Magnetron negative ion sputter source

• US 6,570,172 B2
• Filed: 05/11/2000
• Issued: 05/27/2003
• Est. Priority Date: 05/12/1999
• Status: Expired due to Fees

• Current Assignee: Plasmion GmbH
• Original Assignee: Plasmion GmbH
• Inventors: Sohn, Minho, Kim, Steven
• Primary Examiner(s): Lee, John R.
• Assistant Examiner(s): Quash, Anthony G.
• Application Number:
  US09/568,665
• Publication Number:
  US 20020070357A1
• Time in Patent Office: 1,111 Days
• Field of Search: 250/493.1, 250/283, 250/423.R, 250/424, 250/426, 250/423.P, 250/423.F, 250/492.21, 250/492.3
• US Class Current: 250/493.1
• CPC Class Codes: C23C 14/3407 Cathode assembly for sputtering apparatus, e.g. Target
• CPC Class Codes: C23C 14/3457 using other particles than noble gas ions C23C14/0036, C23C14/46 take precedence
• CPC Class Codes: C23C 14/35 by application of a magnetic field, e.g. magnetron sputtering C23C14/3457 takes precedence
• CPC Class Codes: H01J 27/04 using reflex discharge, e.g. Penning ion sources electron bombardment ion sources H01J27/08
• CPC Class Codes: H01J 37/3405 Magnetron sputtering

Abstract

A negative ion source is disclosed which includes an electrode, a target having a more negative electrical potential than the electrode, a supply of electrical energy for generating a discharge between the electrode and the target, and at least one magnet positioned so as to confine electrons, generated as a result of said discharge, in close proximity to a first surface of the target. The negative ion source further includes a delivery system for delivering cesium to a second surface of the target, and a distribution chamber interposed between the delivery system and the target for uniformly distributing cesium on the second surface of said target. The cesium diffuses through openings in the target from the first surface to the second surface. The negative ion source may comprise a conventional magnetron sputter source that has been retrofitted to include a cesium distribution system.

Claims

1. A negative ion source, comprising:

an electrode;

a target having a more negative electrical potential than said electrode;

a supply of electrical energy for generating a discharge between said electrode and said target;

at least one magnet positioned so as to generate a magnetic field to confine electrons, generated as a result of said discharge, in close proximity to a first surface of said target; and

a delivery system for delivering cesium to a second surface of said target, said second surface opposing said first surface,

wherein said target further comprises a plurality of circular openings through which said cesium diffuses from said second surface to said first surface through a distribution chamber interposed between said delivery system and said target for uniformly distributing cesium on said second surface of said target.

2. The negative ion source of claim 1 wherein said delivery system has been retrofitted to a conventional magnetron sputter source.

3. The negative ion source of claim 1 wherein said distribution chamber further comprises a heater for bringing said cesium to a uniform temperature allowing said cesium to be uniformly distributed in said distribution chamber.

4. The negative ion source of claim 1 wherein said distribution chamber further comprises a porous insert disposed inside said distribution chamber for causing a uniform distribution of cesium throughout said distribution chamber.

5. The negative ion source of claim 1 wherein said delivery system further comprises:

a supply of cesium detachably coupled to a first port;

a reservoir coupled to said first port, said first port for conveying cesium to said reservoir;

a heater in close proximity to said reservoir for heating cesium in said reservoir;

a second port coupled to said reservoir for allowing said reservoir to be subject to a vacuum; and

a valve for metering a flow of cesium from said reservoir to said distribution chamber.

6. The negative ion source of claim 1 wherein said supply of electrical energy supplies RF energy.

7. The negative ion source of claim 1 wherein said supply of electrical energy supplies direct current.

8. The negative ion source of claim 1 wherein the shape of said distribution chamber, said target, and said magnetic field is non circular.

9. A method of depositing ion on a substrate, comprising the steps:

generating a discharge between an electrode and a target;

confining electrons, generated as a result of said discharge, to a first area in close proximity to a first surface of said target;

delivering cesium to a second surface of said target through a distribution chamber for uniformly distributing cesium on said second surface; and

diffusing said cesium through a plurality of circular openings in said target from said second surface to said first surface.

10. The method of claim 9, wherein said step of delivering further comprises the step of heating said cesium to a uniform temperature allowing said cesium to be uniformly distributed in said distribution chamber.

11. The method of claim 9, wherein said step of delivering cesium through a distribution chamber further comprises a porous insert disposed inside said distribution chamber for causing a uniform distribution of cesium throughout said distribution chamber.