Cooling structure of communication device

• US 6,570,086 B1
• Filed: 02/05/2002
• Issued: 05/27/2003
• Est. Priority Date: 06/06/2000
• Status: Expired due to Fees

• Current Assignee: Mitsubishi Denki Kabushiki Kaisha (Mitsubishi Electric Corporation)
• Original Assignee: Mitsubishi Denki Kabushiki Kaisha (Mitsubishi Electric Corporation)
• Inventors: Ozaki, Eiichi, Hirao, Koichi, Yoshizawa, Jiro, Ogushi, Tetsurou, Kobayashi, Takashi, Hasegawa, Manabu, Shimoji, Mihoko, Nakao, Kazushige
• Primary Examiner(s): Ngo, Hung V.
• Application Number:
  US10/048,924
• Time in Patent Office: 476 Days
• Field of Search: 174/35.R, 174/35.MS, 361/816, 361/818, 361/719, 257/712, 257/713, 257/707
• US Class Current: 174/377
• CPC Class Codes: H05K 7/20445 the coupling element being an additional piece, e.g. thermal standoff
• CPC Class Codes: H05K 9/0024 Shield cases mounted on a PCB, e.g. cans or caps or conformal shields
• CPC Class Codes: H05K 9/0026 integrally formed from metal sheet

Abstract

A communication device includes a communication circuit mounted on a printed substrate and having a heat generating element; a shield casing covering the communication circuit and shielding electromagnetic waves; a housing accommodating the shield casing and the printed substrate; a heat diffusing member mounted along an inner wall of the shield casing diffusing heat in a planar direction; and a heat insulating layer disposed between the shield casing and an inner wall of the housing.

Claims

1. A communication device comprising:

a communication circuit mounted on a printed substrate and having a heat generating element;

a shield casing covering the communication circuit and shielding electromagnetic waves;

a housing accommodating the printed substrate having the shield casing and the communication circuit mounted on the printed substrate;

a heat diffusing member mounted along an inner wall of the shield casing for diffusing heat in a planar direction; and

a heat insulating layer disposed between the shield casing and an inner wall of the housing.

2. The communication device according to claim 1, further comprising an electrically insulating, thermally conductive member disposed between the heat diffusing member and the heat generating element.

3. The communication device according to claim 1, further comprising a heat equalizing member on an outer wall of the shield casing, excluding a location where a component is located externally of the shield casing, or on the inner wall of the housing, excluding an inner wall portion of the housing confronting the component.

4. The communication device according to claim 1, wherein the housing has a shape including a portion confronting the heat generating element within the shield casing, or a portion confronting a component located externally of the shield casing, protruding outwardly.

5. The communication device according to claim 1, wherein the housing has a shape including a portion confronting the heat generating element within the shield casing, or a portion confronting a component located externally of the shield casing, protruding inwardly.

6. The communication device according to claim 1, further comprising a heat diffusing member for diffusing heat in a planar direction, said heat diffusing member being mounted on the inner wall of the housing or an outer wall of the housing.

7. The communication device according to claim 6, wherein the heat diffusing member has a shape with a portion confronting the heat generating element within the shield casing, or a portion confronting a component located externally of the shield casing, protruding towards the shield casing.