collar configured to define a configuration of at least a portion of at least one conductive structure.

57. The method of claim 56, wherein said placing comprises placing at least one preformed collar configured to define a configuration of substantially all of said at least one conductive structure.

58. The method of claim 51, wherein said placing comprises placing a plurality of preformed collars on said surface.

59. The method of claim 51, wherein said providing comprises providing at least one semiconductor die.

60. The method of claim 51, wherein said providing comprises providing at least one semiconductor wafer with a plurality of semiconductor dice.

61. The method of claim 51, wherein said providing comprises providing at least one chip-scale package.

62. The method of claim 51, wherein said providing comprises providing at least one ball grid array package.

63. The method of claim 51, wherein said placing comprises placing at least one preformed collar comprising a plurality of at least partially superimposed, contiguous, mutually adhered layers.

64. A method for fabricating a collar positionable around a contact pad of a substrate, comprising:

providing a layer of unconsolidated, electrically insulative material;

at least partially consolidating selected locations of said layer; and

repeating said providing and said at least partially consolidating at least once to form a plurality of at least partially superimposed, contiguous, mutually adhered layers of the collar.

65. The method of claim 64, wherein said providing comprises providing a photopolymer.

66. The method of claim 64, wherein said at least partially consolidating comprises directing a beam of radiation toward said selected locations.

67. The method of claim 64, wherein said repeating comprises repeating said providing and said at least partially consolidating until the collar has a height that will laterally surround at least a base portion of a conductive structure to be secured to the contact pad.

68. The method of claim 64, wherein said repeating comprises repeating said providing and said at least partially consolidating until the collar has a height that will laterally surround substantially all of a conductive structure to be secured to the contact pad.

69. The method of claim 64, wherein said at least partially consolidating comprises forming the collar with an aperture that will define at least a portion of a shape of a conductive structure to be secured to the contact pad.

70. The method of claim 64, further comprising:

further consolidating at least partially consolidated material at said selected locations of said layer.